JP2007150275A5 - - Google Patents

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Publication number
JP2007150275A5
JP2007150275A5 JP2006291272A JP2006291272A JP2007150275A5 JP 2007150275 A5 JP2007150275 A5 JP 2007150275A5 JP 2006291272 A JP2006291272 A JP 2006291272A JP 2006291272 A JP2006291272 A JP 2006291272A JP 2007150275 A5 JP2007150275 A5 JP 2007150275A5
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JP
Japan
Prior art keywords
semiconductor
connection wiring
wiring pattern
semiconductor element
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006291272A
Other languages
English (en)
Japanese (ja)
Other versions
JP5164362B2 (ja
JP2007150275A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006291272A priority Critical patent/JP5164362B2/ja
Priority claimed from JP2006291272A external-priority patent/JP5164362B2/ja
Priority to US11/555,760 priority patent/US20070108610A1/en
Publication of JP2007150275A publication Critical patent/JP2007150275A/ja
Publication of JP2007150275A5 publication Critical patent/JP2007150275A5/ja
Priority to US13/748,657 priority patent/US8609539B2/en
Application granted granted Critical
Publication of JP5164362B2 publication Critical patent/JP5164362B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006291272A 2005-11-02 2006-10-26 半導体内臓基板およびその製造方法 Expired - Fee Related JP5164362B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006291272A JP5164362B2 (ja) 2005-11-02 2006-10-26 半導体内臓基板およびその製造方法
US11/555,760 US20070108610A1 (en) 2005-11-02 2006-11-02 Embedded semiconductor device substrate and production method thereof
US13/748,657 US8609539B2 (en) 2005-11-02 2013-01-24 Embedded semiconductor device substrate and production method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005318962 2005-11-02
JP2005318962 2005-11-02
JP2006291272A JP5164362B2 (ja) 2005-11-02 2006-10-26 半導体内臓基板およびその製造方法

Publications (3)

Publication Number Publication Date
JP2007150275A JP2007150275A (ja) 2007-06-14
JP2007150275A5 true JP2007150275A5 (enExample) 2009-12-10
JP5164362B2 JP5164362B2 (ja) 2013-03-21

Family

ID=38039917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006291272A Expired - Fee Related JP5164362B2 (ja) 2005-11-02 2006-10-26 半導体内臓基板およびその製造方法

Country Status (2)

Country Link
US (2) US20070108610A1 (enExample)
JP (1) JP5164362B2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100856209B1 (ko) * 2007-05-04 2008-09-03 삼성전자주식회사 집적회로가 내장된 인쇄회로기판 및 그 제조방법
FR2917234B1 (fr) * 2007-06-07 2009-11-06 Commissariat Energie Atomique Dispositif multi composants integres dans une matrice semi-conductrice.
KR101113889B1 (ko) 2007-12-04 2012-02-29 삼성테크윈 주식회사 전자 소자를 내장하는 회로기판 및 회로기판의 제조 방법
US8017451B2 (en) * 2008-04-04 2011-09-13 The Charles Stark Draper Laboratory, Inc. Electronic modules and methods for forming the same
US8273603B2 (en) * 2008-04-04 2012-09-25 The Charles Stark Draper Laboratory, Inc. Interposers, electronic modules, and methods for forming the same
AT10247U8 (de) * 2008-05-30 2008-12-15 Austria Tech & System Tech Verfahren zur integration wenigstens eines elektronischen bauteils in eine leiterplatte sowie leiterplatte
FR2934082B1 (fr) * 2008-07-21 2011-05-27 Commissariat Energie Atomique Dispositif multi composants integres dans une matrice
KR101055471B1 (ko) * 2008-09-29 2011-08-08 삼성전기주식회사 전자소자 내장형 인쇄회로기판 및 그 제조방법
JP5467589B2 (ja) * 2009-01-05 2014-04-09 セイコーインスツル株式会社 電子回路部品および電子機器
FR2947948B1 (fr) * 2009-07-09 2012-03-09 Commissariat Energie Atomique Plaquette poignee presentant des fenetres de visualisation
JP5582597B2 (ja) * 2009-09-30 2014-09-03 セイコーインスツル株式会社 電子回路部品および電子機器
DE102009058764A1 (de) * 2009-12-15 2011-06-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe
US8435837B2 (en) * 2009-12-15 2013-05-07 Silicon Storage Technology, Inc. Panel based lead frame packaging method and device
US8836094B1 (en) * 2013-03-14 2014-09-16 Taiwan Semiconductor Manufacturing Company, Ltd. Package device including an opening in a flexible substrate and methods of forming the same
US9663357B2 (en) * 2015-07-15 2017-05-30 Texas Instruments Incorporated Open cavity package using chip-embedding technology
JP6693441B2 (ja) * 2017-02-27 2020-05-13 オムロン株式会社 電子装置およびその製造方法
DE102019103281B4 (de) * 2019-02-11 2023-03-16 Infineon Technologies Ag Verfahren zum bilden eines die-gehäuses

