JP2013519242A5 - - Google Patents

Download PDF

Info

Publication number
JP2013519242A5
JP2013519242A5 JP2012552828A JP2012552828A JP2013519242A5 JP 2013519242 A5 JP2013519242 A5 JP 2013519242A5 JP 2012552828 A JP2012552828 A JP 2012552828A JP 2012552828 A JP2012552828 A JP 2012552828A JP 2013519242 A5 JP2013519242 A5 JP 2013519242A5
Authority
JP
Japan
Prior art keywords
foil
flexible
integrated arrangement
component
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012552828A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013519242A (ja
JP5907896B2 (ja
Filing date
Publication date
Priority claimed from EP10153105A external-priority patent/EP2355144A1/en
Application filed filed Critical
Publication of JP2013519242A publication Critical patent/JP2013519242A/ja
Publication of JP2013519242A5 publication Critical patent/JP2013519242A5/ja
Application granted granted Critical
Publication of JP5907896B2 publication Critical patent/JP5907896B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012552828A 2010-02-09 2011-02-09 フレキシブル基板及び／又は伸長可能な基板上の部品配置 Active JP5907896B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10153105A EP2355144A1 (en) 2010-02-09 2010-02-09 Component placement on flexible and/or stretchable substrates
EP10153105.1 2010-02-09
PCT/NL2011/050092 WO2011099851A1 (en) 2010-02-09 2011-02-09 Component placement on flexible and/or stretchable substrates

Publications (3)

Publication Number Publication Date
JP2013519242A JP2013519242A (ja) 2013-05-23
JP2013519242A5 true JP2013519242A5 (enExample) 2015-04-30
JP5907896B2 JP5907896B2 (ja) 2016-04-26

Family

ID=42245652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012552828A Active JP5907896B2 (ja) 2010-02-09 2011-02-09 フレキシブル基板及び／又は伸長可能な基板上の部品配置

Country Status (5)

Country Link
US (1) US8961725B2 (enExample)
EP (2) EP2355144A1 (enExample)
JP (1) JP5907896B2 (enExample)
CN (1) CN102822960B (enExample)
WO (1) WO2011099851A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9757109B2 (en) 2010-12-10 2017-09-12 Illumix Surgical Canada Inc. Organic light emitting diode illuminated surgical retractor
US8998622B2 (en) 2012-08-31 2015-04-07 Apple Inc. Electrical connectors with applicators for electronic devices
DE102012109138B4 (de) * 2012-09-27 2022-05-25 Osram Oled Gmbh Optoelektronisches Bauelement, Verfahren zum Herstellen eines optoelektronischen Bauelementes und optoelektronische Bauelementevorrichtung
DE102013107116B4 (de) * 2013-07-05 2022-05-25 Pictiva Displays International Limited Organische Leuchtdiode und Verfahren zum Betreiben einer organischen Leuchtdiode
JP6159876B2 (ja) * 2014-03-31 2017-07-05 株式会社フジクラ 伸縮性基板及び回路基板
WO2016015009A1 (en) * 2014-07-24 2016-01-28 Regents Of The University Of California Reflectance based pulse oximetry systems and methods
DE102014113732B4 (de) * 2014-09-23 2022-11-24 Pictiva Displays International Limited 3D-OLED und Verfahren zum Herstellen einer 3D-OLED
WO2016084345A1 (en) * 2014-11-27 2016-06-02 Panasonic Intellectual Property Management Co., Ltd. Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure
US10327331B2 (en) * 2015-09-25 2019-06-18 Intel Corporation Stretchable computing device
KR102488076B1 (ko) * 2016-01-21 2023-01-13 삼성디스플레이 주식회사 스트레쳐블 표시 장치
US10527487B2 (en) 2016-05-31 2020-01-07 Future Technologies In Sport, Inc. System and method for sensing high-frequency vibrations on sporting equipment
CN106798549B (zh) * 2017-02-27 2019-06-18 清华大学 一种基于柔性可延展衬底的血氧传感器
CN107222974B (zh) * 2017-07-01 2019-04-12 华中科技大学 一种延性电路制作方法
WO2019226692A1 (en) 2018-05-21 2019-11-28 The Regents Of The University Of California Printed all-organic reflectance oximeter array
US20210219915A1 (en) * 2018-09-05 2021-07-22 Phc Holdings Corporation Biological information measurement device, biological information measurement system, and inserter
GB201816838D0 (en) * 2018-10-16 2018-11-28 Smith & Nephew Systems and method for applying biocompatible encapsulation to sensor enabled wound monitoring and therapy dressings
US11711892B2 (en) * 2019-07-15 2023-07-25 Velvetwire Llc Method of manufacture and use of a flexible computerized sensing device
CN116490972A (zh) * 2020-12-30 2023-07-25 维耶尔公司 微装置筒映射和补偿
TWI835414B (zh) * 2022-11-22 2024-03-11 友達光電股份有限公司 可撓式電子裝置及其製造方法
WO2024206982A1 (en) * 2023-03-30 2024-10-03 Applied Cavitation, Inc. Apparatus for making electrical connections to flexible circuits

