JP2012248703A5 - - Google Patents

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Publication number
JP2012248703A5
JP2012248703A5 JP2011119619A JP2011119619A JP2012248703A5 JP 2012248703 A5 JP2012248703 A5 JP 2012248703A5 JP 2011119619 A JP2011119619 A JP 2011119619A JP 2011119619 A JP2011119619 A JP 2011119619A JP 2012248703 A5 JP2012248703 A5 JP 2012248703A5
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JP
Japan
Prior art keywords
conductive layer
groove
substrate body
wiring board
inner bottom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011119619A
Other languages
English (en)
Japanese (ja)
Other versions
JP5613620B2 (ja
JP2012248703A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011119619A priority Critical patent/JP5613620B2/ja
Priority claimed from JP2011119619A external-priority patent/JP5613620B2/ja
Priority to US13/480,985 priority patent/US8729407B2/en
Publication of JP2012248703A publication Critical patent/JP2012248703A/ja
Publication of JP2012248703A5 publication Critical patent/JP2012248703A5/ja
Application granted granted Critical
Publication of JP5613620B2 publication Critical patent/JP5613620B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011119619A 2011-05-27 2011-05-27 配線基板及びその製造方法 Active JP5613620B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011119619A JP5613620B2 (ja) 2011-05-27 2011-05-27 配線基板及びその製造方法
US13/480,985 US8729407B2 (en) 2011-05-27 2012-05-25 Wiring substrate and method for manufacturing wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011119619A JP5613620B2 (ja) 2011-05-27 2011-05-27 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012248703A JP2012248703A (ja) 2012-12-13
JP2012248703A5 true JP2012248703A5 (enExample) 2014-04-24
JP5613620B2 JP5613620B2 (ja) 2014-10-29

Family

ID=47218463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011119619A Active JP5613620B2 (ja) 2011-05-27 2011-05-27 配線基板及びその製造方法

Country Status (2)

Country Link
US (1) US8729407B2 (enExample)
JP (1) JP5613620B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8304863B2 (en) * 2010-02-09 2012-11-06 International Business Machines Corporation Electromigration immune through-substrate vias
US20140306349A1 (en) * 2013-04-11 2014-10-16 Qualcomm Incorporated Low cost interposer comprising an oxidation layer
JP2014236102A (ja) * 2013-05-31 2014-12-15 凸版印刷株式会社 貫通電極付き配線基板、その製造方法及び半導体装置
JP6286169B2 (ja) * 2013-09-26 2018-02-28 新光電気工業株式会社 配線基板及びその製造方法
US10777839B2 (en) * 2014-03-28 2020-09-15 Infineon Technologies Ag Method for forming a battery element, a battery element and a battery
TWI553804B (zh) * 2014-06-06 2016-10-11 矽品精密工業股份有限公司 基板結構之製法
KR102211741B1 (ko) * 2014-07-21 2021-02-03 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
JP2016213283A (ja) * 2015-05-01 2016-12-15 ソニー株式会社 製造方法、および貫通電極付配線基板
EP3109199B1 (fr) * 2015-06-25 2022-05-11 Nivarox-FAR S.A. Piece a base de silicium avec au moins un chanfrein et son procede de fabrication
TWI625991B (zh) * 2016-10-17 2018-06-01 南亞電路板股份有限公司 電路板結構與其製造方法
JP7230462B2 (ja) * 2017-12-04 2023-03-01 ローム株式会社 半導体装置およびその製造方法
WO2019171470A1 (ja) * 2018-03-06 2019-09-12 株式会社 東芝 コンデンサ及びその製造方法
CN111508893B (zh) * 2019-01-31 2023-12-15 奥特斯(中国)有限公司 部件承载件及制造部件承载件的方法
US11711885B2 (en) * 2020-01-31 2023-07-25 Ttm Technologies, Inc. Method of manufacturing printed circuit board assemblies with engineered thermal paths
US11950371B2 (en) * 2019-08-22 2024-04-02 Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. Method for manufacturing transparent circuit board
US11901266B2 (en) * 2021-08-30 2024-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device structure and method for forming the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4340832B2 (ja) * 2001-05-10 2009-10-07 日立電線株式会社 配線基板及びその製造方法
JP2003318178A (ja) * 2002-04-24 2003-11-07 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP4056854B2 (ja) 2002-11-05 2008-03-05 新光電気工業株式会社 半導体装置の製造方法
US7088003B2 (en) * 2004-02-19 2006-08-08 International Business Machines Corporation Structures and methods for integration of ultralow-k dielectrics with improved reliability
JP5038612B2 (ja) * 2005-09-29 2012-10-03 富士通セミコンダクター株式会社 半導体装置
JP5154789B2 (ja) * 2006-12-21 2013-02-27 ルネサスエレクトロニクス株式会社 半導体装置並びに半導体装置の製造方法
US8334202B2 (en) * 2009-11-03 2012-12-18 Infineon Technologies Ag Device fabricated using an electroplating process
KR20120048991A (ko) * 2010-11-08 2012-05-16 삼성전자주식회사 반도체 장치 및 그 제조 방법
US9018094B2 (en) * 2011-03-07 2015-04-28 Invensas Corporation Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
JP2013105753A (ja) * 2011-11-10 2013-05-30 Toshiba Corp 半導体装置の製造方法

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