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131863U (enExample) * 1973-03-10 1974-11-13
JPS60252992A (ja) * 1984-05-30 1985-12-13 Toshiba Corp Ｉｃカ−ド
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
JP2772157B2 (ja) * 1991-05-28 1998-07-02 三菱重工業株式会社 半導体装置の配線方法
US5548091A (en) * 1993-10-26 1996-08-20 Tessera, Inc. Semiconductor chip connection components with adhesives and methods for bonding to the chip
JPH07153867A (ja) * 1993-11-30 1995-06-16 Hitachi Ltd 半導体装置およびその製造方法
US5886877A (en) * 1995-10-13 1999-03-23 Meiko Electronics Co., Ltd. Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
JP2842378B2 (ja) 1996-05-31 1999-01-06 日本電気株式会社 電子回路基板の高密度実装構造
DE60128656T2 (de) * 2000-02-25 2007-10-04 Ibiden Co., Ltd., Ogaki Mehrschichtige leiterplatte und verfahren zu ihrer herstellung
JP2001291797A (ja) * 2000-04-10 2001-10-19 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
KR101093471B1 (ko) * 2000-09-25 2011-12-13 이비덴 가부시키가이샤 반도체소자,반도체소자의 제조방법,다층프린트배선판 및 다층프린트배선판의 제조방법
JP3634735B2 (ja) * 2000-10-05 2005-03-30 三洋電機株式会社 半導体装置および半導体モジュール
DE10213296B9 (de) * 2002-03-25 2007-04-19 Infineon Technologies Ag Elektronisches Bauteil mit einem Halbleiterchip, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Nutzens
JP2004152982A (ja) * 2002-10-30 2004-05-27 Matsushita Electric Ind Co Ltd 電子部品実装済部品の製造方法、及び該電子部品実装済部品を備えた電子部品実装済完成品の製造方法、並びに電子部品実装済完成品
JP3920195B2 (ja) * 2002-11-11 2007-05-30 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP4209178B2 (ja) * 2002-11-26 2009-01-14 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP4489411B2 (ja) * 2003-01-23 2010-06-23 新光電気工業株式会社 電子部品実装構造の製造方法
JP4137659B2 (ja) 2003-02-13 2008-08-20 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP4200285B2 (ja) * 2003-04-02 2008-12-24 パナソニック株式会社 回路基板の製造方法
JP2004335641A (ja) 2003-05-06 2004-11-25 Canon Inc 半導体素子内蔵基板の製造方法
JP4298559B2 (ja) * 2004-03-29 2009-07-22 新光電気工業株式会社 電子部品実装構造及びその製造方法
JP4361826B2 (ja) * 2004-04-20 2009-11-11 新光電気工業株式会社 半導体装置
TW200539246A (en) * 2004-05-26 2005-12-01 Matsushita Electric Industrial Co Ltd Semiconductor device and method for manufacturing the same
JP4398305B2 (ja) * 2004-06-02 2010-01-13 カシオ計算機株式会社 半導体装置およびその製造方法
JP2006019441A (ja) * 2004-06-30 2006-01-19 Shinko Electric Ind Co Ltd 電子部品内蔵基板の製造方法
JP4575071B2 (ja) * 2004-08-02 2010-11-04 新光電気工業株式会社 電子部品内蔵基板の製造方法
JP2006059992A (ja) * 2004-08-19 2006-03-02 Shinko Electric Ind Co Ltd 電子部品内蔵基板の製造方法
JP2006165252A (ja) * 2004-12-07 2006-06-22 Shinko Electric Ind Co Ltd チップ内蔵基板の製造方法
TWI260056B (en) * 2005-02-01 2006-08-11 Phoenix Prec Technology Corp Module structure having an embedded chip
JP2006332094A (ja) * 2005-05-23 2006-12-07 Seiko Epson Corp 電子基板の製造方法及び半導体装置の製造方法並びに電子機器の製造方法

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