JP2018006712A5 - - Google Patents

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Publication number
JP2018006712A5
JP2018006712A5 JP2016136291A JP2016136291A JP2018006712A5 JP 2018006712 A5 JP2018006712 A5 JP 2018006712A5 JP 2016136291 A JP2016136291 A JP 2016136291A JP 2016136291 A JP2016136291 A JP 2016136291A JP 2018006712 A5 JP2018006712 A5 JP 2018006712A5
Authority
JP
Japan
Prior art keywords
layer
wiring
electronic component
via hole
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016136291A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018006712A (ja
JP6671256B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016136291A priority Critical patent/JP6671256B2/ja
Priority claimed from JP2016136291A external-priority patent/JP6671256B2/ja
Priority to US15/635,590 priority patent/US10080292B2/en
Publication of JP2018006712A publication Critical patent/JP2018006712A/ja
Publication of JP2018006712A5 publication Critical patent/JP2018006712A5/ja
Application granted granted Critical
Publication of JP6671256B2 publication Critical patent/JP6671256B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016136291A 2016-07-08 2016-07-08 配線基板及びその製造方法 Active JP6671256B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016136291A JP6671256B2 (ja) 2016-07-08 2016-07-08 配線基板及びその製造方法
US15/635,590 US10080292B2 (en) 2016-07-08 2017-06-28 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016136291A JP6671256B2 (ja) 2016-07-08 2016-07-08 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2018006712A JP2018006712A (ja) 2018-01-11
JP2018006712A5 true JP2018006712A5 (enExample) 2019-03-28
JP6671256B2 JP6671256B2 (ja) 2020-03-25

Family

ID=60911425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016136291A Active JP6671256B2 (ja) 2016-07-08 2016-07-08 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US10080292B2 (enExample)
JP (1) JP6671256B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN216531943U (zh) 2018-10-04 2022-05-13 株式会社村田制作所 层叠体
US11296030B2 (en) * 2019-04-29 2022-04-05 Advanced Semiconductor Engineering, Inc. Embedded component package structure and manufacturing method thereof
KR20220086924A (ko) * 2020-12-17 2022-06-24 삼성전기주식회사 인쇄회로기판

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8225503B2 (en) * 2008-02-11 2012-07-24 Ibiden Co., Ltd. Method for manufacturing board with built-in electronic elements
US8024858B2 (en) * 2008-02-14 2011-09-27 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
JP5693977B2 (ja) 2011-01-11 2015-04-01 新光電気工業株式会社 配線基板及びその製造方法
JP2013084692A (ja) 2011-10-06 2013-05-09 Ibiden Co Ltd 配線板及びその製造方法
JP2015226013A (ja) * 2014-05-29 2015-12-14 イビデン株式会社 プリント配線板およびその製造方法
JP2016066705A (ja) * 2014-09-25 2016-04-28 イビデン株式会社 プリント配線板およびその製造方法

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