JP5062533B2 - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

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Publication number
JP5062533B2
JP5062533B2 JP2008199401A JP2008199401A JP5062533B2 JP 5062533 B2 JP5062533 B2 JP 5062533B2 JP 2008199401 A JP2008199401 A JP 2008199401A JP 2008199401 A JP2008199401 A JP 2008199401A JP 5062533 B2 JP5062533 B2 JP 5062533B2
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layer
conductor layer
wiring
forming
groove
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JP2008199401A
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Japanese (ja)
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JP2010040625A (ja
JP2010040625A5 (enExample
Inventor
圭吾 佐藤
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2008199401A priority Critical patent/JP5062533B2/ja
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Publication of JP2010040625A5 publication Critical patent/JP2010040625A5/ja
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2008199401A 2008-08-01 2008-08-01 配線基板の製造方法 Active JP5062533B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008199401A JP5062533B2 (ja) 2008-08-01 2008-08-01 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008199401A JP5062533B2 (ja) 2008-08-01 2008-08-01 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2010040625A JP2010040625A (ja) 2010-02-18
JP2010040625A5 JP2010040625A5 (enExample) 2011-08-04
JP5062533B2 true JP5062533B2 (ja) 2012-10-31

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ID=42012887

Family Applications (1)

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JP2008199401A Active JP5062533B2 (ja) 2008-08-01 2008-08-01 配線基板の製造方法

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JP (1) JP5062533B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021132389A1 (ja) * 2019-12-25 2021-07-01 富士フイルム株式会社 導電性基板の製造方法、導電性基板、タッチセンサー、アンテナ、電磁波シールド材料
JP2023010236A (ja) 2021-07-09 2023-01-20 イビデン株式会社 配線基板及び配線基板の製造方法
TWI869647B (zh) * 2022-01-13 2025-01-11 大陸商芯愛科技（南京）有限公司 線路結構之製法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3805225B2 (ja) * 2001-10-01 2006-08-02 株式会社トクヤマ 配線基板の製造方法及びそれに用いるウエット処理システム
JP2003273510A (ja) * 2002-03-12 2003-09-26 Hitachi Kokusai Electric Inc プリント基板の製造方法
JP2005057077A (ja) * 2003-08-05 2005-03-03 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP4079927B2 (ja) * 2004-09-16 2008-04-23 Ｔｄｋ株式会社 多層基板及びその製造方法
JP4694349B2 (ja) * 2005-11-07 2011-06-08 日立ビアメカニクス株式会社 レーザ加工を用いたプリント配線板及びその製造方法
JP2008166736A (ja) * 2006-12-06 2008-07-17 Hitachi Via Mechanics Ltd プリント基板の製造方法およびプリント基板加工機

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Publication number Publication date
JP2010040625A (ja) 2010-02-18

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