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5217550A (en) * 1990-09-28 1993-06-08 Dai Nippon Printing Co., Ltd Alignment transfer method
US5667884A (en) * 1993-04-12 1997-09-16 Bolger; Justin C. Area bonding conductive adhesive preforms
JP3252534B2 (ja) 1993-06-10 2002-02-04 株式会社村田製作所 基板への導電パターン形成方法
JPH07161919A (ja) 1993-12-03 1995-06-23 Seiko Instr Inc 半導体装置およびその製造方法
JP2842378B2 (ja) 1996-05-31 1999-01-06 日本電気株式会社 電子回路基板の高密度実装構造
US6210771B1 (en) 1997-09-24 2001-04-03 Massachusetts Institute Of Technology Electrically active textiles and articles made therefrom
JP2001135910A (ja) 1999-11-04 2001-05-18 Mitsubishi Gas Chem Co Inc 炭酸ガスレーザーによる銅張多層板の孔あけ方法
US6796867B2 (en) 2000-10-27 2004-09-28 Science Applications International Corporation Use of printing and other technology for micro-component placement
US6476314B2 (en) * 2001-03-20 2002-11-05 The Boeing Company Solar tile and associated method for fabricating the same
EP1455394B1 (en) 2001-07-24 2018-04-11 Samsung Electronics Co., Ltd. Transfer method
WO2003021679A2 (en) 2001-09-03 2003-03-13 National Microelectronic Research Centre University College Cork - National University Of Ireland Cork Integrated circuit structure and a method of making an integrated circuit structure
JP2004281738A (ja) 2003-03-17 2004-10-07 Central Glass Co Ltd レーザ走査による導電線パターンの描画方法
US7491892B2 (en) 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
JP3918776B2 (ja) 2003-05-13 2007-05-23 株式会社デンソー Ｉｃパッケージの製造方法
GB0505826D0 (en) 2005-03-22 2005-04-27 Uni Microelektronica Ct Vsw Methods for embedding of conducting material and devices resulting from said methods
US7523546B2 (en) * 2005-05-04 2009-04-28 Nokia Corporation Method for manufacturing a composite layer for an electronic device
US7517725B2 (en) * 2005-11-28 2009-04-14 Xci, Inc. System and method for separating and packaging integrated circuits
DE102007007269A1 (de) 2006-04-04 2007-10-11 Man Roland Druckmaschinen Ag Applikation von elektronischen Bauelementen in Druckprodukten
DE602007007201D1 (de) 2006-04-07 2010-07-29 Koninkl Philips Electronics Nv Elastisch verformbare integrierte schaltung
JP4415977B2 (ja) * 2006-07-14 2010-02-17 セイコーエプソン株式会社 半導体装置の製造方法、及び転写用の基板
JP4292424B2 (ja) 2006-11-15 2009-07-08 セイコーエプソン株式会社 配線基板およびその製造方法、並びに電子機器
DE102006055576A1 (de) 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger
WO2008102866A1 (ja) * 2007-02-22 2008-08-28 Konica Minolta Holdings, Inc. 有機エレクトロルミネッセンス素子の製造方法、有機エレクトロルミネッセンス素子
AT505688A1 (de) 2007-09-13 2009-03-15 Nanoident Technologies Ag Sensormatrix aus halbleiterbauteilen
EP2066159A1 (en) 2007-11-27 2009-06-03 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method of providing conductive structures in a multi-foil system and multi-foil system comprising same
US8904315B2 (en) 2007-12-17 2014-12-02 Nokia Corporation Circuit arrangements and associated apparatus and methods
DE102008030821A1 (de) 2008-06-30 2009-12-31 Osram Opto Semiconductors Gmbh Elektroluminieszierende Vorrichtung und Verfahren zur Herstellung einer elektroluminieszierenden Vorrichtung
EP2141973A1 (en) 2008-07-02 2010-01-06 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method of providing conductive structures in a multi-foil system and multi-foil system comprising same
EP2200412A1 (en) 2008-12-17 2010-06-23 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Flexible electronic product and method for manufacturing the same

Similar Documents

Publication Publication Date Title
JP2013519242A5 (enExample)
CN102822960B (zh) 柔性和/或可伸缩的衬底上的组件布局
JP5902931B2 (ja) 配線基板の製造方法、及び、配線基板製造用の支持体
JP2015070269A5 (enExample)
US9179553B2 (en) Method of manufacturing multilayer wiring board
JP2005236244A5 (enExample)
JP2016504751A (ja) ポリマー内への薄型チップの埋込み
WO2010116694A3 (en) Method of manufacturing semiconductor device
JP2013243345A5 (enExample)
US20140090879A1 (en) Embedded architecture using resin coated copper
JP2014022665A5 (enExample)
JP2014110390A5 (enExample)
JP2014502792A (ja) 液晶高分子はんだマスクとアウタシール層とを有する電子デバイス及びその関連方法
JP2014130856A (ja) 配線基板の製造方法
JP2014084458A (ja) 積層基材、これを利用した基板の製造方法及び基板
JP2009164204A (ja) 光電池装置
JP2009130054A5 (enExample)
CN107017211B (zh) 电子部件和方法
JP2016048768A (ja) 配線板及び半導体装置の製造方法
JP2018006466A5 (enExample)
JP2017157739A (ja) 電子部品付き配線板の製造方法
JP5925872B2 (ja) 基板構造およびその製造方法
US20150155250A1 (en) Semiconductor package and fabrication method thereof
US8026603B2 (en) Interconnect structure of an integrated circuit and manufacturing method thereof
KR101580472B1 (ko) 회로기판 제조방법