JP2013507763A5 - - Google Patents
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- Publication number
- JP2013507763A5 JP2013507763A5 JP2012533067A JP2012533067A JP2013507763A5 JP 2013507763 A5 JP2013507763 A5 JP 2013507763A5 JP 2012533067 A JP2012533067 A JP 2012533067A JP 2012533067 A JP2012533067 A JP 2012533067A JP 2013507763 A5 JP2013507763 A5 JP 2013507763A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- circuit board
- printed circuit
- embedded
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090095840A KR20110038521A (ko) | 2009-10-08 | 2009-10-08 | 인쇄회로기판 및 그 제조방법 |
| KR10-2009-0095840 | 2009-10-08 | ||
| PCT/KR2010/005124 WO2011043537A2 (en) | 2009-10-08 | 2010-08-05 | Printed circuit board and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013507763A JP2013507763A (ja) | 2013-03-04 |
| JP2013507763A5 true JP2013507763A5 (enExample) | 2013-09-26 |
| JP5635613B2 JP5635613B2 (ja) | 2014-12-03 |
Family
ID=43857240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012533067A Expired - Fee Related JP5635613B2 (ja) | 2009-10-08 | 2010-08-05 | プリント回路基板及びその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20120255764A1 (enExample) |
| JP (1) | JP5635613B2 (enExample) |
| KR (1) | KR20110038521A (enExample) |
| CN (1) | CN102577642B (enExample) |
| TW (1) | TWI482549B (enExample) |
| WO (1) | WO2011043537A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106034373B (zh) * | 2015-03-10 | 2018-09-25 | 上海量子绘景电子股份有限公司 | 高密度多层铜线路板及其制备方法 |
| CN112423474A (zh) * | 2019-08-23 | 2021-02-26 | 中国科学技术大学 | 电路板的制备方法及电路板 |
| EP4129023A1 (en) * | 2020-03-26 | 2023-02-08 | Battelle Memorial Institute | Printed circuit board connector |
| US20240147617A1 (en) * | 2021-03-22 | 2024-05-02 | Panasonic Intellectual Property Management Co., Ltd. | Wiring body, mounting substrate, wiring-equipped wiring transfer plate, wiring body intermediate material, method for manufacturing wiring body, and method for manufacturing mounting substrate |
| CN113347808B (zh) * | 2021-05-13 | 2022-07-19 | 江苏普诺威电子股份有限公司 | 具有厚铜和超微细密线路的多层电路板的制作方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6294743B1 (en) * | 1995-04-28 | 2001-09-25 | Victor Company Of Japan, Ltd. | Multilayer print circuit board and the production method of the multilayer print circuit board |
| US5772905A (en) * | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
| US6753483B2 (en) * | 2000-06-14 | 2004-06-22 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method of manufacturing the same |
| US6815709B2 (en) * | 2001-05-23 | 2004-11-09 | International Business Machines Corporation | Structure having flush circuitry features and method of making |
| US7186365B2 (en) * | 2003-06-05 | 2007-03-06 | Intel Corporation | Methods for forming an imprinting tool |
| KR101063620B1 (ko) * | 2003-09-08 | 2011-09-07 | 엘지이노텍 주식회사 | 다층 인쇄회로기판 및 그의 제조방법 |
| KR100601474B1 (ko) * | 2004-10-28 | 2006-07-18 | 삼성전기주식회사 | 임프린트법을 이용한 고분해능 인쇄회로기판의 제조방법 |
| KR100741677B1 (ko) * | 2006-03-06 | 2007-07-23 | 삼성전기주식회사 | 임프린팅에 의한 기판의 제조방법 |
| KR100836653B1 (ko) * | 2006-10-25 | 2008-06-10 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
| JP5069449B2 (ja) * | 2006-11-14 | 2012-11-07 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| KR100776248B1 (ko) * | 2006-11-21 | 2007-11-16 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
| JP4697156B2 (ja) * | 2007-02-28 | 2011-06-08 | トヨタ自動車株式会社 | 回路基板の製造方法 |
| JP5078451B2 (ja) * | 2007-06-11 | 2012-11-21 | パナソニック株式会社 | 電子部品内蔵モジュール |
| KR100916646B1 (ko) * | 2007-11-26 | 2009-09-08 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
| JP2009177005A (ja) * | 2008-01-25 | 2009-08-06 | Nitto Denko Corp | 配線回路基板の製造方法 |
-
2009
- 2009-10-08 KR KR1020090095840A patent/KR20110038521A/ko not_active Ceased
-
2010
- 2010-08-05 CN CN201080045505.XA patent/CN102577642B/zh not_active Expired - Fee Related
- 2010-08-05 US US13/500,754 patent/US20120255764A1/en not_active Abandoned
- 2010-08-05 WO PCT/KR2010/005124 patent/WO2011043537A2/en not_active Ceased
- 2010-08-05 JP JP2012533067A patent/JP5635613B2/ja not_active Expired - Fee Related
- 2010-08-13 TW TW099127093A patent/TWI482549B/zh active
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