Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
  • A61F13/00—Bandages or dressings; Absorbent pads
  • A61F13/00987—Apparatus or processes for manufacturing non-adhesive dressings or bandages
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
  • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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  • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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  • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
  • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
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  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0277—Bendability or stretchability details
  • H05K1/0283—Stretchable printed circuits
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  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
  • A61B2562/02—Details of sensors specially adapted for in-vivo measurements
  • A61B2562/0233—Special features of optical sensors or probes classified in A61B5/00
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  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
  • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
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  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
  • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
  • A61B2562/164—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted in or on a conformable substrate or carrier
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  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B5/00—Measuring for diagnostic purposes; Identification of persons
  • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
  • A61B5/024—Measuring pulse rate or heart rate
  • A61B5/02438—Measuring pulse rate or heart rate with portable devices, e.g. worn by the patient
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  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B5/00—Measuring for diagnostic purposes; Identification of persons
  • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue
  • A61B5/1455—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue using optical sensors, e.g. spectral photometrical oximeters
  • A61B5/14551—Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value ; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid or cerebral tissue using optical sensors, e.g. spectral photometrical oximeters for measuring blood gases
  • A61B5/14552—Details of sensors specially adapted therefor
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  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B5/00—Measuring for diagnostic purposes; Identification of persons
  • A61B5/44—Detecting, measuring or recording for evaluating the integumentary system, e.g. skin, hair or nails
  • A61B5/441—Skin evaluation, e.g. for skin disorder diagnosis
  • A61B5/445—Evaluating skin irritation or skin trauma, e.g. rash, eczema, wound, bed sore
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  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
  • A61F13/00—Bandages or dressings; Absorbent pads
  • A61F13/01—Non-adhesive bandages or dressings
  • A61F13/01034—Non-adhesive bandages or dressings characterised by a property
  • A61F13/01038—Flexibility, stretchability or elasticity
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  • H01L2224/27—Manufacturing methods
  • H01L2224/275—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
  • H01L2224/27505—Sintering
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  • H01L2224/27—Manufacturing methods
  • H01L2224/275—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
  • H01L2224/27515—Curing and solidification, e.g. of a photosensitive layer material
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  • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
  • H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
  • H01L2224/29139—Silver [Ag] as principal constituent
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  • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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  • H01L2224/29147—Copper [Cu] as principal constituent
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  • H01L2224/29299—Base material
  • H01L2224/29393—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
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  • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0104—Properties and characteristics in general
  • H05K2201/0133—Elastomeric or compliant polymer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
  • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
  • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/10—Methods of surface bonding and/or assembly therefor
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/10—Methods of surface bonding and/or assembly therefor
  • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
  • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
  • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
  • Y10T156/1168—Gripping and pulling work apart during delaminating
  • Y10T156/1195—Delaminating from release surface

Definitions

• the invention relates to a method and a system for component placement on flexible and/or stretchable substrates.
• foil based devices show only limited flexibility and are not intrinsically stretchable. This means they may need to be cut into pieces and connected to a carrier in order to allow for a highly flexible or stretchable application.
• a stretchable substrate is provided on a sacrificial layer.
• a stretchable substrate is a substrate which is stretchable, which can stretch under certain influences as forces as for instance physical or mechanical force, without thereby losing its essential functionalities.
• a substrate can comprise metal lines, interconnect lines, electronic components, chips etc. All the constituents together form a composite substrate.
• Such a composite substrate is flexible if it has at least some flexibility in at least part of it. As the method and the device made by this method are closely related, they will be described together.
• the present invention furthermore relates to the field of mechanically assembling multi-foil systems, i.e. flexible laminated electronic or optic systems.
• each foil may have a certain electric or optic function, like a display function, a battery function or a solar panel function.
• Systems-in-foil have numerous applications, e.g. in the fields of lighting and reusable and disposable sensor devices.
• foils may be made in large sizes and quantities at low costs, e.g. using production processes such as presently used in the paper printing industry.
