JP2011211705A5 - - Google Patents

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Publication number
JP2011211705A5
JP2011211705A5 JP2011059371A JP2011059371A JP2011211705A5 JP 2011211705 A5 JP2011211705 A5 JP 2011211705A5 JP 2011059371 A JP2011059371 A JP 2011059371A JP 2011059371 A JP2011059371 A JP 2011059371A JP 2011211705 A5 JP2011211705 A5 JP 2011211705A5
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JP
Japan
Prior art keywords
pcb substrate
transmitter
conductive layer
gold
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011059371A
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English (en)
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JP2011211705A (ja
Filing date
Publication date
Priority claimed from US12/748,709 external-priority patent/US8169060B2/en
Application filed filed Critical
Publication of JP2011211705A publication Critical patent/JP2011211705A/ja
Publication of JP2011211705A5 publication Critical patent/JP2011211705A5/ja
Pending legal-status Critical Current

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Claims (3)

  1. 前記導波管が、前記ＰＣＢ基板に完全に入れられた導電層を含む、請求項１または２に記載の送信機。
  2. 前記ＰＣＢ基板が、それを通過する開口部を有し、前記開口部が、前記ＰＣＢ基板において内向き側壁を画定する、請求項１または２に記載の送信機。
  3. 前記導電層が、金、銅またはアルミニウムの少なくとも１つを含む、請求項３または５に記載の送信機。
JP2011059371A 2010-03-29 2011-03-17 導波管を含む集積回路パッケージアセンブリ Pending JP2011211705A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/748,709 US8169060B2 (en) 2010-03-29 2010-03-29 Integrated circuit package assembly including wave guide
US12/748,709 2010-03-29

Publications (2)

Publication Number Publication Date
JP2011211705A JP2011211705A (ja) 2011-10-20
JP2011211705A5 true JP2011211705A5 (ja) 2011-12-01

Family

ID=44586205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011059371A Pending JP2011211705A (ja) 2010-03-29 2011-03-17 導波管を含む集積回路パッケージアセンブリ

Country Status (3)

Country Link
US (2) US8169060B2 (ja)
JP (1) JP2011211705A (ja)
DE (1) DE102011005767A1 (ja)

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JP2015149650A (ja) * 2014-02-07 2015-08-20 株式会社東芝 ミリ波帯用半導体パッケージおよびミリ波帯用半導体装置
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