JP2009147263A5 - - Google Patents

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Publication number
JP2009147263A5
JP2009147263A5 JP2007325747A JP2007325747A JP2009147263A5 JP 2009147263 A5 JP2009147263 A5 JP 2009147263A5 JP 2007325747 A JP2007325747 A JP 2007325747A JP 2007325747 A JP2007325747 A JP 2007325747A JP 2009147263 A5 JP2009147263 A5 JP 2009147263A5
Authority
JP
Japan
Prior art keywords
wiring board
wiring
conductor portion
forming
reinforcing conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007325747A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009147263A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007325747A priority Critical patent/JP2009147263A/ja
Priority claimed from JP2007325747A external-priority patent/JP2009147263A/ja
Priority to US12/335,907 priority patent/US20090166077A1/en
Priority to TW097149133A priority patent/TW200938012A/zh
Publication of JP2009147263A publication Critical patent/JP2009147263A/ja
Publication of JP2009147263A5 publication Critical patent/JP2009147263A5/ja
Pending legal-status Critical Current

Links

JP2007325747A 2007-12-18 2007-12-18 配線基板およびその製造方法 Pending JP2009147263A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007325747A JP2009147263A (ja) 2007-12-18 2007-12-18 配線基板およびその製造方法
US12/335,907 US20090166077A1 (en) 2007-12-18 2008-12-16 Wiring board and method of manufacturing the same
TW097149133A TW200938012A (en) 2007-12-18 2008-12-17 Wiring board and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007325747A JP2009147263A (ja) 2007-12-18 2007-12-18 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JP2009147263A JP2009147263A (ja) 2009-07-02
JP2009147263A5 true JP2009147263A5 (enExample) 2010-10-21

Family

ID=40796730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007325747A Pending JP2009147263A (ja) 2007-12-18 2007-12-18 配線基板およびその製造方法

Country Status (3)

Country Link
US (1) US20090166077A1 (enExample)
JP (1) JP2009147263A (enExample)
TW (1) TW200938012A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8921705B2 (en) * 2008-11-28 2014-12-30 Ibiden Co., Ltd. Wiring board and fabrication method therefor
US20100139967A1 (en) * 2008-12-08 2010-06-10 Ibiden Co., Ltd. Wiring board and fabrication method therefor
TW201110839A (en) * 2009-09-04 2011-03-16 Advanced Semiconductor Eng Substrate structure and method for manufacturing the same
JP2013214568A (ja) * 2012-03-30 2013-10-17 Fujitsu Ltd 配線基板及び配線基板の製造方法
KR101548816B1 (ko) * 2013-11-11 2015-08-31 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP6306865B2 (ja) * 2013-12-05 2018-04-04 Ｊｘ金属株式会社 樹脂基板を互いに剥離可能に密着させた積層体
KR102436226B1 (ko) * 2015-08-19 2022-08-25 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04279097A (ja) * 1991-03-07 1992-10-05 Sony Corp プリント配線板の放熱構造
JPH07109943B2 (ja) * 1992-12-09 1995-11-22 日本電気株式会社 多層配線基板
DE4334127C1 (de) * 1993-10-07 1995-03-23 Mtu Muenchen Gmbh Metallkernleiterplatte zum Einschieben in das Gehäuse eines Elektronikgerätes
JP2003347727A (ja) * 2002-05-30 2003-12-05 Hitachi Ltd 配線基板および両面実装半導体製品
JP5105168B2 (ja) * 2005-11-02 2012-12-19 イビデン株式会社 多層プリント配線板
US7714453B2 (en) * 2006-05-12 2010-05-11 Broadcom Corporation Interconnect structure and formation for package stacking of molded plastic area array package

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