JP2009135184A - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP2009135184A
JP2009135184A JP2007308583A JP2007308583A JP2009135184A JP 2009135184 A JP2009135184 A JP 2009135184A JP 2007308583 A JP2007308583 A JP 2007308583A JP 2007308583 A JP2007308583 A JP 2007308583A JP 2009135184 A JP2009135184 A JP 2009135184A
Authority
JP
Japan
Prior art keywords
wiring
wiring board
insulating layer
layer
reinforcing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007308583A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009135184A5 (enExample
Inventor
Masahiro Haruhara
昌宏 春原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007308583A priority Critical patent/JP2009135184A/ja
Priority to TW097144822A priority patent/TW200924595A/zh
Priority to US12/323,648 priority patent/US20090139751A1/en
Priority to EP08170158A priority patent/EP2066157A3/en
Priority to KR1020080118746A priority patent/KR20090056860A/ko
Publication of JP2009135184A publication Critical patent/JP2009135184A/ja
Publication of JP2009135184A5 publication Critical patent/JP2009135184A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2007308583A 2007-11-29 2007-11-29 配線基板及びその製造方法 Pending JP2009135184A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007308583A JP2009135184A (ja) 2007-11-29 2007-11-29 配線基板及びその製造方法
TW097144822A TW200924595A (en) 2007-11-29 2008-11-20 Wiring substrate and manufacturing method thereof
US12/323,648 US20090139751A1 (en) 2007-11-29 2008-11-26 Wiring substrate and manufacturing method thereof
EP08170158A EP2066157A3 (en) 2007-11-29 2008-11-27 Wiring substrate and manufacturing method thereof
KR1020080118746A KR20090056860A (ko) 2007-11-29 2008-11-27 배선기판 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007308583A JP2009135184A (ja) 2007-11-29 2007-11-29 配線基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2009135184A true JP2009135184A (ja) 2009-06-18
JP2009135184A5 JP2009135184A5 (enExample) 2010-10-07

Family

ID=40410186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007308583A Pending JP2009135184A (ja) 2007-11-29 2007-11-29 配線基板及びその製造方法

Country Status (5)

Country Link
US (1) US20090139751A1 (enExample)
EP (1) EP2066157A3 (enExample)
JP (1) JP2009135184A (enExample)
KR (1) KR20090056860A (enExample)
TW (1) TW200924595A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108959A (ja) * 2009-11-20 2011-06-02 Kyocera Corp 配線基板およびプローブカードならびに電子装置
JP2015008214A (ja) * 2013-06-25 2015-01-15 株式会社デンソー 電子装置
US9814137B2 (en) 2013-10-24 2017-11-07 Murata Manufacturing Co., Ltd. Wiring board and method of manufacturing same
JP2020533805A (ja) * 2017-09-15 2020-11-19 ステムコ カンパニー リミテッド 回路基板およびその製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4473935B1 (ja) * 2009-07-06 2010-06-02 新光電気工業株式会社 多層配線基板
KR101088792B1 (ko) * 2009-11-30 2011-12-01 엘지이노텍 주식회사 인쇄회로기판 및 그 제조방법
JP2013038374A (ja) * 2011-01-20 2013-02-21 Ibiden Co Ltd 配線板及びその製造方法
KR20120124319A (ko) * 2011-05-03 2012-11-13 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
WO2014050995A1 (ja) * 2012-09-26 2014-04-03 日立化成株式会社 多層配線板、及び、多層配線板の製造方法
KR101814843B1 (ko) 2013-02-08 2018-01-04 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
TWI576025B (zh) * 2014-10-29 2017-03-21 矽品精密工業股份有限公司 基板結構及其製法
CN208657154U (zh) * 2015-03-20 2019-03-26 3M创新有限公司 用于附接发光半导体装置的柔性多层基板
TWI573231B (zh) * 2015-07-17 2017-03-01 矽品精密工業股份有限公司 封裝基板及其製法
CN113540029B (zh) 2020-04-16 2024-10-18 奥特斯奥地利科技与系统技术有限公司 部件承载件以及制造和设计部件承载件的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003136623A (ja) * 2001-08-22 2003-05-14 Tdk Corp モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3277347A (en) * 1955-10-12 1966-10-04 Minnesota Mining & Mfg Electric circuit panelboard
JPS5831753B2 (ja) * 1979-02-02 1983-07-08 鐘淵化学工業株式会社 電気用絶縁積層板及び印刷回路用金属箔張り積層板
TW200638811A (en) * 2004-09-21 2006-11-01 Ibiden Co Ltd Flexible printed wiring board
JP4072176B2 (ja) * 2005-08-29 2008-04-09 新光電気工業株式会社 多層配線基板の製造方法
JP4452222B2 (ja) * 2005-09-07 2010-04-21 新光電気工業株式会社 多層配線基板及びその製造方法
JP4377867B2 (ja) * 2005-09-30 2009-12-02 日本ピラー工業株式会社 銅張積層板、プリント配線板及び多層プリント配線板並びにこれらの製造方法
IL171378A (en) * 2005-10-11 2010-11-30 Dror Hurwitz Integrated circuit support structures and the fabrication thereof
JP4334005B2 (ja) * 2005-12-07 2009-09-16 新光電気工業株式会社 配線基板の製造方法及び電子部品実装構造体の製造方法
JP2007227561A (ja) * 2006-02-22 2007-09-06 Renesas Technology Corp 半導体装置及びその製造方法
US7737370B2 (en) * 2006-07-31 2010-06-15 Hitachi Cable, Ltd. Electromagnetic shielding filter

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003136623A (ja) * 2001-08-22 2003-05-14 Tdk Corp モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011108959A (ja) * 2009-11-20 2011-06-02 Kyocera Corp 配線基板およびプローブカードならびに電子装置
JP2015008214A (ja) * 2013-06-25 2015-01-15 株式会社デンソー 電子装置
US9814137B2 (en) 2013-10-24 2017-11-07 Murata Manufacturing Co., Ltd. Wiring board and method of manufacturing same
JP2020533805A (ja) * 2017-09-15 2020-11-19 ステムコ カンパニー リミテッド 回路基板およびその製造方法
US11147160B2 (en) 2017-09-15 2021-10-12 Stemco Co., Ltd. Circuit board and method for manufacturing same
JP7002643B2 (ja) 2017-09-15 2022-01-20 ステムコ カンパニー リミテッド 回路基板およびその製造方法

Also Published As

Publication number Publication date
EP2066157A2 (en) 2009-06-03
US20090139751A1 (en) 2009-06-04
TW200924595A (en) 2009-06-01
EP2066157A3 (en) 2011-03-09
KR20090056860A (ko) 2009-06-03

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