• the foils may be manufactured on different locations and the system may be assembled on a central location.
• the invention aims to provide a simple roll-to-roll compatible and cost effective mass placement of discrete foil based devices on flexible and / or stretchable carriers.
• the invention provides a method of placement of a component on a stretchable substrate, comprising the steps of providing a base substrate having a stretchable substrate layer, providing a flexible foil comprising an integral arrangement of a multiple of flexible foil components; the flexible foil components each comprising component pads for electro/optical access to the flexible foil components, providing in plane interconnecting traces on the stretchable substrate layer in correspondence with the component pads in the integral arrangement; aligning the base substrate and the flexible foil so as to be used in a reel based manufacturing process; providing, through lamination of the base substrate and the flexible foil an electro/optical via connection between the traces and the component pads of the integral component arrangement; and mechanically separating the integral
• One advantage of the invention is that it may be used in a conventional manufacturing process for multi-foil systems such as a roll to roll, roll to sheet or sheet to roll process.
• multi-foil systems such as a roll to roll, roll to sheet or sheet to roll process.
• Figure 1 shows a first manufacturing step of the manufacturing method
• Figure 2 shows a subsequent manufacturing step of the manufacturing method
• Figure 3 shows a via forming step
• Figure 4 shows an alignment step
• Figure 5 shows a lamination step
• Figure 6 shows a further manufacturing step
• Figure 7 shows a detailed aspect of Figure 6 showing an electro/optical component on a stretchable substrate layer
• Figure 8 shows a schematic series of steps resulting in a electro/optical interconnected component system on a stretchable substrate layer
• Figure 9 shows an example product.
• the invention concerns a method of placement of a component on a stretchable substrate.
• the component is manufactured as a so-called
• a functional foil device that may be used in multi-foil systems according to the invention. Such devices may be indicatively characterized as 'a flexible laminated electronic or optic foil device'. Typically, such a functional foil device comprises at least one electrical and/or optical, in the remainder indicated as electro/optical, functional circuit. Further, typically, the functional foil system comprises at least one connection pad being connected to the at least one functional circuit. Thus, a functional foil may be considered a multi-layer device in itself. Typical examples of such foils can be found in the following prior art publication:
• foils are also generally referenced as 'foil'.
• These foil devices are not stretchable in the common sense of the word, because typically the foil substrates of these devices such as polyimide or PEN, when subject to already very low stretching forces, will disintegrate whereas its electro/optic functionality is almost immediately lost when the device is subject to stretching.
• substrates used for such devices cannot be stretched more then 10% of the area, whereas a stretchability is desired, for the stretchable carrier in the order of at least more than 200 % area enlargement.
• Figure 1 shows a first manufacturing step of the manufacturing method.
• a base substrate 10 is provided having a stretchable substrate layer 1 (hereafter also indicated as stretchable carrier 1) and that contains electrical contact paths and/or tracks 3. These will be used for driving and/or reading out of the functional components 2 (see subsequent Figures).
• stretchable substrates are disclosed in EP1746869 wherein after removal of a sacrificial layer, additional sets of components can be introduced on the stretchable substrate.
• a textile having conductive tracks (conductive yarn) arranged can be provided. While the invention relates to a method of placement of a component on a stretchable substrate 1, during production, a sacrificial substrate (not shown) may include a non- stretchable sacrificial layer.
• a base substrate 10 having a stretchable substrate layer 1 and optionally, said base substrate comprises a non- stretchable sacrificial layer which is removed after lamination.
• the stretchable substrate layer comprises in plane interconnecting traces 3 in correspondence with component pads to be placed thereon.
• Figure 2 shows a subsequent manufacturing step of the manufacturing method, wherein an adhesive layer 4 is applied specifically on those places where devices or components 2 need to be placed. This can be done in various ways.
• the adhesive 4 may be printed or applied with some other patterned method, or it may be prepatterned and transferred via a release liner (not shown).
