JP2014067941A5 - - Google Patents
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- Publication number
- JP2014067941A5 JP2014067941A5 JP2012213601A JP2012213601A JP2014067941A5 JP 2014067941 A5 JP2014067941 A5 JP 2014067941A5 JP 2012213601 A JP2012213601 A JP 2012213601A JP 2012213601 A JP2012213601 A JP 2012213601A JP 2014067941 A5 JP2014067941 A5 JP 2014067941A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- copper
- tin alloy
- wiring
- via hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 39
- 239000010949 copper Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 19
- 239000007822 coupling agent Substances 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000003197 catalytic effect Effects 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 7
- 238000000034 method Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000010030 laminating Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- -1 palladium ions Chemical class 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012213601A JP6009300B2 (ja) | 2012-09-27 | 2012-09-27 | 配線基板及びその製造方法 |
| US14/032,592 US9232644B2 (en) | 2012-09-27 | 2013-09-20 | Wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012213601A JP6009300B2 (ja) | 2012-09-27 | 2012-09-27 | 配線基板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014067941A JP2014067941A (ja) | 2014-04-17 |
| JP2014067941A5 true JP2014067941A5 (enExample) | 2015-10-08 |
| JP6009300B2 JP6009300B2 (ja) | 2016-10-19 |
Family
ID=50337771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012213601A Active JP6009300B2 (ja) | 2012-09-27 | 2012-09-27 | 配線基板及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9232644B2 (enExample) |
| JP (1) | JP6009300B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9418934B1 (en) * | 2015-06-30 | 2016-08-16 | International Business Machines Corporation | Structure and fabrication method for electromigration immortal nanoscale interconnects |
| JP6625872B2 (ja) * | 2015-11-25 | 2019-12-25 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
| EP3386282A4 (en) * | 2015-11-30 | 2019-07-17 | Toppan Printing Co., Ltd. | MULTILAYER FITTED PCB AND METHOD FOR THE MANUFACTURE THEREOF |
| CN107347230B (zh) * | 2016-05-06 | 2019-08-20 | 宏恒胜电子科技（淮安）有限公司 | 电路板的制备方法 |
| WO2019171990A1 (ja) * | 2018-03-09 | 2019-09-12 | 株式会社有沢製作所 | 積層体及びその製造方法 |
| WO2021044274A1 (en) * | 2019-09-03 | 2021-03-11 | 3M Innovative Properties Company | Optical films and methods of manufacturing such optical films |
| US11393747B2 (en) * | 2020-08-31 | 2022-07-19 | Advanced Semiconductor Engineering, Inc. | Substrate structure having roughned upper surface of conductive layer |
| TWI740767B (zh) * | 2021-01-07 | 2021-09-21 | 欣興電子股份有限公司 | 線路板及其製作方法 |
| WO2022202547A1 (ja) * | 2021-03-22 | 2022-09-29 | パナソニックＩｐマネジメント株式会社 | 配線体、実装基板、配線体の製造方法、及び、実装基板の製造方法 |
| JP7569743B2 (ja) * | 2021-04-19 | 2024-10-18 | イビデン株式会社 | 配線基板 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS505375B1 (enExample) * | 1970-03-26 | 1975-03-03 | ||
| JPS61113296A (ja) | 1984-11-08 | 1986-05-31 | キヤノン株式会社 | プリント回路板の製造方法 |
| US6197688B1 (en) * | 1998-02-12 | 2001-03-06 | Motorola Inc. | Interconnect structure in a semiconductor device and method of formation |
| JP3631682B2 (ja) | 2001-02-26 | 2005-03-23 | 京セラ株式会社 | 多層配線基板及びその製造方法 |
| US6475327B2 (en) * | 2001-04-05 | 2002-11-05 | Phoenix Precision Technology Corporation | Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier |
| CN100546435C (zh) | 2003-11-14 | 2009-09-30 | 日立化成工业株式会社 | 金属层的树脂层的形成方法、印刷线路板及其制造方法 |
| US7517736B2 (en) * | 2006-02-15 | 2009-04-14 | International Business Machines Corporation | Structure and method of chemically formed anchored metallic vias |
| US8314348B2 (en) * | 2008-03-03 | 2012-11-20 | Ibiden Co., Ltd. | Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
| EP2200413A4 (en) * | 2008-09-30 | 2011-12-14 | Ibiden Co Ltd | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD |
| JP5310849B2 (ja) * | 2009-06-24 | 2013-10-09 | 富士通株式会社 | 配線基板の製造方法 |
| JP2011049289A (ja) * | 2009-08-26 | 2011-03-10 | Kyocera Corp | 配線基板及びその製造方法 |
| JP5330156B2 (ja) * | 2009-08-26 | 2013-10-30 | パナソニック株式会社 | 回路基板の製造方法、及び前記製造方法により得られた回路基板 |
| US8324738B2 (en) * | 2009-09-01 | 2012-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Self-aligned protection layer for copper post structure |
-
2012
- 2012-09-27 JP JP2012213601A patent/JP6009300B2/ja active Active
-
2013
- 2013-09-20 US US14/032,592 patent/US9232644B2/en active Active
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