MY179632A - Substrate for mounting semiconductor element and method for manufacturing said substrate - Google Patents
Substrate for mounting semiconductor element and method for manufacturing said substrateInfo
- Publication number
- MY179632A MY179632A MYPI2015701637A MYPI2015701637A MY179632A MY 179632 A MY179632 A MY 179632A MY PI2015701637 A MYPI2015701637 A MY PI2015701637A MY PI2015701637 A MYPI2015701637 A MY PI2015701637A MY 179632 A MY179632 A MY 179632A
- Authority
- MY
- Malaysia
- Prior art keywords
- resist layer
- substrate
- light
- front surface
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Wire Bonding (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Provided are a substrate for mounting a semiconductor element (1) with enhanced adhesiveness between an electrode layer and resin and a method for manufacturing the substrate thanks to a substantially inverted-trapezoidal shape and roughened side surfaces of the electrode layer. The method for manufacturing a substrate for mounting a semiconductor element includes following steps in sequence: a) a step of forming, on a front surface of a metal plate, a two-layered resist layer formed of a lower resist layer (30) and an upper resist layer (40) by using resists each having a different main photosensitive wavelength; b) a step of light-exposing the upper resist layer in a predetermined pattern while the lower resist layer is in a non-light-exposed state; c) a developing step of forming openings in a predetermined pattern in the upper resist layer and forming further openings with the pattern of the upper resist layer in the non-light-exposed lower resist layer to partially expose the front surface of the metal plate; d) a step of light-exposing and curing the lower resist layer; e) a step of forming a plated layer (10) on the front surface of the metal plate exposed from the lower resist layer; f) a step of etching a front surface of each of the plated layers to make a roughened surface (90); g) a step of performing noble metal plating for bonding (100) on the roughened surface, and h) a step of peeling off all of the resist layers. Figure 2
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012254958A JP6099370B2 (en) | 2012-11-21 | 2012-11-21 | Semiconductor device mounting substrate and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
MY179632A true MY179632A (en) | 2020-11-11 |
Family
ID=50775932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015701637A MY179632A (en) | 2012-11-21 | 2013-11-01 | Substrate for mounting semiconductor element and method for manufacturing said substrate |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6099370B2 (en) |
KR (1) | KR101691762B1 (en) |
CN (1) | CN104813464A (en) |
MY (1) | MY179632A (en) |
PH (1) | PH12015501133A1 (en) |
TW (1) | TWI605553B (en) |
WO (1) | WO2014080746A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6497615B2 (en) | 2015-03-04 | 2019-04-10 | パナソニックIpマネジメント株式会社 | Mounting board and LED module using the same |
JP6555927B2 (en) * | 2015-05-18 | 2019-08-07 | 大口マテリアル株式会社 | Semiconductor device mounting lead frame and semiconductor device manufacturing method |
JP6641807B2 (en) * | 2015-09-07 | 2020-02-05 | 大口マテリアル株式会社 | Optical semiconductor device and method of manufacturing the same |
JP2017168510A (en) * | 2016-03-14 | 2017-09-21 | Shマテリアル株式会社 | Semiconductor element mounting substrate, semiconductor device, method of manufacturing semiconductor element mounting substrate, and method of manufacturing semiconductor device |
JP6826073B2 (en) * | 2018-05-31 | 2021-02-03 | デクセリアルズ株式会社 | Polarizing plate and its manufacturing method, and optical equipment |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3626075B2 (en) * | 2000-06-20 | 2005-03-02 | 九州日立マクセル株式会社 | Manufacturing method of semiconductor device |
JP3960302B2 (en) * | 2002-12-18 | 2007-08-15 | Tdk株式会社 | Substrate manufacturing method |
JP2004253433A (en) * | 2003-02-18 | 2004-09-09 | Matsushita Electric Ind Co Ltd | Printed wiring board, modular component using it, and method for manufacturing same |
JP2005077955A (en) * | 2003-09-02 | 2005-03-24 | Sanyo Electric Co Ltd | Etching method and method for manufacturing circuit device by using same |
JP4508064B2 (en) * | 2005-09-30 | 2010-07-21 | 住友金属鉱山株式会社 | Manufacturing method of wiring board for semiconductor device |
JP5151438B2 (en) * | 2007-12-10 | 2013-02-27 | 大日本印刷株式会社 | Semiconductor device and manufacturing method thereof, and substrate for semiconductor device and manufacturing method thereof |
JP5370330B2 (en) * | 2010-10-01 | 2013-12-18 | 住友金属鉱山株式会社 | Manufacturing method of semiconductor device mounting substrate |
-
2012
- 2012-11-21 JP JP2012254958A patent/JP6099370B2/en active Active
-
2013
- 2013-11-01 MY MYPI2015701637A patent/MY179632A/en unknown
- 2013-11-01 KR KR1020157016475A patent/KR101691762B1/en active IP Right Grant
- 2013-11-01 CN CN201380060217.5A patent/CN104813464A/en active Pending
- 2013-11-01 WO PCT/JP2013/079766 patent/WO2014080746A1/en active Application Filing
- 2013-11-20 TW TW102142207A patent/TWI605553B/en active
-
2015
- 2015-05-21 PH PH12015501133A patent/PH12015501133A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014103293A (en) | 2014-06-05 |
KR101691762B1 (en) | 2017-01-09 |
JP6099370B2 (en) | 2017-03-22 |
PH12015501133B1 (en) | 2015-07-27 |
PH12015501133A1 (en) | 2015-07-27 |
WO2014080746A1 (en) | 2014-05-30 |
CN104813464A (en) | 2015-07-29 |
KR20150087387A (en) | 2015-07-29 |
TWI605553B (en) | 2017-11-11 |
TW201436119A (en) | 2014-09-16 |
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