JP7206589B2 - キャパシタ内蔵ガラス回路基板の製造方法 - Google Patents

キャパシタ内蔵ガラス回路基板の製造方法 Download PDF

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JP7206589B2
JP7206589B2 JP2017246227A JP2017246227A JP7206589B2 JP 7206589 B2 JP7206589 B2 JP 7206589B2 JP 2017246227 A JP2017246227 A JP 2017246227A JP 2017246227 A JP2017246227 A JP 2017246227A JP 7206589 B2 JP7206589 B2 JP 7206589B2
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layer
capacitor
forming
glass
manufacturing
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JP2019114635A (ja
JP2019114635A5 (enExample
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貴志 木津
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Toppan Inc
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Toppan Inc
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JP2017246227A 2017-12-22 2017-12-22 キャパシタ内蔵ガラス回路基板の製造方法 Active JP7206589B2 (ja)

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JP2017246227A JP7206589B2 (ja) 2017-12-22 2017-12-22 キャパシタ内蔵ガラス回路基板の製造方法
JP2022130129A JP7444210B2 (ja) 2017-12-22 2022-08-17 キャパシタ内蔵ガラス回路基板

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JP2019114635A5 JP2019114635A5 (enExample) 2021-01-28
JP7206589B2 true JP7206589B2 (ja) 2023-01-18

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6725095B2 (ja) 2018-06-21 2020-07-15 大日本印刷株式会社 配線基板および半導体装置
JP7443734B2 (ja) * 2019-11-29 2024-03-06 Tdk株式会社 電子部品
JP7512594B2 (ja) * 2020-01-10 2024-07-09 Ｔｏｐｐａｎホールディングス株式会社 回路基板
US12255225B2 (en) * 2020-09-25 2025-03-18 Intel Corporation Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes
TWI800153B (zh) * 2020-12-24 2023-04-21 南韓商東友精細化工有限公司 電路板

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123690A (ja) 2005-10-31 2007-05-17 Tdk Corp 薄膜デバイスおよびその製造方法
JP2007180093A (ja) 2005-12-27 2007-07-12 Tdk Corp 薄膜デバイスおよびその製造方法
JP2008084933A (ja) 2006-09-26 2008-04-10 Fujitsu Ltd インターポーザ及びその製造方法
JP2009188401A (ja) 2008-02-07 2009-08-20 Ibiden Co Ltd キャパシタ内蔵プリント配線板
JP2011054979A (ja) 2005-10-18 2011-03-17 Murata Mfg Co Ltd 薄膜キャパシタ
JP2011129665A (ja) 2009-12-17 2011-06-30 Sony Corp 積層配線基板の製造方法
JP2014241356A (ja) 2013-06-12 2014-12-25 日本電気株式会社 電極構造及びその製造方法
JP2016195161A (ja) 2015-03-31 2016-11-17 Tdk株式会社 薄膜キャパシタ
JP2017139326A (ja) 2016-02-03 2017-08-10 富士ゼロックス株式会社 回路基板および回路基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4997757B2 (ja) * 2005-12-20 2012-08-08 富士通株式会社 薄膜キャパシタ及びその製造方法、電子装置並びに回路基板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054979A (ja) 2005-10-18 2011-03-17 Murata Mfg Co Ltd 薄膜キャパシタ
JP2007123690A (ja) 2005-10-31 2007-05-17 Tdk Corp 薄膜デバイスおよびその製造方法
JP2007180093A (ja) 2005-12-27 2007-07-12 Tdk Corp 薄膜デバイスおよびその製造方法
JP2008084933A (ja) 2006-09-26 2008-04-10 Fujitsu Ltd インターポーザ及びその製造方法
JP2009188401A (ja) 2008-02-07 2009-08-20 Ibiden Co Ltd キャパシタ内蔵プリント配線板
JP2011129665A (ja) 2009-12-17 2011-06-30 Sony Corp 積層配線基板の製造方法
JP2014241356A (ja) 2013-06-12 2014-12-25 日本電気株式会社 電極構造及びその製造方法
JP2016195161A (ja) 2015-03-31 2016-11-17 Tdk株式会社 薄膜キャパシタ
JP2017139326A (ja) 2016-02-03 2017-08-10 富士ゼロックス株式会社 回路基板および回路基板の製造方法

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JP7444210B2 (ja) 2024-03-06
JP2019114635A (ja) 2019-07-11
JP2022159478A (ja) 2022-10-17

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