DE102011005767A1 - Integrierte-Schaltung-Gehäuseanordnung, die einen Wellenleiter umfasst - Google Patents

Integrierte-Schaltung-Gehäuseanordnung, die einen Wellenleiter umfasst Download PDF

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Publication number
DE102011005767A1
DE102011005767A1 DE102011005767A DE102011005767A DE102011005767A1 DE 102011005767 A1 DE102011005767 A1 DE 102011005767A1 DE 102011005767 A DE102011005767 A DE 102011005767A DE 102011005767 A DE102011005767 A DE 102011005767A DE 102011005767 A1 DE102011005767 A1 DE 102011005767A1
Authority
DE
Germany
Prior art keywords
aperture
antenna
package
conductive layer
waveguide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102011005767A
Other languages
German (de)
English (en)
Inventor
Thomas Wickgruber
Alexander Reisenzahn
Linus Maurer
Markus Treml
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of DE102011005767A1 publication Critical patent/DE102011005767A1/de
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/06—Waveguide mouths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1903—Structure including wave guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Waveguides (AREA)
  • Transceivers (AREA)
DE102011005767A 2010-03-29 2011-03-18 Integrierte-Schaltung-Gehäuseanordnung, die einen Wellenleiter umfasst Ceased DE102011005767A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/748,709 2010-03-29
US12/748,709 US8169060B2 (en) 2010-03-29 2010-03-29 Integrated circuit package assembly including wave guide

Publications (1)

Publication Number Publication Date
DE102011005767A1 true DE102011005767A1 (de) 2011-09-29

Family

ID=44586205

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011005767A Ceased DE102011005767A1 (de) 2010-03-29 2011-03-18 Integrierte-Schaltung-Gehäuseanordnung, die einen Wellenleiter umfasst

Country Status (3)

Country Link
US (2) US8169060B2 (enExample)
JP (1) JP2011211705A (enExample)
DE (1) DE102011005767A1 (enExample)

Cited By (1)

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CN112888143A (zh) * 2019-11-29 2021-06-01 广州方邦电子股份有限公司 线路板

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US9356352B2 (en) 2012-10-22 2016-05-31 Texas Instruments Incorporated Waveguide coupler
US9202782B2 (en) 2013-01-07 2015-12-01 Intel Corporation Embedded package in PCB build up
US9472843B2 (en) 2013-02-01 2016-10-18 The Boeing Company Radio frequency grounding sheet for a phased array antenna
US9252077B2 (en) * 2013-09-25 2016-02-02 Intel Corporation Package vias for radio frequency antenna connections
JP2015149649A (ja) * 2014-02-07 2015-08-20 株式会社東芝 ミリ波帯用半導体パッケージおよびミリ波帯用半導体装置
JP2015149650A (ja) * 2014-02-07 2015-08-20 株式会社東芝 ミリ波帯用半導体パッケージおよびミリ波帯用半導体装置
US9488719B2 (en) 2014-05-30 2016-11-08 Toyota Motor Engineering & Manufacturing North America, Inc. Automotive radar sub-system packaging for robustness
US9917372B2 (en) 2014-06-13 2018-03-13 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling arrangement
US9620841B2 (en) 2014-06-13 2017-04-11 Nxp Usa, Inc. Radio frequency coupling structure
US10103447B2 (en) 2014-06-13 2018-10-16 Nxp Usa, Inc. Integrated circuit package with radio frequency coupling structure
US9887449B2 (en) 2014-08-29 2018-02-06 Nxp Usa, Inc. Radio frequency coupling structure and a method of manufacturing thereof
US10225925B2 (en) 2014-08-29 2019-03-05 Nxp Usa, Inc. Radio frequency coupling and transition structure
US9444135B2 (en) 2014-09-19 2016-09-13 Freescale Semiconductor, Inc. Integrated circuit package
US9564671B2 (en) * 2014-12-28 2017-02-07 International Business Machines Corporation Direct chip to waveguide transition including ring shaped antennas disposed in a thinned periphery of the chip
US10094788B2 (en) * 2015-12-21 2018-10-09 Applied Materials, Inc. Surface acoustic wave sensors in semiconductor processing equipment
US10720689B2 (en) * 2017-11-20 2020-07-21 Keyssa Systems, Inc. Launch assembly for coupling EM signals between a CCU and a waveguide, where the CCU is enclosed by a cover region including transition and waveguide interface regions therein for coupling to the waveguide
US10530038B2 (en) * 2018-03-06 2020-01-07 Advanced Semiconductor Engineering, Inc. Semiconductor package device
US11294028B2 (en) * 2019-01-29 2022-04-05 Magna Electronics Inc. Sensing system with enhanced electrical contact at PCB-waveguide interface
US11196146B2 (en) * 2019-05-14 2021-12-07 Texas Instruments Incorporated Grounded BGA wave-guiding interface between an on-package signal launch and an external waveguide
KR102740759B1 (ko) 2019-10-23 2024-12-12 삼성전자주식회사 반도체 패키지
US11557491B2 (en) 2019-10-31 2023-01-17 Nxp B.V. Selective underfill assembly and method therefor
US11522268B2 (en) 2020-01-09 2022-12-06 Texas Instruments Incorporated Wireless device with substrate to antenna coupling
CN112713377B (zh) * 2020-12-23 2022-04-01 中国电子科技集团公司第十三研究所 W波段表贴气密微波封装集成结构
US11963291B2 (en) 2022-04-21 2024-04-16 Nxp B.V. Efficient wave guide transition between package and PCB using solder wall
US12381164B2 (en) 2022-06-08 2025-08-05 Nxp Usa, Inc. Semiconductor device with enclosed cavity and method therefor
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Also Published As

Publication number Publication date
US9048248B2 (en) 2015-06-02
US20110234472A1 (en) 2011-09-29
JP2011211705A (ja) 2011-10-20
US20120187511A1 (en) 2012-07-26
US8169060B2 (en) 2012-05-01

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