JP2017073520A5 - - Google Patents
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- Publication number
- JP2017073520A5 JP2017073520A5 JP2015201143A JP2015201143A JP2017073520A5 JP 2017073520 A5 JP2017073520 A5 JP 2017073520A5 JP 2015201143 A JP2015201143 A JP 2015201143A JP 2015201143 A JP2015201143 A JP 2015201143A JP 2017073520 A5 JP2017073520 A5 JP 2017073520A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- layer
- wiring
- connection terminal
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000001681 protective effect Effects 0.000 claims description 17
- 230000003746 surface roughness Effects 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000007788 roughening Methods 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000009499 grossing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015201143A JP6530298B2 (ja) | 2015-10-09 | 2015-10-09 | 配線基板、半導体装置及び配線基板の製造方法 |
| US15/284,592 US9997450B2 (en) | 2015-10-09 | 2016-10-04 | Wiring substrate and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015201143A JP6530298B2 (ja) | 2015-10-09 | 2015-10-09 | 配線基板、半導体装置及び配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017073520A JP2017073520A (ja) | 2017-04-13 |
| JP2017073520A5 true JP2017073520A5 (enExample) | 2018-08-23 |
| JP6530298B2 JP6530298B2 (ja) | 2019-06-12 |
Family
ID=58499951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015201143A Active JP6530298B2 (ja) | 2015-10-09 | 2015-10-09 | 配線基板、半導体装置及び配線基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9997450B2 (enExample) |
| JP (1) | JP6530298B2 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180120507A (ko) * | 2017-04-27 | 2018-11-06 | 삼성전기주식회사 | 인쇄회로기판 |
| US10325854B2 (en) * | 2017-07-18 | 2019-06-18 | Advanced Semiconductor Engineering, Inc. | Interposer and semiconductor package device |
| US10163832B1 (en) * | 2017-10-27 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated fan-out package, redistribution circuit structure, and method of fabricating the same |
| CN113611785B (zh) | 2018-02-01 | 2022-05-27 | 新唐科技日本株式会社 | 半导体装置 |
| JP7067114B2 (ja) * | 2018-02-27 | 2022-05-16 | 三菱マテリアル株式会社 | 絶縁回路基板及びその製造方法 |
| KR102666153B1 (ko) * | 2018-06-15 | 2024-05-17 | 삼성전자주식회사 | 반도체 장치 |
| JP7097139B2 (ja) | 2018-07-26 | 2022-07-07 | 京セラ株式会社 | 配線基板 |
| KR102513086B1 (ko) * | 2018-10-01 | 2023-03-23 | 삼성전자주식회사 | 반도체 패키지 |
| JP7253946B2 (ja) * | 2019-03-20 | 2023-04-07 | 新光電気工業株式会社 | 配線基板及びその製造方法、半導体パッケージ |
| US10950519B2 (en) * | 2019-05-31 | 2021-03-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated circuit package and method |
| JP2020202205A (ja) * | 2019-06-06 | 2020-12-17 | イビデン株式会社 | プリント配線板とプリント配線板の製造方法 |
| US12245366B2 (en) | 2019-10-30 | 2025-03-04 | Kyocera Corporation | Wiring board |
| US11854879B2 (en) | 2020-02-26 | 2023-12-26 | Raytheon Company | Cu3Sn via metallization in electrical devices for low-temperature 3D-integration |
| KR102854173B1 (ko) * | 2020-07-24 | 2025-09-03 | 삼성전기주식회사 | 인쇄회로기판 |
| CN116529870A (zh) * | 2020-10-30 | 2023-08-01 | 京瓷株式会社 | 布线基板、电子装置以及电子模块 |
| KR20250146094A (ko) * | 2024-03-29 | 2025-10-13 | 엘지이노텍 주식회사 | 회로 기판 및 이를 포함하는 반도체 패키지 |
| TWI869312B (zh) * | 2024-07-09 | 2025-01-01 | 頎邦科技股份有限公司 | 具有微凸塊之基板構造及其製造方法 |
| CN118737976B (zh) * | 2024-09-03 | 2025-01-10 | 安徽长飞先进半导体股份有限公司 | 半导体器件及制备方法、功率模块、功率转换电路和车辆 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4397399B2 (ja) * | 2007-02-15 | 2010-01-13 | 富士通株式会社 | 半導体装置の製造方法 |
| US20100103634A1 (en) * | 2007-03-30 | 2010-04-29 | Takuo Funaya | Functional-device-embedded circuit board, method for manufacturing the same, and electronic equipment |
| KR20100060968A (ko) | 2008-11-28 | 2010-06-07 | 삼성전기주식회사 | 메탈 포스트를 구비한 기판 및 그 제조방법 |
| US8912649B2 (en) * | 2011-08-17 | 2014-12-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dummy flip chip bumps for reducing stress |
| JP2013093405A (ja) * | 2011-10-25 | 2013-05-16 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
| US9673132B2 (en) * | 2012-04-27 | 2017-06-06 | Taiwan Semiconductor Manufacting Company, Ltd. | Interconnection structure with confinement layer |
| US8975531B2 (en) * | 2013-01-22 | 2015-03-10 | International Business Machines Corporation | Composite copper wire interconnect structures and methods of forming |
| JP6169955B2 (ja) | 2013-04-17 | 2017-07-26 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP2015018932A (ja) * | 2013-07-11 | 2015-01-29 | 日本特殊陶業株式会社 | 配線基板 |
| US9331038B2 (en) * | 2013-08-29 | 2016-05-03 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor interconnect structure |
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2015
- 2015-10-09 JP JP2015201143A patent/JP6530298B2/ja active Active
-
2016
- 2016-10-04 US US15/284,592 patent/US9997450B2/en active Active