JP2011211705A5 - - Google Patents

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Publication number
JP2011211705A5
JP2011211705A5 JP2011059371A JP2011059371A JP2011211705A5 JP 2011211705 A5 JP2011211705 A5 JP 2011211705A5 JP 2011059371 A JP2011059371 A JP 2011059371A JP 2011059371 A JP2011059371 A JP 2011059371A JP 2011211705 A5 JP2011211705 A5 JP 2011211705A5
Authority
JP
Japan
Prior art keywords
pcb substrate
transmitter
conductive layer
gold
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011059371A
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English (en)
Japanese (ja)
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JP2011211705A (ja
Filing date
Publication date
Priority claimed from US12/748,709 external-priority patent/US8169060B2/en
Application filed filed Critical
Publication of JP2011211705A publication Critical patent/JP2011211705A/ja
Publication of JP2011211705A5 publication Critical patent/JP2011211705A5/ja
Pending legal-status Critical Current

Links

JP2011059371A 2010-03-29 2011-03-17 導波管を含む集積回路パッケージアセンブリ Pending JP2011211705A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/748,709 2010-03-29
US12/748,709 US8169060B2 (en) 2010-03-29 2010-03-29 Integrated circuit package assembly including wave guide

Publications (2)

Publication Number Publication Date
JP2011211705A JP2011211705A (ja) 2011-10-20
JP2011211705A5 true JP2011211705A5 (enExample) 2011-12-01

Family

ID=44586205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011059371A Pending JP2011211705A (ja) 2010-03-29 2011-03-17 導波管を含む集積回路パッケージアセンブリ

Country Status (3)

Country Link
US (2) US8169060B2 (enExample)
JP (1) JP2011211705A (enExample)
DE (1) DE102011005767A1 (enExample)

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US9502382B2 (en) * 2011-09-26 2016-11-22 Regents Of The University Of Minnesota Coplaner waveguide transition
US9356352B2 (en) 2012-10-22 2016-05-31 Texas Instruments Incorporated Waveguide coupler
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US9472843B2 (en) 2013-02-01 2016-10-18 The Boeing Company Radio frequency grounding sheet for a phased array antenna
US9252077B2 (en) * 2013-09-25 2016-02-02 Intel Corporation Package vias for radio frequency antenna connections
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JP2015149650A (ja) * 2014-02-07 2015-08-20 株式会社東芝 ミリ波帯用半導体パッケージおよびミリ波帯用半導体装置
US9488719B2 (en) 2014-05-30 2016-11-08 Toyota Motor Engineering & Manufacturing North America, Inc. Automotive radar sub-system packaging for robustness
US9917372B2 (en) 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
US9620841B2 (en) 2014-06-13 2017-04-11 Nxp Usa, Inc. Radio frequency coupling structure
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US9887449B2 (en) 2014-08-29 2018-02-06 Nxp Usa, Inc. Radio frequency coupling structure and a method of manufacturing thereof
US10225925B2 (en) 2014-08-29 2019-03-05 Nxp Usa, Inc. Radio frequency coupling and transition structure
US9444135B2 (en) 2014-09-19 2016-09-13 Freescale Semiconductor, Inc. Integrated circuit package
US9564671B2 (en) * 2014-12-28 2017-02-07 International Business Machines Corporation Direct chip to waveguide transition including ring shaped antennas disposed in a thinned periphery of the chip
US10094788B2 (en) * 2015-12-21 2018-10-09 Applied Materials, Inc. Surface acoustic wave sensors in semiconductor processing equipment
US10720689B2 (en) * 2017-11-20 2020-07-21 Keyssa Systems, Inc. Launch assembly for coupling EM signals between a CCU and a waveguide, where the CCU is enclosed by a cover region including transition and waveguide interface regions therein for coupling to the waveguide
US10530038B2 (en) * 2018-03-06 2020-01-07 Advanced Semiconductor Engineering, Inc. Semiconductor package device
US11294028B2 (en) * 2019-01-29 2022-04-05 Magna Electronics Inc. Sensing system with enhanced electrical contact at PCB-waveguide interface
US11196146B2 (en) * 2019-05-14 2021-12-07 Texas Instruments Incorporated Grounded BGA wave-guiding interface between an on-package signal launch and an external waveguide
KR102740759B1 (ko) 2019-10-23 2024-12-12 삼성전자주식회사 반도체 패키지
US11557491B2 (en) 2019-10-31 2023-01-17 Nxp B.V. Selective underfill assembly and method therefor
CN112888143B (zh) * 2019-11-29 2025-06-20 广州方邦电子股份有限公司 线路板
US11522268B2 (en) 2020-01-09 2022-12-06 Texas Instruments Incorporated Wireless device with substrate to antenna coupling
CN112713377B (zh) * 2020-12-23 2022-04-01 中国电子科技集团公司第十三研究所 W波段表贴气密微波封装集成结构
US11963291B2 (en) 2022-04-21 2024-04-16 Nxp B.V. Efficient wave guide transition between package and PCB using solder wall
US12381164B2 (en) 2022-06-08 2025-08-05 Nxp Usa, Inc. Semiconductor device with enclosed cavity and method therefor
US20230417904A1 (en) * 2022-06-28 2023-12-28 Veoneer Us, Llc Integrated circuit to waveguide transitional structures and related sensor assemblies
US11843178B1 (en) 2023-05-23 2023-12-12 Micro-Ant, LLC Compact unit cell PCB antenna system with waveguide coupling

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