JP2013084852A5 - - Google Patents
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- Publication number
- JP2013084852A5 JP2013084852A5 JP2011225062A JP2011225062A JP2013084852A5 JP 2013084852 A5 JP2013084852 A5 JP 2013084852A5 JP 2011225062 A JP2011225062 A JP 2011225062A JP 2011225062 A JP2011225062 A JP 2011225062A JP 2013084852 A5 JP2013084852 A5 JP 2013084852A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- hole
- reinforcing material
- density
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 239000012779 reinforcing material Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 4
- 239000010409 thin film Substances 0.000 claims 4
- 238000009713 electroplating Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011225062A JP5753471B2 (ja) | 2011-10-12 | 2011-10-12 | 配線基板、半導体装置及び配線基板の製造方法 |
| US13/648,842 US9433096B2 (en) | 2011-10-12 | 2012-10-10 | Wiring board, semiconductor device and method for manufacturing wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011225062A JP5753471B2 (ja) | 2011-10-12 | 2011-10-12 | 配線基板、半導体装置及び配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013084852A JP2013084852A (ja) | 2013-05-09 |
| JP2013084852A5 true JP2013084852A5 (enExample) | 2014-09-11 |
| JP5753471B2 JP5753471B2 (ja) | 2015-07-22 |
Family
ID=48529721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011225062A Expired - Fee Related JP5753471B2 (ja) | 2011-10-12 | 2011-10-12 | 配線基板、半導体装置及び配線基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9433096B2 (enExample) |
| JP (1) | JP5753471B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9406587B2 (en) * | 2012-06-26 | 2016-08-02 | Intel Corporation | Substrate conductor structure and method |
| WO2015041245A1 (ja) * | 2013-09-18 | 2015-03-26 | 日立化成株式会社 | 配線基板 |
| TWI527173B (zh) * | 2013-10-01 | 2016-03-21 | 旭德科技股份有限公司 | 封裝載板 |
| KR102259485B1 (ko) * | 2013-12-27 | 2021-06-03 | 아지노모토 가부시키가이샤 | 배선판의 제조 방법 |
| JP2020027824A (ja) * | 2018-08-09 | 2020-02-20 | ローム株式会社 | 発光装置および表示装置 |
| JP2023514253A (ja) * | 2020-02-13 | 2023-04-05 | アヴェラテック・コーポレイション | 触媒化金属箔およびその用途 |
| US12170244B2 (en) * | 2020-06-26 | 2024-12-17 | Intel Corporation | High-throughput additively manufactured power delivery vias and traces |
| CN117998750B (zh) * | 2024-02-27 | 2025-05-23 | 清远市富盈电子有限公司 | 厚pcb板的过孔制作方法和pcb板 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3012590B2 (ja) | 1998-03-26 | 2000-02-21 | 富山日本電気株式会社 | 多層印刷配線板の製造方法 |
| WO2004064467A1 (ja) * | 2003-01-16 | 2004-07-29 | Fujitsu Limited | 多層配線基板、その製造方法、および、ファイバ強化樹脂基板の製造方法 |
| JP2007149870A (ja) * | 2005-11-25 | 2007-06-14 | Denso Corp | 回路基板及び回路基板の製造方法。 |
| US8431833B2 (en) * | 2008-12-29 | 2013-04-30 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
| US20110232953A1 (en) * | 2010-03-29 | 2011-09-29 | Kyocera Corporation | Circuit board and structure using the same |
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2011
- 2011-10-12 JP JP2011225062A patent/JP5753471B2/ja not_active Expired - Fee Related
-
2012
- 2012-10-10 US US13/648,842 patent/US9433096B2/en active Active