JP2019114635A5 - - Google Patents
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- Publication number
- JP2019114635A5 JP2019114635A5 JP2017246227A JP2017246227A JP2019114635A5 JP 2019114635 A5 JP2019114635 A5 JP 2019114635A5 JP 2017246227 A JP2017246227 A JP 2017246227A JP 2017246227 A JP2017246227 A JP 2017246227A JP 2019114635 A5 JP2019114635 A5 JP 2019114635A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- glass
- surface region
- conductor circuit
- built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000010410 layer Substances 0.000 claims description 100
- 239000011521 glass Substances 0.000 claims description 60
- 239000004020 conductor Substances 0.000 claims description 40
- 239000003990 capacitor Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000011241 protective layer Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 239000010948 rhodium Substances 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000006124 Pilkington process Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000003280 down draw process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 238000007372 rollout process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017246227A JP7206589B2 (ja) | 2017-12-22 | 2017-12-22 | キャパシタ内蔵ガラス回路基板の製造方法 |
| JP2022130129A JP7444210B2 (ja) | 2017-12-22 | 2022-08-17 | キャパシタ内蔵ガラス回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017246227A JP7206589B2 (ja) | 2017-12-22 | 2017-12-22 | キャパシタ内蔵ガラス回路基板の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022130129A Division JP7444210B2 (ja) | 2017-12-22 | 2022-08-17 | キャパシタ内蔵ガラス回路基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019114635A JP2019114635A (ja) | 2019-07-11 |
| JP2019114635A5 true JP2019114635A5 (enExample) | 2021-01-28 |
| JP7206589B2 JP7206589B2 (ja) | 2023-01-18 |
Family
ID=67222835
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017246227A Active JP7206589B2 (ja) | 2017-12-22 | 2017-12-22 | キャパシタ内蔵ガラス回路基板の製造方法 |
| JP2022130129A Active JP7444210B2 (ja) | 2017-12-22 | 2022-08-17 | キャパシタ内蔵ガラス回路基板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022130129A Active JP7444210B2 (ja) | 2017-12-22 | 2022-08-17 | キャパシタ内蔵ガラス回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP7206589B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6725095B2 (ja) | 2018-06-21 | 2020-07-15 | 大日本印刷株式会社 | 配線基板および半導体装置 |
| JP7443734B2 (ja) * | 2019-11-29 | 2024-03-06 | Tdk株式会社 | 電子部品 |
| JP7512594B2 (ja) * | 2020-01-10 | 2024-07-09 | Ｔｏｐｐａｎホールディングス株式会社 | 回路基板 |
| US12255225B2 (en) * | 2020-09-25 | 2025-03-18 | Intel Corporation | Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes |
| TWI800153B (zh) * | 2020-12-24 | 2023-04-21 | 南韓商東友精細化工有限公司 | 電路板 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4674606B2 (ja) | 2005-10-18 | 2011-04-20 | 株式会社村田製作所 | 薄膜キャパシタ |
| JP4461386B2 (ja) | 2005-10-31 | 2010-05-12 | Ｔｄｋ株式会社 | 薄膜デバイスおよびその製造方法 |
| JP4997757B2 (ja) * | 2005-12-20 | 2012-08-08 | 富士通株式会社 | 薄膜キャパシタ及びその製造方法、電子装置並びに回路基板 |
| JP2007180093A (ja) | 2005-12-27 | 2007-07-12 | Tdk Corp | 薄膜デバイスおよびその製造方法 |
| JP5003082B2 (ja) | 2006-09-26 | 2012-08-15 | 富士通株式会社 | インターポーザ及びその製造方法 |
| US8730647B2 (en) | 2008-02-07 | 2014-05-20 | Ibiden Co., Ltd. | Printed wiring board with capacitor |
| JP2011129665A (ja) | 2009-12-17 | 2011-06-30 | Sony Corp | 積層配線基板の製造方法 |
| JP2014241356A (ja) | 2013-06-12 | 2014-12-25 | 日本電気株式会社 | 電極構造及びその製造方法 |
| JP2016195161A (ja) | 2015-03-31 | 2016-11-17 | Tdk株式会社 | 薄膜キャパシタ |
| JP6669513B2 (ja) | 2016-02-03 | 2020-03-18 | 富士ゼロックス株式会社 | 回路基板および回路基板の製造方法 |
-
2017
- 2017-12-22 JP JP2017246227A patent/JP7206589B2/ja active Active
-
2022
- 2022-08-17 JP JP2022130129A patent/JP7444210B2/ja active Active
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