JP5164362B2 - 半導体内臓基板およびその製造方法 - Google Patents

半導体内臓基板およびその製造方法 Download PDF

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Publication number
JP5164362B2
JP5164362B2 JP2006291272A JP2006291272A JP5164362B2 JP 5164362 B2 JP5164362 B2 JP 5164362B2 JP 2006291272 A JP2006291272 A JP 2006291272A JP 2006291272 A JP2006291272 A JP 2006291272A JP 5164362 B2 JP5164362 B2 JP 5164362B2
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Prior art keywords
semiconductor element
semiconductor
layer
wiring pattern
connection wiring
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JP2006291272A
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Japanese (ja)
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JP2007150275A5 (enExample
JP2007150275A (ja
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浩史 近藤
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Canon Inc
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Canon Inc
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Priority to JP2006291272A priority Critical patent/JP5164362B2/ja
Priority to US11/555,760 priority patent/US20070108610A1/en
Publication of JP2007150275A publication Critical patent/JP2007150275A/ja
Publication of JP2007150275A5 publication Critical patent/JP2007150275A5/ja
Priority to US13/748,657 priority patent/US8609539B2/en
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Publication of JP5164362B2 publication Critical patent/JP5164362B2/ja
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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