JP2009147263A - 配線基板およびその製造方法 - Google Patents

配線基板およびその製造方法 Download PDF

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Publication number
JP2009147263A
JP2009147263A JP2007325747A JP2007325747A JP2009147263A JP 2009147263 A JP2009147263 A JP 2009147263A JP 2007325747 A JP2007325747 A JP 2007325747A JP 2007325747 A JP2007325747 A JP 2007325747A JP 2009147263 A JP2009147263 A JP 2009147263A
Authority
JP
Japan
Prior art keywords
wiring board
wiring
layer
conductor portion
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007325747A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009147263A5 (enExample
Inventor
Hidekazu Hirakawa
英一 平川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007325747A priority Critical patent/JP2009147263A/ja
Priority to US12/335,907 priority patent/US20090166077A1/en
Priority to TW097149133A priority patent/TW200938012A/zh
Publication of JP2009147263A publication Critical patent/JP2009147263A/ja
Publication of JP2009147263A5 publication Critical patent/JP2009147263A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2007325747A 2007-12-18 2007-12-18 配線基板およびその製造方法 Pending JP2009147263A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007325747A JP2009147263A (ja) 2007-12-18 2007-12-18 配線基板およびその製造方法
US12/335,907 US20090166077A1 (en) 2007-12-18 2008-12-16 Wiring board and method of manufacturing the same
TW097149133A TW200938012A (en) 2007-12-18 2008-12-17 Wiring board and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007325747A JP2009147263A (ja) 2007-12-18 2007-12-18 配線基板およびその製造方法

Publications (2)

Publication Number Publication Date
JP2009147263A true JP2009147263A (ja) 2009-07-02
JP2009147263A5 JP2009147263A5 (enExample) 2010-10-21

Family

ID=40796730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007325747A Pending JP2009147263A (ja) 2007-12-18 2007-12-18 配線基板およびその製造方法

Country Status (3)

Country Link
US (1) US20090166077A1 (enExample)
JP (1) JP2009147263A (enExample)
TW (1) TW200938012A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015107598A (ja) * 2013-12-05 2015-06-11 Jx日鉱日石金属株式会社 樹脂基板を互いに剥離可能に密着させた積層体

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8921705B2 (en) * 2008-11-28 2014-12-30 Ibiden Co., Ltd. Wiring board and fabrication method therefor
US20100139967A1 (en) * 2008-12-08 2010-06-10 Ibiden Co., Ltd. Wiring board and fabrication method therefor
TW201110839A (en) * 2009-09-04 2011-03-16 Advanced Semiconductor Eng Substrate structure and method for manufacturing the same
JP2013214568A (ja) * 2012-03-30 2013-10-17 Fujitsu Ltd 配線基板及び配線基板の製造方法
KR101548816B1 (ko) * 2013-11-11 2015-08-31 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR102436226B1 (ko) * 2015-08-19 2022-08-25 삼성전기주식회사 인쇄회로기판 및 그 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04279097A (ja) * 1991-03-07 1992-10-05 Sony Corp プリント配線板の放熱構造
JP2003347727A (ja) * 2002-05-30 2003-12-05 Hitachi Ltd 配線基板および両面実装半導体製品
WO2007052674A1 (ja) * 2005-11-02 2007-05-10 Ibiden Co., Ltd. 半導体装置用多層プリント配線板及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07109943B2 (ja) * 1992-12-09 1995-11-22 日本電気株式会社 多層配線基板
DE4334127C1 (de) * 1993-10-07 1995-03-23 Mtu Muenchen Gmbh Metallkernleiterplatte zum Einschieben in das Gehäuse eines Elektronikgerätes
US7714453B2 (en) * 2006-05-12 2010-05-11 Broadcom Corporation Interconnect structure and formation for package stacking of molded plastic area array package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04279097A (ja) * 1991-03-07 1992-10-05 Sony Corp プリント配線板の放熱構造
JP2003347727A (ja) * 2002-05-30 2003-12-05 Hitachi Ltd 配線基板および両面実装半導体製品
WO2007052674A1 (ja) * 2005-11-02 2007-05-10 Ibiden Co., Ltd. 半導体装置用多層プリント配線板及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015107598A (ja) * 2013-12-05 2015-06-11 Jx日鉱日石金属株式会社 樹脂基板を互いに剥離可能に密着させた積層体

Also Published As

Publication number Publication date
US20090166077A1 (en) 2009-07-02
TW200938012A (en) 2009-09-01

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