JP2011515862A5 - - Google Patents

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Publication number
JP2011515862A5
JP2011515862A5 JP2011501170A JP2011501170A JP2011515862A5 JP 2011515862 A5 JP2011515862 A5 JP 2011515862A5 JP 2011501170 A JP2011501170 A JP 2011501170A JP 2011501170 A JP2011501170 A JP 2011501170A JP 2011515862 A5 JP2011515862 A5 JP 2011515862A5
Authority
JP
Japan
Prior art keywords
electronic component
conductive sheet
wiring board
printed wiring
contact connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011501170A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011515862A (ja
Filing date
Publication date
Priority claimed from DE200810000842 external-priority patent/DE102008000842A1/de
Application filed filed Critical
Publication of JP2011515862A publication Critical patent/JP2011515862A/ja
Publication of JP2011515862A5 publication Critical patent/JP2011515862A5/ja
Pending legal-status Critical Current

Links

JP2011501170A 2008-03-27 2009-03-13 電子構成群を製造する方法 Pending JP2011515862A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008000842.7 2008-03-27
DE200810000842 DE102008000842A1 (de) 2008-03-27 2008-03-27 Verfahren zur Herstellung einer elektronischen Baugruppe
PCT/EP2009/052953 WO2009118249A1 (de) 2008-03-27 2009-03-13 Verfahren zur herstellung einer elektronischen baugruppe

Publications (2)

Publication Number Publication Date
JP2011515862A JP2011515862A (ja) 2011-05-19
JP2011515862A5 true JP2011515862A5 (enExample) 2013-02-14

Family

ID=40791154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011501170A Pending JP2011515862A (ja) 2008-03-27 2009-03-13 電子構成群を製造する方法

Country Status (6)

Country Link
US (1) US20110088936A1 (enExample)
EP (1) EP2260683B1 (enExample)
JP (1) JP2011515862A (enExample)
CN (1) CN101982025B (enExample)
DE (1) DE102008000842A1 (enExample)
WO (1) WO2009118249A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007024189A1 (de) * 2007-05-24 2008-11-27 Robert Bosch Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe
WO2009147936A1 (ja) * 2008-06-02 2009-12-10 イビデン株式会社 多層プリント配線板の製造方法
US8966747B2 (en) 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
DE102012213916A1 (de) * 2011-11-08 2013-05-08 Robert Bosch Gmbh Elektronikmodul für ein Steuergerät
DE102011088256A1 (de) * 2011-12-12 2013-06-13 Zf Friedrichshafen Ag Multilayer-Leiterplatte sowie Anordnung mit einer solchen
US9536798B2 (en) * 2012-02-22 2017-01-03 Cyntec Co., Ltd. Package structure and the method to fabricate thereof
JP5406389B2 (ja) 2012-03-01 2014-02-05 株式会社フジクラ 部品内蔵基板及びその製造方法
FI125959B (en) 2013-05-10 2016-04-29 Murata Manufacturing Co Microelectromechanical device and method of manufacture of microelectromechanical device
DE102013217146A1 (de) * 2013-08-28 2015-03-05 Carl Zeiss Smt Gmbh Optisches Bauelement
EP2911486B1 (en) * 2014-02-19 2024-07-31 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft PCB-based connector device
US20150351218A1 (en) * 2014-05-27 2015-12-03 Fujikura Ltd. Component built-in board and method of manufacturing the same, and mounting body
KR102333559B1 (ko) 2015-05-11 2021-12-01 삼성전자 주식회사 안테나 장치 및 그를 포함하는 전자 장치
US10264664B1 (en) * 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
US10785871B1 (en) 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
EP3562281A1 (de) * 2018-04-25 2019-10-30 Siemens Aktiengesellschaft Backplane und verfahren zu deren herstellung
FR3090264B1 (fr) * 2018-12-13 2022-01-07 St Microelectronics Grenoble 2 Procédé de montage de composant
EP3709777A1 (en) 2019-03-11 2020-09-16 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Solder-free component carrier connection using an elastic element, and method
DE102019123193A1 (de) * 2019-08-29 2021-03-04 Endress+Hauser SE+Co. KG Feldgerät der Automatisierungstechnik
CN117832190A (zh) * 2022-09-28 2024-04-05 星科金朋私人有限公司 集成封装及其制造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6538210B2 (en) * 1999-12-20 2003-03-25 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module, radio device having the same, and method for producing the same
JP3598060B2 (ja) * 1999-12-20 2004-12-08 松下電器産業株式会社 回路部品内蔵モジュール及びその製造方法並びに無線装置
US6512182B2 (en) 2001-03-12 2003-01-28 Ngk Spark Plug Co., Ltd. Wiring circuit board and method for producing same
FI119215B (fi) * 2002-01-31 2008-08-29 Imbera Electronics Oy Menetelmä komponentin upottamiseksi alustaan ja elektroniikkamoduuli
US6919508B2 (en) * 2002-11-08 2005-07-19 Flipchip International, Llc Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing
JP2007535123A (ja) * 2003-07-14 2007-11-29 エイブイエックス コーポレイション モジュール式電子アッセンブリーおよび製造方法
FI20031201A7 (fi) * 2003-08-26 2005-02-27 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
DE10353676B4 (de) * 2003-11-17 2007-11-29 Siemens Ag Verfahren zur Herstellung eines ultradünnen Moduls mit rauen Kontakten
FI20040592L (fi) * 2004-04-27 2005-10-28 Imbera Electronics Oy Lämmön johtaminen upotetusta komponentista
JP2006165175A (ja) * 2004-12-06 2006-06-22 Alps Electric Co Ltd 回路部品モジュールおよび電子回路装置並びに回路部品モジュールの製造方法
EP1684341A3 (de) * 2005-01-21 2007-01-10 Robert Bosch Gmbh Elektrische Schaltung und Verfahren zur Herstellung einer elektrischen Schaltung
DE102005003125A1 (de) 2005-01-21 2006-07-27 Robert Bosch Gmbh Elektrische Schaltung und Verfahren zur Herstellung einer elektrischen Schaltung
KR100716826B1 (ko) * 2005-05-10 2007-05-09 삼성전기주식회사 전자부품이 내장된 기판의 제조방법
GB2441265B (en) * 2005-06-16 2012-01-11 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
JP2007227586A (ja) * 2006-02-23 2007-09-06 Cmk Corp 半導体素子内蔵基板及びその製造方法
KR100770874B1 (ko) * 2006-09-07 2007-10-26 삼성전자주식회사 매설된 집적회로를 구비한 다층 인쇄회로기판
US8174119B2 (en) * 2006-11-10 2012-05-08 Stats Chippac, Ltd. Semiconductor package with embedded die
DE102007015819A1 (de) * 2007-03-30 2008-10-09 Robert Bosch Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe
DE102007044754A1 (de) * 2007-09-19 2009-04-09 Robert Bosch Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe
US8375577B2 (en) * 2008-06-04 2013-02-19 National Semiconductor Corporation Method of making foil based semiconductor package

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