• patches 4 of a relatively stiff adhesive are applied, for instance, by printing, or by transferring a prepatterned trace pattern via e.g. a release tape.
• a prepatterned trace pattern via e.g. a release tape.
• in plane interconnecting traces 3 may be provided on the stretchable substrate layer 1 by transfer via a release liner having prepatterned traces arranged thereon.
• Figure 3 shows a via forming step, wherein interconnections (vias) 5 may be provided through the adhesive layer 4.
• the vias 5 may be preformed in the adhesive layer 4, prior to providing the layer 4 on the stretchable base substrate 1.
• the (cured) adhesive 4 is preferably less flexible than the carrier 1 and possibly also stiffer that the foil based component 2. Because of this
• the solid state adhesive layer has convertible
• the conductive adhesive may be of an isotropic or anisotropic nature, in a manner disclosed in PCT/NL2009/050389 and PCT/NL2008/050750 of the same applicant which are incorporated by reference.
• Examples of adhesives that may be used to form the solid state adhesive layer 4 are epoxies and acrylates, but also thermoplastic polymers like ethylene-vinyl acetate (EVA) and modified polypropylenes.
• the thermoplastic polymers may include pressure sensitive adhesives, thermo hardening adhesives and/ thermoplastic materials and/or UV hardening adhesives.
• the thickness of the adhesive layer 4 may vary in the order of 5 - 50 micrometers.
• Figure 4 shows an alignment step.
• the carrier 1 and a flexible foil 6 are aligned so as to be used in a reel based manufacturing process. Examples of such reel based alignment are disclosed in European
• the flexible foil 6 comprises an integral arrangement 20 of a multiple of flexible foil components 2; the flexible foil 6 components each comprising component pads 7 (see Figure 7) for electro/optical access to the flexible foil components.
• the integral arrangement 20 of flexible foil components 2 is defined by at least a single mechanical connection via a substrate layer or common foil between the components 2.
• components 2 are produced in a process wherein the common layer defines a planar substrate used to realize the component structure.
• the planar substrate is produced in a roll to roll process.
• interconnecting zones 21 define the region between the components 2. These zones 21 do not possess device functionality and may be removed or cut for mechanical separation of the components 2.
• the zone 21 may be covering a substantial interdistance between or be as small as a single cut.
• Figure 5 shows a lamination step.
• the foil 6 containing the components 2 is laminated to the carrier 1 with enough accuracy such that the electrical interconnection with the carrier 1 may be made. Accordingly, through lamination of the carrier 1 and the flexible foil 6 an electro/optical via connection is provided between the traces and the component pads of the integral component arrangement.
• Figure 6 shows a further manufacturing step.
• intermediate zones 21 that do not contain any functionality may be removed (A) to regain flexibility or stretchability in the assembled system 111.
• This may be done in various ways.
• the foil 6 may be perforated before lamination. Accordingly, as an example, the integral arrangement is mechanically separated by tearing along predefined weakenings 21 in the flexible foil.
• the integral arrangement 20 may be mechanically separated by providing a cut 21 between the foil components 2. While a single cutting trace is sufficient to provide mechanical separation, in an embodiment, the integral arrangement is mechanically separated by removing foil interconnecting zones 21 between the foil components. In these interconnection zones, additional foil devices or components may be provided in a subsequent production step.
• PCT/NL2009/050061 of the same applicant and incorporated herein by reference, discloses a manufacturing method wherein a foil device is manufacturing separatable from a carrier substrate (as indicated in Figure 7).
• a so called foilless device is manufactured on a production foil 6, the devices 2 being very thin and slightly brittle. In this case some minor mechanical stress will release material that is not adhered and connected to the surface. Accordingly, only some mechanical action may be sufficient to remove the not adhered parts, and thus, optionally, the integral arrangement may be mechanically separated by release of the flexible foil components from a foil manufacturing substrate..
• the foil based devices 2 were pre patterned and laminated and interconnected to the carrier 1 whilst on a release liner 6.
