JP2017005074A5 - - Google Patents
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- Publication number
- JP2017005074A5 JP2017005074A5 JP2015116522A JP2015116522A JP2017005074A5 JP 2017005074 A5 JP2017005074 A5 JP 2017005074A5 JP 2015116522 A JP2015116522 A JP 2015116522A JP 2015116522 A JP2015116522 A JP 2015116522A JP 2017005074 A5 JP2017005074 A5 JP 2017005074A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- pad
- wiring board
- insulating layer
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 12
- 239000011888 foil Substances 0.000 claims 11
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000001039 wet etching Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 239000011259 mixed solution Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015116522A JP6510897B2 (ja) | 2015-06-09 | 2015-06-09 | 配線基板及びその製造方法と電子部品装置 |
| US15/174,440 US9711476B2 (en) | 2015-06-09 | 2016-06-06 | Wiring board and electronic component device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015116522A JP6510897B2 (ja) | 2015-06-09 | 2015-06-09 | 配線基板及びその製造方法と電子部品装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017005074A JP2017005074A (ja) | 2017-01-05 |
| JP2017005074A5 true JP2017005074A5 (enExample) | 2018-02-08 |
| JP6510897B2 JP6510897B2 (ja) | 2019-05-08 |
Family
ID=57517205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015116522A Active JP6510897B2 (ja) | 2015-06-09 | 2015-06-09 | 配線基板及びその製造方法と電子部品装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9711476B2 (enExample) |
| JP (1) | JP6510897B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6858576B2 (ja) * | 2017-01-30 | 2021-04-14 | 新光電気工業株式会社 | 半導体装置の製造方法 |
| EP3584276B1 (en) * | 2017-02-17 | 2024-09-11 | Resonac Corporation | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate |
| JP7032148B2 (ja) * | 2018-01-17 | 2022-03-08 | 新光電気工業株式会社 | 配線基板及びその製造方法と電子部品装置 |
| CN208691627U (zh) | 2018-08-03 | 2019-04-02 | 奥特斯科技(重庆)有限公司 | 具有嵌入腔中的部件且前侧上具有双介电层的部件承载件 |
| DE112019005745T5 (de) * | 2018-11-15 | 2021-07-29 | Rohm Co., Ltd. | Halbleiterbauelement |
| CN109729639B (zh) | 2018-12-24 | 2020-11-20 | 奥特斯科技(重庆)有限公司 | 在无芯基板上包括柱体的部件承载件 |
| JP7700986B2 (ja) * | 2021-10-19 | 2025-07-01 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4108643B2 (ja) | 2004-05-12 | 2008-06-25 | 日本電気株式会社 | 配線基板及びそれを用いた半導体パッケージ |
| JP5410660B2 (ja) * | 2007-07-27 | 2014-02-05 | 新光電気工業株式会社 | 配線基板及びその製造方法と電子部品装置及びその製造方法 |
| JP5526746B2 (ja) * | 2009-12-04 | 2014-06-18 | 凸版印刷株式会社 | 多層基板の製造方法及び支持基板 |
| JP5599276B2 (ja) * | 2010-09-24 | 2014-10-01 | 新光電気工業株式会社 | 半導体素子、半導体素子実装体及び半導体素子の製造方法 |
| JP2012216824A (ja) * | 2011-03-31 | 2012-11-08 | Hitachi Chem Co Ltd | 半導体素子搭載用パッケージ基板の製造方法 |
| US8772951B1 (en) | 2013-08-29 | 2014-07-08 | Qualcomm Incorporated | Ultra fine pitch and spacing interconnects for substrate |
| JP2015060947A (ja) * | 2013-09-19 | 2015-03-30 | イビデン株式会社 | 金属ポストを有するプリント配線板及び金属ポストを有するプリント配線板の製造方法 |
-
2015
- 2015-06-09 JP JP2015116522A patent/JP6510897B2/ja active Active
-
2016
- 2016-06-06 US US15/174,440 patent/US9711476B2/en active Active
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