JP2007129124A5 - - Google Patents

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Publication number
JP2007129124A5
JP2007129124A5 JP2005321954A JP2005321954A JP2007129124A5 JP 2007129124 A5 JP2007129124 A5 JP 2007129124A5 JP 2005321954 A JP2005321954 A JP 2005321954A JP 2005321954 A JP2005321954 A JP 2005321954A JP 2007129124 A5 JP2007129124 A5 JP 2007129124A5
Authority
JP
Japan
Prior art keywords
layer
paste
multilayer printed
wiring board
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005321954A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007129124A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005321954A priority Critical patent/JP2007129124A/ja
Priority claimed from JP2005321954A external-priority patent/JP2007129124A/ja
Priority to TW095140739A priority patent/TWI392410B/zh
Priority to KR1020077026340A priority patent/KR100962837B1/ko
Priority to PCT/JP2006/322126 priority patent/WO2007052799A1/ja
Priority to EP06823039A priority patent/EP1811824B1/en
Priority to DE602006011710T priority patent/DE602006011710D1/de
Priority to CN200680001333XA priority patent/CN101069459B/zh
Priority to US11/577,957 priority patent/US20090229862A1/en
Publication of JP2007129124A publication Critical patent/JP2007129124A/ja
Publication of JP2007129124A5 publication Critical patent/JP2007129124A5/ja
Pending legal-status Critical Current

Links

JP2005321954A 2005-11-07 2005-11-07 多層プリント配線基板及びその製造方法 Pending JP2007129124A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2005321954A JP2007129124A (ja) 2005-11-07 2005-11-07 多層プリント配線基板及びその製造方法
TW095140739A TWI392410B (zh) 2005-11-07 2006-11-03 Multilayer printed wiring board and manufacturing method thereof
US11/577,957 US20090229862A1 (en) 2005-11-07 2006-11-07 Multilayer printed wiring board and method of manufacturing the same
EP06823039A EP1811824B1 (en) 2005-11-07 2006-11-07 Multilayer printed wiring board and process for producing the same
PCT/JP2006/322126 WO2007052799A1 (ja) 2005-11-07 2006-11-07 多層プリント配線基板及びその製造方法
KR1020077026340A KR100962837B1 (ko) 2005-11-07 2006-11-07 다층 프린트 배선 기판 및 그 제조 방법
DE602006011710T DE602006011710D1 (de) 2005-11-07 2006-11-07 Mehrschichtige leiterplatte und herstellungsverfahren dafür
CN200680001333XA CN101069459B (zh) 2005-11-07 2006-11-07 多层印刷线路基板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005321954A JP2007129124A (ja) 2005-11-07 2005-11-07 多層プリント配線基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2007129124A JP2007129124A (ja) 2007-05-24
JP2007129124A5 true JP2007129124A5 (enExample) 2008-11-27

Family

ID=38005950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005321954A Pending JP2007129124A (ja) 2005-11-07 2005-11-07 多層プリント配線基板及びその製造方法

Country Status (8)

Country Link
US (1) US20090229862A1 (enExample)
EP (1) EP1811824B1 (enExample)
JP (1) JP2007129124A (enExample)
KR (1) KR100962837B1 (enExample)
CN (1) CN101069459B (enExample)
DE (1) DE602006011710D1 (enExample)
TW (1) TWI392410B (enExample)
WO (1) WO2007052799A1 (enExample)

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US8933556B2 (en) * 2010-01-22 2015-01-13 Ibiden Co., Ltd. Wiring board
CN102939803A (zh) * 2010-06-08 2013-02-20 松下电器产业株式会社 多层布线基板以及多层布线基板的制造方法
JP5581828B2 (ja) * 2010-06-09 2014-09-03 富士通株式会社 積層回路基板および基板製造方法
CN102378489B (zh) * 2010-08-24 2013-11-20 欣兴电子股份有限公司 软硬线路板的制造方法
WO2013031822A1 (ja) * 2011-08-29 2013-03-07 京セラ株式会社 薄膜配線基板およびプローブカード用基板
CN103037637A (zh) * 2011-09-30 2013-04-10 富葵精密组件(深圳)有限公司 多层电路板及多层电路板的制作方法
CN103037636A (zh) * 2011-09-30 2013-04-10 富葵精密组件(深圳)有限公司 多层电路板及多层电路板的制作方法
US9532466B2 (en) 2011-12-22 2016-12-27 Haesung Ds Co., Ltd. Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the method
CN103369872A (zh) * 2012-03-30 2013-10-23 北大方正集团有限公司 多层印刷电路板的压合方法
JP5196056B1 (ja) * 2012-06-14 2013-05-15 パナソニック株式会社 複合多層配線基板とその製造方法
WO2013186966A1 (ja) * 2012-06-14 2013-12-19 パナソニック株式会社 複合多層配線基板とその製造方法
CN103517583B (zh) * 2012-06-27 2016-09-28 富葵精密组件(深圳)有限公司 多层电路板及其制作方法
US9545017B2 (en) * 2013-02-15 2017-01-10 Ormet Circuits, Inc. Structures for z-axis interconnection of multilayer electronic substrates
CN103258806B (zh) * 2013-05-08 2016-01-27 日月光半导体制造股份有限公司 具桥接结构的半导体封装构造及其制造方法
CN104902675B (zh) * 2014-03-05 2018-08-07 深南电路有限公司 一种台阶槽电路板及其加工方法
JP2016115823A (ja) * 2014-12-16 2016-06-23 イビデン株式会社 プリント配線板
US11259398B2 (en) * 2017-03-31 2022-02-22 Magna Seating Inc. Electrical circuit board with low thermal conductivity and method of constructing thereof
US12262482B2 (en) 2019-05-07 2025-03-25 AT&SAustria Technologie&Systemtechnik Aktiengesellschaft Method of manufacturing component carrier and component carrier intermediate product
EP3736852A1 (en) 2019-05-07 2020-11-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Aligning component carrier structure with known-good sections and critical section with other component carrier with components and dummies
JP7031955B2 (ja) * 2019-09-10 2022-03-08 Ｆｉｃｔ株式会社 回路基板の製造方法
TWI741891B (zh) * 2020-08-28 2021-10-01 欣興電子股份有限公司 電路板結構及其製作方法
CN112856265A (zh) * 2021-02-04 2021-05-28 广东大唐永恒智能科技有限公司 一种双面柔性导线板及柔性导线拼板
CN115602688A (zh) * 2021-07-09 2023-01-13 欣兴电子股份有限公司（Tw） 异质基板结构及其制作方法
US20240178124A1 (en) * 2022-11-30 2024-05-30 Compass Technology Company Limited Embedded Die Package
JP2024176264A (ja) 2023-06-08 2024-12-19 富士電機株式会社 水質分析装置

