JP2019125709A5 - - Google Patents
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- Publication number
- JP2019125709A5 JP2019125709A5 JP2018005651A JP2018005651A JP2019125709A5 JP 2019125709 A5 JP2019125709 A5 JP 2019125709A5 JP 2018005651 A JP2018005651 A JP 2018005651A JP 2018005651 A JP2018005651 A JP 2018005651A JP 2019125709 A5 JP2019125709 A5 JP 2019125709A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal
- plating layer
- metal plating
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 47
- 238000007747 plating Methods 0.000 claims description 31
- 238000001039 wet etching Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 229960003280 cupric chloride Drugs 0.000 claims 1
- 239000011259 mixed solution Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018005651A JP7032148B2 (ja) | 2018-01-17 | 2018-01-17 | 配線基板及びその製造方法と電子部品装置 |
| US16/243,199 US10643934B2 (en) | 2018-01-17 | 2019-01-09 | Wiring substrate and electronic component device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018005651A JP7032148B2 (ja) | 2018-01-17 | 2018-01-17 | 配線基板及びその製造方法と電子部品装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019125709A JP2019125709A (ja) | 2019-07-25 |
| JP2019125709A5 true JP2019125709A5 (enExample) | 2020-12-24 |
| JP7032148B2 JP7032148B2 (ja) | 2022-03-08 |
Family
ID=67213032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018005651A Active JP7032148B2 (ja) | 2018-01-17 | 2018-01-17 | 配線基板及びその製造方法と電子部品装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10643934B2 (enExample) |
| JP (1) | JP7032148B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7279624B2 (ja) * | 2019-11-27 | 2023-05-23 | 株式会社ソシオネクスト | 半導体装置 |
| JP7760246B2 (ja) | 2021-01-13 | 2025-10-27 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
| JPWO2023026984A1 (enExample) * | 2021-08-26 | 2023-03-02 | ||
| CN115835472A (zh) * | 2021-09-16 | 2023-03-21 | Lg伊诺特有限公司 | 电路板、透镜驱动装置及包括其的相机模块 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63153889A (ja) * | 1986-12-17 | 1988-06-27 | 日立プラント建設株式会社 | プリント基板のパタ−ン形成方法 |
| JP2005175128A (ja) | 2003-12-10 | 2005-06-30 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| JP4769056B2 (ja) | 2005-10-07 | 2011-09-07 | 日本特殊陶業株式会社 | 配線基板及びその製法方法 |
| JP2008135445A (ja) | 2006-11-27 | 2008-06-12 | Shinko Electric Ind Co Ltd | 配線構造及び配線層の形成方法 |
| US8338957B2 (en) * | 2007-07-05 | 2012-12-25 | ÅAC Microtec AB | Low resistance through-wafer via |
| JP2013077726A (ja) | 2011-09-30 | 2013-04-25 | Toppan Printing Co Ltd | 半導体パッケージの製造方法 |
| JP2014154800A (ja) | 2013-02-13 | 2014-08-25 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
| JP2014179362A (ja) | 2013-03-13 | 2014-09-25 | Ps4 Luxco S A R L | 半導体装置 |
| JP2015076465A (ja) * | 2013-10-08 | 2015-04-20 | イビデン株式会社 | プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ |
| JP2015162660A (ja) | 2014-02-28 | 2015-09-07 | イビデン株式会社 | プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ |
| JP6375159B2 (ja) * | 2014-07-07 | 2018-08-15 | 新光電気工業株式会社 | 配線基板、半導体パッケージ |
| US9564359B2 (en) * | 2014-07-17 | 2017-02-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conductive structure and method of forming the same |
| JP6510897B2 (ja) * | 2015-06-09 | 2019-05-08 | 新光電気工業株式会社 | 配線基板及びその製造方法と電子部品装置 |
| JP6619294B2 (ja) | 2016-05-24 | 2019-12-11 | 新光電気工業株式会社 | 配線基板及びその製造方法と電子部品装置 |
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2018
- 2018-01-17 JP JP2018005651A patent/JP7032148B2/ja active Active
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2019
- 2019-01-09 US US16/243,199 patent/US10643934B2/en active Active