JP2015211077A5 - - Google Patents

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Publication number
JP2015211077A5
JP2015211077A5 JP2014090406A JP2014090406A JP2015211077A5 JP 2015211077 A5 JP2015211077 A5 JP 2015211077A5 JP 2014090406 A JP2014090406 A JP 2014090406A JP 2014090406 A JP2014090406 A JP 2014090406A JP 2015211077 A5 JP2015211077 A5 JP 2015211077A5
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JP
Japan
Prior art keywords
metal layer
hole
layer
forming
substrate body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014090406A
Other languages
English (en)
Japanese (ja)
Other versions
JP6251629B2 (ja
JP2015211077A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014090406A priority Critical patent/JP6251629B2/ja
Priority claimed from JP2014090406A external-priority patent/JP6251629B2/ja
Priority to US14/687,126 priority patent/US9318351B2/en
Publication of JP2015211077A publication Critical patent/JP2015211077A/ja
Publication of JP2015211077A5 publication Critical patent/JP2015211077A5/ja
Application granted granted Critical
Publication of JP6251629B2 publication Critical patent/JP6251629B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014090406A 2014-04-24 2014-04-24 配線基板及び配線基板の製造方法 Active JP6251629B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014090406A JP6251629B2 (ja) 2014-04-24 2014-04-24 配線基板及び配線基板の製造方法
US14/687,126 US9318351B2 (en) 2014-04-24 2015-04-15 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014090406A JP6251629B2 (ja) 2014-04-24 2014-04-24 配線基板及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2015211077A JP2015211077A (ja) 2015-11-24
JP2015211077A5 true JP2015211077A5 (enExample) 2017-02-16
JP6251629B2 JP6251629B2 (ja) 2017-12-20

Family

ID=54335479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014090406A Active JP6251629B2 (ja) 2014-04-24 2014-04-24 配線基板及び配線基板の製造方法

Country Status (2)

Country Link
US (1) US9318351B2 (enExample)
JP (1) JP6251629B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6723236B2 (ja) 2014-11-05 2020-07-15 コーニング インコーポレイテッド バイアボトムアップ電解メッキ方法
US9666507B2 (en) * 2014-11-30 2017-05-30 United Microelectronics Corp. Through-substrate structure and method for fabricating the same
JP7307898B2 (ja) * 2017-03-24 2023-07-13 大日本印刷株式会社 貫通電極基板及びその製造方法
US10917966B2 (en) * 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias
US20190357364A1 (en) * 2018-05-17 2019-11-21 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component Carrier With Only Partially Filled Thermal Through-Hole
WO2020138221A1 (ja) * 2018-12-26 2020-07-02 京セラ株式会社 配線基板、電子装置及び電子モジュール
WO2020213624A1 (ja) * 2019-04-15 2020-10-22 大日本印刷株式会社 貫通電極基板、電子ユニット、貫通電極基板の製造方法および電子ユニットの製造方法
JP2022147360A (ja) * 2021-03-23 2022-10-06 凸版印刷株式会社 多層配線基板およびその製造方法
JP7746684B2 (ja) * 2021-05-11 2025-10-01 大日本印刷株式会社 貫通電極基板
WO2025047765A1 (ja) * 2023-08-30 2025-03-06 京セラ株式会社 印刷配線板及びビルドアップ印刷配線板
CN120015732B (zh) * 2025-02-14 2025-11-14 无锡缶英微电子科技有限公司 一种硅电容器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3810659B2 (ja) * 2001-08-28 2006-08-16 日本メクトロン株式会社 ヴィアホールの充填方法
US6853046B2 (en) * 2002-09-24 2005-02-08 Hamamatsu Photonics, K.K. Photodiode array and method of making the same
JP4098673B2 (ja) 2003-06-19 2008-06-11 新光電気工業株式会社 半導体パッケージの製造方法
JP2007005404A (ja) * 2005-06-21 2007-01-11 Matsushita Electric Works Ltd 半導体基板への貫通配線の形成方法
JP4552770B2 (ja) * 2005-06-21 2010-09-29 パナソニック電工株式会社 半導体基板への貫通配線の形成方法
US8330256B2 (en) * 2008-11-18 2012-12-11 Seiko Epson Corporation Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus
JP2013077807A (ja) * 2011-09-13 2013-04-25 Hoya Corp 基板製造方法および配線基板の製造方法

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