JP4684730B2 - 高周波半導体装置、送信装置および受信装置 - Google Patents
高周波半導体装置、送信装置および受信装置 Download PDFInfo
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- JP4684730B2 JP4684730B2 JP2005126932A JP2005126932A JP4684730B2 JP 4684730 B2 JP4684730 B2 JP 4684730B2 JP 2005126932 A JP2005126932 A JP 2005126932A JP 2005126932 A JP2005126932 A JP 2005126932A JP 4684730 B2 JP4684730 B2 JP 4684730B2
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Description
高周波半導体素子から、誘電体基板を経て回路基板にいたる伝熱経路が形成され、
誘電体基板の前記回路基板に臨む一表面部には、平面アンテナが設けられ、
前記回路基板には、前記平面アンテナを開放するように貫通孔が形成され、
前記伝熱経路は、誘電体基板の前記一表面部に設けられ、前記貫通孔を囲繞するように配設されるグランド層を含むことを特徴とする高周波半導体装置である。
また本発明は、前記高周波半導体装置を備えることを特徴とする受信装置である。
本発明に従えば、受信装置は、放熱効果の高い高周波半導体装置を備えているので、放熱対策としての放熱部品を省略し得る。
また誘電体基板の回路基板に臨む一表面部には、平面アンテナが設けられ、回路基板には、平面アンテナを開放するように貫通孔が形成されており、伝熱経路は、誘電体基板の該一表面部に設けられ、かつ貫通孔を囲繞するように配設されるグランド層を含んでいる。したがって、効率よく熱伝導が行われるとともに、誘電体基板と回路基板との接続において、誘電体基板と回路基板とが広い面積で接続されることによって、強い機械的強度が得られる。
21 高周波半導体素子
22 誘電体基板
23 回路基板
27 接地用ビアホール
28 第1のグランド層
30 第1のビアホール
31 第1の補助グランド層
32 第2のグランド層
33 第2のビアホール
34 第3のグランド層
35 接着材層
36 平面アンテナ
49 外部筐体
50 送信装置
51 受信装置
66 第1のミリ波パッケージ
67 第2のミリ波パッケージ
Claims (5)
- 高周波半導体素子と、該高周波半導体素子が搭載される誘電体基板と、回路基板とを少なくとも備え、前記誘電体基板を回路基板に実装して成る高周波半導体装置であって、
高周波半導体素子から、誘電体基板を経て回路基板にいたる伝熱経路が形成され、
誘電体基板の前記回路基板に臨む一表面部には、平面アンテナが設けられ、
前記回路基板には、前記平面アンテナを開放するように貫通孔が形成され、
前記伝熱経路は、誘電体基板の前記一表面部に設けられ、前記貫通孔を囲繞するように配設されるグランド層を含むことを特徴とする高周波半導体装置。 - 前記伝熱経路は、誘電体基板および回路基板にそれぞれ設けられるグランド層を含むことを特徴とする請求項1に記載の高周波半導体装置。
- 前記伝熱経路は、誘電体基板に設けられるグランド層と、回路基板に設けられるグランド層との間に設けられる導電性材料から成る層を含むことを特徴とする請求項2に記載の高周波半導体装置。
- 請求項1記載の高周波半導体装置を備えることを特徴とする送信装置。
- 請求項1記載の高周波半導体装置を備えることを特徴とする受信装置。
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