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US5282312A (en) * 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
JP3472299B2 (ja) * 1991-12-31 2003-12-02 テッセラ、インク． 多層回路ユニットの製造方法及びその構成要素
USRE43509E1 (en) * 1996-12-19 2012-07-17 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP3053790B2 (ja) * 1997-09-30 2000-06-19 松下電器産業株式会社 回路基板接続用部材、回路基板の製造方法および回路基板
US6565954B2 (en) * 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
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JP2002094200A (ja) * 2000-09-18 2002-03-29 Matsushita Electric Ind Co Ltd 回路基板用電気絶縁材と回路基板およびその製造方法
EP1194020A3 (en) * 2000-09-27 2004-03-31 Matsushita Electric Industrial Co., Ltd. Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
TW532050B (en) * 2000-11-09 2003-05-11 Matsushita Electric Industrial Co Ltd Circuit board and method for manufacturing the same
JP2002232135A (ja) * 2001-01-30 2002-08-16 Matsushita Electric Ind Co Ltd 積層用両面回路基板とその製造方法及びそれを用いた多層プリント配線板
US6593534B2 (en) * 2001-03-19 2003-07-15 International Business Machines Corporation Printed wiring board structure with z-axis interconnections
JP2002307608A (ja) * 2001-04-10 2002-10-23 Kanegafuchi Chem Ind Co Ltd 積層体の製造方法および多層プリント配線板
US6465084B1 (en) * 2001-04-12 2002-10-15 International Business Machines Corporation Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
US6756628B2 (en) * 2001-05-30 2004-06-29 Matsushita Electric Industrial Co., Ltd. Capacitor sheet with built in capacitors
JP2003017862A (ja) * 2001-07-02 2003-01-17 Nitto Denko Corp 多層配線基板の製造方法
WO2003009656A1 (fr) * 2001-07-18 2003-01-30 Matsushita Electric Industrial Co., Ltd. Substrat forme sur circuit et procede de fabrication d'un substrat forme sur circuit
JP2003163458A (ja) * 2001-11-29 2003-06-06 Fujitsu Ltd 多層配線基板及びその製造方法
US20040214006A1 (en) * 2003-04-25 2004-10-28 Matsushita Electric Industrial Co., Ltd. Member for a circuit board, method of manufacturing the same, and methods of manufacturing circuit boards
JP2005045150A (ja) * 2003-07-25 2005-02-17 Matsushita Electric Ind Co Ltd 中間接続用配線基材および多層配線基板、ならびにこれらの製造方法
KR100567087B1 (ko) * 2003-10-20 2006-03-31 삼성전기주식회사 층간 전기 접속이 향상된 병렬적 다층 인쇄회로기판 제조방법
JP3694708B2 (ja) * 2003-11-10 2005-09-14 大日本印刷株式会社 印刷配線板の製造方法および印刷配線板
TWI236324B (en) * 2004-04-08 2005-07-11 Phoenix Prec Technology Corp Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure
TWI233323B (en) * 2004-04-22 2005-05-21 Phoenix Prec Technology Corp Circuit board with identifiable information and method for fabricating the same
US20070088134A1 (en) * 2005-10-13 2007-04-19 Ajinomoto Co. Inc Thermosetting resin composition containing modified polyimide resin
TW200740334A (en) * 2005-10-20 2007-10-16 Matsushita Electric Industrial Co Ltd Multilayer printed wiring board and its manufacturing method

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