JP2007019267A5 - - Google Patents

Download PDF

Info

Publication number
JP2007019267A5
JP2007019267A5 JP2005199151A JP2005199151A JP2007019267A5 JP 2007019267 A5 JP2007019267 A5 JP 2007019267A5 JP 2005199151 A JP2005199151 A JP 2005199151A JP 2005199151 A JP2005199151 A JP 2005199151A JP 2007019267 A5 JP2007019267 A5 JP 2007019267A5
Authority
JP
Japan
Prior art keywords
substrate
wiring board
fiducial mark
board according
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005199151A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007019267A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005199151A priority Critical patent/JP2007019267A/ja
Priority claimed from JP2005199151A external-priority patent/JP2007019267A/ja
Publication of JP2007019267A publication Critical patent/JP2007019267A/ja
Publication of JP2007019267A5 publication Critical patent/JP2007019267A5/ja
Pending legal-status Critical Current

Links

JP2005199151A 2005-07-07 2005-07-07 配線基板、およびこの配線基板を備えた電子機器 Pending JP2007019267A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005199151A JP2007019267A (ja) 2005-07-07 2005-07-07 配線基板、およびこの配線基板を備えた電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005199151A JP2007019267A (ja) 2005-07-07 2005-07-07 配線基板、およびこの配線基板を備えた電子機器

Publications (2)

Publication Number Publication Date
JP2007019267A JP2007019267A (ja) 2007-01-25
JP2007019267A5 true JP2007019267A5 (enExample) 2008-07-03

Family

ID=37756149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005199151A Pending JP2007019267A (ja) 2005-07-07 2005-07-07 配線基板、およびこの配線基板を備えた電子機器

Country Status (1)

Country Link
JP (1) JP2007019267A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5032870B2 (ja) * 2007-03-27 2012-09-26 パナソニック株式会社 凹凸回路基板の製造方法
US7935893B2 (en) 2008-02-14 2011-05-03 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
US8024858B2 (en) 2008-02-14 2011-09-27 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
JP2009218545A (ja) 2008-03-12 2009-09-24 Ibiden Co Ltd 多層プリント配線板及びその製造方法
JP2009231818A (ja) 2008-03-21 2009-10-08 Ibiden Co Ltd 多層プリント配線板及びその製造方法
JP2009239247A (ja) * 2008-03-27 2009-10-15 Ibiden Co Ltd 多層プリント配線板の製造方法
JPWO2009147936A1 (ja) 2008-06-02 2011-10-27 イビデン株式会社 多層プリント配線板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3482826B2 (ja) * 1997-08-01 2004-01-06 セイコーエプソン株式会社 Ｉｃ実装方法、液晶表示装置および電子機器並びに液晶表示装置の製造装置
JP4854846B2 (ja) * 2000-02-25 2012-01-18 イビデン株式会社 多層プリント配線板の製造方法
JP3870018B2 (ja) * 2000-10-12 2007-01-17 日本アビオニクス株式会社 多層プリント配線板およびその製造方法
JP4392157B2 (ja) * 2001-10-26 2009-12-24 パナソニック電工株式会社 配線板用シート材及びその製造方法、並びに多層板及びその製造方法
JP4137451B2 (ja) * 2002-01-15 2008-08-20 ソニー株式会社 多層基板製造方法
JP2004343021A (ja) * 2003-03-17 2004-12-02 Matsushita Electric Ind Co Ltd 部品内蔵モジュールの製造方法及び製造装置
JP2004296562A (ja) * 2003-03-26 2004-10-21 Sharp Corp 電子部品内蔵基板及びその製造方法
FI20031201A7 (fi) * 2003-08-26 2005-02-27 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli

Similar Documents

Publication Publication Date Title
WO2007050114A3 (en) A substantially continuous layer of embedded transient protection for printed circuit boards
TW200733841A (en) Multilayer printed wiring board for semiconductor device and process for producing the same
WO2008157143A3 (en) Edge connection structure for printed circuit boards
WO2008099784A1 (ja) Ｌｅｄパッケージおよび立体回路部品の取付構造
WO2006134216A3 (en) Circuit board structure and method for manufacturing a circuit board structure
JP2011515862A5 (enExample)
EP1478023A4 (en) MODULE PART
JP2007129124A5 (enExample)
ATE502399T1 (de) Schaltungsvorrichtung mit gebondetem smd-bauteil
TW200644202A (en) Method of manufacturing flexible circuit substrate
TW200742518A (en) Flexible printed circuit board and method for manufacturing the same
WO2006110634A3 (en) Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
JP2006517348A5 (enExample)
JP2007019267A5 (enExample)
JP2009505442A5 (enExample)
TW200629998A (en) Printed circuit board and forming method thereof
WO2009054105A1 (ja) 部品内蔵プリント配線基板およびその製造方法
TW200611620A (en) A manufacturing method of a multi-layer circuit board with embedded passive components
EP1722616A3 (en) Technique for defining a wettable solder joint area for an electronic assembly substrate
CN102762034B (zh) 线路板制造方法及基层线路板
TW200631482A (en) Rigid flexible printed circuit board and method of fabricating same
JP2009117501A5 (enExample)
JP2007149810A5 (enExample)
JP2005317912A5 (enExample)
TW200735310A (en) Package structure for electronic device