JP2010040625A5 - - Google Patents
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- Publication number
- JP2010040625A5 JP2010040625A5 JP2008199401A JP2008199401A JP2010040625A5 JP 2010040625 A5 JP2010040625 A5 JP 2010040625A5 JP 2008199401 A JP2008199401 A JP 2008199401A JP 2008199401 A JP2008199401 A JP 2008199401A JP 2010040625 A5 JP2010040625 A5 JP 2010040625A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- forming
- conductor layer
- groove
- base substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 26
- 239000011347 resin Substances 0.000 claims 13
- 229920005989 resin Polymers 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 10
- 238000004519 manufacturing process Methods 0.000 claims 5
- 238000009713 electroplating Methods 0.000 claims 4
- 238000007772 electroless plating Methods 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008199401A JP5062533B2 (ja) | 2008-08-01 | 2008-08-01 | 配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008199401A JP5062533B2 (ja) | 2008-08-01 | 2008-08-01 | 配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010040625A JP2010040625A (ja) | 2010-02-18 |
| JP2010040625A5 true JP2010040625A5 (enExample) | 2011-08-04 |
| JP5062533B2 JP5062533B2 (ja) | 2012-10-31 |
Family
ID=42012887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008199401A Active JP5062533B2 (ja) | 2008-08-01 | 2008-08-01 | 配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5062533B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021132389A1 (ja) * | 2019-12-25 | 2021-07-01 | 富士フイルム株式会社 | 導電性基板の製造方法、導電性基板、タッチセンサー、アンテナ、電磁波シールド材料 |
| JP2023010236A (ja) | 2021-07-09 | 2023-01-20 | イビデン株式会社 | 配線基板及び配線基板の製造方法 |
| TWI869647B (zh) * | 2022-01-13 | 2025-01-11 | 大陸商芯愛科技（南京）有限公司 | 線路結構之製法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3805225B2 (ja) * | 2001-10-01 | 2006-08-02 | 株式会社トクヤマ | 配線基板の製造方法及びそれに用いるウエット処理システム |
| JP2003273510A (ja) * | 2002-03-12 | 2003-09-26 | Hitachi Kokusai Electric Inc | プリント基板の製造方法 |
| JP2005057077A (ja) * | 2003-08-05 | 2005-03-03 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
| JP4079927B2 (ja) * | 2004-09-16 | 2008-04-23 | Ｔｄｋ株式会社 | 多層基板及びその製造方法 |
| JP4694349B2 (ja) * | 2005-11-07 | 2011-06-08 | 日立ビアメカニクス株式会社 | レーザ加工を用いたプリント配線板及びその製造方法 |
| JP2008166736A (ja) * | 2006-12-06 | 2008-07-17 | Hitachi Via Mechanics Ltd | プリント基板の製造方法およびプリント基板加工機 |
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2008
- 2008-08-01 JP JP2008199401A patent/JP5062533B2/ja active Active