JP6671256B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP6671256B2
JP6671256B2 JP2016136291A JP2016136291A JP6671256B2 JP 6671256 B2 JP6671256 B2 JP 6671256B2 JP 2016136291 A JP2016136291 A JP 2016136291A JP 2016136291 A JP2016136291 A JP 2016136291A JP 6671256 B2 JP6671256 B2 JP 6671256B2
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Prior art keywords
layer
wiring
electronic component
insulating film
electrode
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Japanese (ja)
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JP2018006712A (ja
JP2018006712A5 (enExample
Inventor
淳史 佐藤
淳史 佐藤
人資 近藤
人資 近藤
深瀬　克哉
克哉 深瀬
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2016136291A priority Critical patent/JP6671256B2/ja
Priority to US15/635,590 priority patent/US10080292B2/en
Publication of JP2018006712A publication Critical patent/JP2018006712A/ja
Publication of JP2018006712A5 publication Critical patent/JP2018006712A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
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    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Geometry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2016136291A 2016-07-08 2016-07-08 配線基板及びその製造方法 Active JP6671256B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016136291A JP6671256B2 (ja) 2016-07-08 2016-07-08 配線基板及びその製造方法
US15/635,590 US10080292B2 (en) 2016-07-08 2017-06-28 Wiring board

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