TWI392410B - Multilayer printed wiring board and manufacturing method thereof - Google Patents

Multilayer printed wiring board and manufacturing method thereof Download PDF

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Publication number
TWI392410B
TWI392410B TW095140739A TW95140739A TWI392410B TW I392410 B TWI392410 B TW I392410B TW 095140739 A TW095140739 A TW 095140739A TW 95140739 A TW95140739 A TW 95140739A TW I392410 B TWI392410 B TW I392410B
Authority
TW
Taiwan
Prior art keywords
layer
paste
film
wiring board
wiring
Prior art date
Application number
TW095140739A
Other languages
English (en)
Chinese (zh)
Inventor
中村禎志
越後文雄
平井昌吾
須川俊夫
Original Assignee
松下電器產業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器產業股份有限公司 filed Critical 松下電器產業股份有限公司
Application granted granted Critical
Publication of TWI392410B publication Critical patent/TWI392410B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4658—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095140739A 2005-11-07 2006-11-03 Multilayer printed wiring board and manufacturing method thereof TWI392410B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005321954A JP2007129124A (ja) 2005-11-07 2005-11-07 多層プリント配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
TWI392410B true TWI392410B (zh) 2013-04-01

Family

ID=38005950

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140739A TWI392410B (zh) 2005-11-07 2006-11-03 Multilayer printed wiring board and manufacturing method thereof

Country Status (8)

Country Link
US (1) US20090229862A1 (enExample)
EP (1) EP1811824B1 (enExample)
JP (1) JP2007129124A (enExample)
KR (1) KR100962837B1 (enExample)
CN (1) CN101069459B (enExample)
DE (1) DE602006011710D1 (enExample)
TW (1) TWI392410B (enExample)
WO (1) WO2007052799A1 (enExample)

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US8933556B2 (en) * 2010-01-22 2015-01-13 Ibiden Co., Ltd. Wiring board
CN102939803A (zh) * 2010-06-08 2013-02-20 松下电器产业株式会社 多层布线基板以及多层布线基板的制造方法
JP5581828B2 (ja) * 2010-06-09 2014-09-03 富士通株式会社 積層回路基板および基板製造方法
CN102378489B (zh) * 2010-08-24 2013-11-20 欣兴电子股份有限公司 软硬线路板的制造方法
WO2013031822A1 (ja) * 2011-08-29 2013-03-07 京セラ株式会社 薄膜配線基板およびプローブカード用基板
CN103037637A (zh) * 2011-09-30 2013-04-10 富葵精密组件(深圳)有限公司 多层电路板及多层电路板的制作方法
CN103037636A (zh) * 2011-09-30 2013-04-10 富葵精密组件(深圳)有限公司 多层电路板及多层电路板的制作方法
US9532466B2 (en) 2011-12-22 2016-12-27 Haesung Ds Co., Ltd. Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the method
CN103369872A (zh) * 2012-03-30 2013-10-23 北大方正集团有限公司 多层印刷电路板的压合方法
JP5196056B1 (ja) * 2012-06-14 2013-05-15 パナソニック株式会社 複合多層配線基板とその製造方法
WO2013186966A1 (ja) * 2012-06-14 2013-12-19 パナソニック株式会社 複合多層配線基板とその製造方法
CN103517583B (zh) * 2012-06-27 2016-09-28 富葵精密组件(深圳)有限公司 多层电路板及其制作方法
US9545017B2 (en) * 2013-02-15 2017-01-10 Ormet Circuits, Inc. Structures for z-axis interconnection of multilayer electronic substrates
CN103258806B (zh) * 2013-05-08 2016-01-27 日月光半导体制造股份有限公司 具桥接结构的半导体封装构造及其制造方法
CN104902675B (zh) * 2014-03-05 2018-08-07 深南电路有限公司 一种台阶槽电路板及其加工方法
JP2016115823A (ja) * 2014-12-16 2016-06-23 イビデン株式会社 プリント配線板
US11259398B2 (en) * 2017-03-31 2022-02-22 Magna Seating Inc. Electrical circuit board with low thermal conductivity and method of constructing thereof
US12262482B2 (en) 2019-05-07 2025-03-25 AT&SAustria Technologie&Systemtechnik Aktiengesellschaft Method of manufacturing component carrier and component carrier intermediate product
EP3736852A1 (en) 2019-05-07 2020-11-11 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Aligning component carrier structure with known-good sections and critical section with other component carrier with components and dummies
JP7031955B2 (ja) * 2019-09-10 2022-03-08 Ｆｉｃｔ株式会社 回路基板の製造方法
TWI741891B (zh) * 2020-08-28 2021-10-01 欣興電子股份有限公司 電路板結構及其製作方法
CN112856265A (zh) * 2021-02-04 2021-05-28 广东大唐永恒智能科技有限公司 一种双面柔性导线板及柔性导线拼板
CN115602688A (zh) * 2021-07-09 2023-01-13 欣兴电子股份有限公司（Tw） 异质基板结构及其制作方法
US20240178124A1 (en) * 2022-11-30 2024-05-30 Compass Technology Company Limited Embedded Die Package
JP2024176264A (ja) 2023-06-08 2024-12-19 富士電機株式会社 水質分析装置

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JP2004072125A (ja) * 2003-11-10 2004-03-04 Toshiba Corp 印刷配線板の製造方法および印刷配線板
TW200534762A (en) * 2004-04-08 2005-10-16 Phoenix Prec Technology Corp Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure
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TW538664B (en) * 2001-07-18 2003-06-21 Matsushita Electric Industrial Co Ltd Circuit forming board and method of manufacturing the same
JP2004072125A (ja) * 2003-11-10 2004-03-04 Toshiba Corp 印刷配線板の製造方法および印刷配線板
TW200534762A (en) * 2004-04-08 2005-10-16 Phoenix Prec Technology Corp Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure
TW200536448A (en) * 2004-04-22 2005-11-01 Phoenix Prec Technology Corp Circuit board with identifiable information and method for fabricating the same

Also Published As

Publication number Publication date
KR100962837B1 (ko) 2010-06-09
DE602006011710D1 (de) 2010-03-04
CN101069459A (zh) 2007-11-07
US20090229862A1 (en) 2009-09-17
KR20080002956A (ko) 2008-01-04
JP2007129124A (ja) 2007-05-24
EP1811824A1 (en) 2007-07-25
CN101069459B (zh) 2010-09-01
EP1811824B1 (en) 2010-01-13
EP1811824A4 (en) 2007-12-12
WO2007052799A1 (ja) 2007-05-10

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