JP2009135184A5 - - Google Patents

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Publication number
JP2009135184A5
JP2009135184A5 JP2007308583A JP2007308583A JP2009135184A5 JP 2009135184 A5 JP2009135184 A5 JP 2009135184A5 JP 2007308583 A JP2007308583 A JP 2007308583A JP 2007308583 A JP2007308583 A JP 2007308583A JP 2009135184 A5 JP2009135184 A5 JP 2009135184A5
Authority
JP
Japan
Prior art keywords
wiring
reinforcing body
wiring board
manufacturing
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007308583A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009135184A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007308583A priority Critical patent/JP2009135184A/ja
Priority claimed from JP2007308583A external-priority patent/JP2009135184A/ja
Priority to TW097144822A priority patent/TW200924595A/zh
Priority to US12/323,648 priority patent/US20090139751A1/en
Priority to EP08170158A priority patent/EP2066157A3/en
Priority to KR1020080118746A priority patent/KR20090056860A/ko
Publication of JP2009135184A publication Critical patent/JP2009135184A/ja
Publication of JP2009135184A5 publication Critical patent/JP2009135184A5/ja
Pending legal-status Critical Current

Links

JP2007308583A 2007-11-29 2007-11-29 配線基板及びその製造方法 Pending JP2009135184A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007308583A JP2009135184A (ja) 2007-11-29 2007-11-29 配線基板及びその製造方法
TW097144822A TW200924595A (en) 2007-11-29 2008-11-20 Wiring substrate and manufacturing method thereof
US12/323,648 US20090139751A1 (en) 2007-11-29 2008-11-26 Wiring substrate and manufacturing method thereof
EP08170158A EP2066157A3 (en) 2007-11-29 2008-11-27 Wiring substrate and manufacturing method thereof
KR1020080118746A KR20090056860A (ko) 2007-11-29 2008-11-27 배선기판 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007308583A JP2009135184A (ja) 2007-11-29 2007-11-29 配線基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2009135184A JP2009135184A (ja) 2009-06-18
JP2009135184A5 true JP2009135184A5 (enExample) 2010-10-07

Family

ID=40410186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007308583A Pending JP2009135184A (ja) 2007-11-29 2007-11-29 配線基板及びその製造方法

Country Status (5)

Country Link
US (1) US20090139751A1 (enExample)
EP (1) EP2066157A3 (enExample)
JP (1) JP2009135184A (enExample)
KR (1) KR20090056860A (enExample)
TW (1) TW200924595A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4473935B1 (ja) * 2009-07-06 2010-06-02 新光電気工業株式会社 多層配線基板
JP5383447B2 (ja) * 2009-11-20 2014-01-08 京セラ株式会社 配線基板およびプローブカードならびに電子装置
KR101088792B1 (ko) * 2009-11-30 2011-12-01 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
JP2013038374A (ja) * 2011-01-20 2013-02-21 Ibiden Co Ltd 配線板及びその製造方法
KR20120124319A (ko) * 2011-05-03 2012-11-13 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
WO2014050995A1 (ja) * 2012-09-26 2014-04-03 日立化成株式会社 多層配線板、及び、多層配線板の製造方法
KR101814843B1 (ko) 2013-02-08 2018-01-04 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
JP2015008214A (ja) * 2013-06-25 2015-01-15 株式会社デンソー 電子装置
WO2015060045A1 (ja) 2013-10-24 2015-04-30 株式会社村田製作所 配線基板およびその製造方法
TWI576025B (zh) * 2014-10-29 2017-03-21 矽品精密工業股份有限公司 基板結構及其製法
CN208657154U (zh) * 2015-03-20 2019-03-26 3M创新有限公司 用于附接发光半导体装置的柔性多层基板
TWI573231B (zh) * 2015-07-17 2017-03-01 矽品精密工業股份有限公司 封裝基板及其製法
KR102059478B1 (ko) * 2017-09-15 2019-12-26 스템코 주식회사 회로 기판 및 그 제조 방법
CN113540029B (zh) 2020-04-16 2024-10-18 奥特斯奥地利科技与系统技术有限公司 部件承载件以及制造和设计部件承载件的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3277347A (en) * 1955-10-12 1966-10-04 Minnesota Mining & Mfg Electric circuit panelboard
JPS5831753B2 (ja) * 1979-02-02 1983-07-08 鐘淵化学工業株式会社 電気用絶縁積層板及び印刷回路用金属箔張り積層板
JP2003136623A (ja) * 2001-08-22 2003-05-14 Tdk Corp モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法
TW200638811A (en) * 2004-09-21 2006-11-01 Ibiden Co Ltd Flexible printed wiring board
JP4072176B2 (ja) * 2005-08-29 2008-04-09 新光電気工業株式会社 多層配線基板の製造方法
JP4452222B2 (ja) * 2005-09-07 2010-04-21 新光電気工業株式会社 多層配線基板及びその製造方法
JP4377867B2 (ja) * 2005-09-30 2009-12-02 日本ピラー工業株式会社 銅張積層板、プリント配線板及び多層プリント配線板並びにこれらの製造方法
IL171378A (en) * 2005-10-11 2010-11-30 Dror Hurwitz Integrated circuit support structures and the fabrication thereof
JP4334005B2 (ja) * 2005-12-07 2009-09-16 新光電気工業株式会社 配線基板の製造方法及び電子部品実装構造体の製造方法
JP2007227561A (ja) * 2006-02-22 2007-09-06 Renesas Technology Corp 半導体装置及びその製造方法
US7737370B2 (en) * 2006-07-31 2010-06-15 Hitachi Cable, Ltd. Electromagnetic shielding filter

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