JP6510897B2 - 配線基板及びその製造方法と電子部品装置 - Google Patents

配線基板及びその製造方法と電子部品装置 Download PDF

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Publication number
JP6510897B2
JP6510897B2 JP2015116522A JP2015116522A JP6510897B2 JP 6510897 B2 JP6510897 B2 JP 6510897B2 JP 2015116522 A JP2015116522 A JP 2015116522A JP 2015116522 A JP2015116522 A JP 2015116522A JP 6510897 B2 JP6510897 B2 JP 6510897B2
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Japan
Prior art keywords
metal
pad
wiring
insulating layer
layer
Prior art date
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Application number
JP2015116522A
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English (en)
Japanese (ja)
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JP2017005074A5 (enExample
JP2017005074A (ja
Inventor
朋幸 下平
朋幸 下平
貴博 六川
貴博 六川
人資 近藤
人資 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2015116522A priority Critical patent/JP6510897B2/ja
Priority to US15/174,440 priority patent/US9711476B2/en
Publication of JP2017005074A publication Critical patent/JP2017005074A/ja
Publication of JP2017005074A5 publication Critical patent/JP2017005074A5/ja
Application granted granted Critical
Publication of JP6510897B2 publication Critical patent/JP6510897B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H10W70/05—
    • H10W70/652—
    • H10W70/685—
    • H10W74/012—
    • H10W74/15—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W42/121—
    • H10W72/01251—
    • H10W72/01253—
    • H10W72/01333—
    • H10W72/01336—
    • H10W72/072—
    • H10W72/07236—
    • H10W72/07252—
    • H10W72/073—
    • H10W72/07338—
    • H10W72/221—
    • H10W72/234—
    • H10W72/241—
    • H10W72/248—
    • H10W72/252—
    • H10W72/354—
    • H10W72/856—
    • H10W90/724—
    • H10W90/734—
    • H10W99/00—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2015116522A 2015-06-09 2015-06-09 配線基板及びその製造方法と電子部品装置 Active JP6510897B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015116522A JP6510897B2 (ja) 2015-06-09 2015-06-09 配線基板及びその製造方法と電子部品装置
US15/174,440 US9711476B2 (en) 2015-06-09 2016-06-06 Wiring board and electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015116522A JP6510897B2 (ja) 2015-06-09 2015-06-09 配線基板及びその製造方法と電子部品装置

Publications (3)

Publication Number Publication Date
JP2017005074A JP2017005074A (ja) 2017-01-05
JP2017005074A5 JP2017005074A5 (enExample) 2018-02-08
JP6510897B2 true JP6510897B2 (ja) 2019-05-08

Family

ID=57517205

Family Applications (1)

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JP2015116522A Active JP6510897B2 (ja) 2015-06-09 2015-06-09 配線基板及びその製造方法と電子部品装置

Country Status (2)

Country Link
US (1) US9711476B2 (enExample)
JP (1) JP6510897B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6858576B2 (ja) * 2017-01-30 2021-04-14 新光電気工業株式会社 半導体装置の製造方法
KR102429887B1 (ko) * 2017-02-17 2022-08-04 쇼와덴코머티리얼즈가부시끼가이샤 프리프레그, 적층판, 프린트 배선판, 코어리스 기판, 반도체 패키지 및 코어리스 기판의 제조 방법
JP7032148B2 (ja) * 2018-01-17 2022-03-08 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
CN208691627U (zh) 2018-08-03 2019-04-02 奥特斯科技(重庆)有限公司 具有嵌入腔中的部件且前侧上具有双介电层的部件承载件
WO2020100947A1 (ja) * 2018-11-15 2020-05-22 ローム株式会社 半導体装置
CN109729639B (zh) 2018-12-24 2020-11-20 奥特斯科技(重庆)有限公司 在无芯基板上包括柱体的部件承载件
KR102904475B1 (ko) * 2020-09-25 2025-12-24 삼성전자 주식회사 Ubm층을 가지는 팬 아웃 반도체 패키지
JP7700986B2 (ja) * 2021-10-19 2025-07-01 新光電気工業株式会社 配線基板及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4108643B2 (ja) 2004-05-12 2008-06-25 日本電気株式会社 配線基板及びそれを用いた半導体パッケージ
JP5410660B2 (ja) * 2007-07-27 2014-02-05 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置及びその製造方法
JP5526746B2 (ja) * 2009-12-04 2014-06-18 凸版印刷株式会社 多層基板の製造方法及び支持基板
JP5599276B2 (ja) * 2010-09-24 2014-10-01 新光電気工業株式会社 半導体素子、半導体素子実装体及び半導体素子の製造方法
JP2012216824A (ja) * 2011-03-31 2012-11-08 Hitachi Chem Co Ltd 半導体素子搭載用パッケージ基板の製造方法
US8772951B1 (en) 2013-08-29 2014-07-08 Qualcomm Incorporated Ultra fine pitch and spacing interconnects for substrate
JP2015060947A (ja) * 2013-09-19 2015-03-30 イビデン株式会社 金属ポストを有するプリント配線板及び金属ポストを有するプリント配線板の製造方法

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Publication number Publication date
US20160365327A1 (en) 2016-12-15
US9711476B2 (en) 2017-07-18
JP2017005074A (ja) 2017-01-05

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