• Figure 7 shows a detailed aspect of Figure 6 showing an electro/optical component 2 on a stretchable substrate layer 1. Interconnection can be realized via the adhesive layer 4, for example by a process wherein
• electro/optical via interconnections 5 are provided in an interconnecting solid state adhesive layer 4 arranged on the stretchable substrate layer 1, the interconnecting layer 4 thus having out of plane arranged interconnections 5 in correspondence with the interconnecting traces 3.
• the solid state adhesive layer 4 may be provided with a conductive paste 5 arranged in through holes.
• Figure 8 shows a special case wherein a stretchable substrate is laminated 100, cut 200 and stretched 300:
• Stretch 300 wired substrate 1 to get enlarged area Stretched areas can also be used as diffusion channel for e.g. moisture in bandage application, since device area 2 will be impenetrable but the stretchable intermediate zones may be permeable to moist (for example, by having additional perforations).
• a further flexible foil can be laminated with the interconnected component system on the stretchable substrate layer, the further flexible foil comprising further foil components aligned with the interconnection zones.
• components may be fabricated on foil 6 in high density integral arrangement 20 and positioned on a stretchable carrier 1 using the above method. After cutting/release the carrier 1 may be stretched yielding a large area application with equally distributed components. This is of special interest in the fabrication of conformable sensor arrays, such as in 'smart bandage'
• the extent of stretchability can be varied in between the components thereby providing a means to allocate components which are equidistantially produced (therefore more efficiently) at a predefined position on the final carrier material.
• Examples of foils with different surface structures are OLED foils or organic photodiode foils (OPD).
• OLED foils organic photodiode foils
• Different surface structures may prevent the foils to be melted onto each other directly.
• the adhesive layer may separate the foils and enables to stack two functional foils having mutually differing adjacent surface structures.
• Another cause for different surface structures may be a layer that is applied to a foil only locally.
• the OLED foil may be locally covered by flexible, inorganic transparent barrier layers.
• an adhesive may be enriched by providing additives to the adhesive.
• Optical diffuser materials may for example be added to the adhesive to improve the light guiding characteristics of the adhesive layer, e.g. to ensure a good incoupling of light from an OLED foil onto a photodiode foil.
• Another example of enriching an adhesive layer is by mixing water getters through the adhesive to keep water away from water- sensitive foils, like OLED foils.
• the adhesive may also provide mechanical integrity to a multi-foil system. Melting foils together directly may provide insufficient coherence between the foils and cause the foil system to fall apart. An adhesive layer may provide the coherence to keep the foil system together.
• Examples of the conductive material that may be used are conductive pastes like thermally or UV curing silver or copper, but also carbon-filled epoxies or acrylates. Additionally, it is possible to fill the holes with a seed-material and (electroless) grow metallic conductors from that seed.
• Example 1 smart bandage sensor
• An example of a multi-foil system is a smart bandage sensor for in- situ monitoring of the healing of a wound.
• a polyurethane substrate (having, as an indicative value, a stretchability up to 500%) may be used as carrier for a smart bandage application.
• a device functionality remains intact while the stretchable area is enlarged with values of 200, 300 up to 500 % of the unstr etched area value.
• a pulse oximeter sensor device may be manufactured having a stretchable substrate and including a plurality of reflection based OLEDs and OPDs fabricated on non-stretchable flexible foil.
• a stretchable substrate may be manufactured having a stretchable substrate and including a plurality of reflection based OLEDs and OPDs fabricated on non-stretchable flexible foil.
• such flexible foils cannot be stretched more than 200% without losing its electro-optic
• components are OLEDs and OPD but also printed passives (e.g. resistors, capacitor) or combinations of these may be placed in a similar fashion when such components are manufactured as an integral arrangement on a production foil as hereabove explained.
• printed passives e.g. resistors, capacitor
• Figure 9 shows the smart bandage sensor 80 as a three-foil system comprising three functional foils 81, 82 and 83.
• the three foils 81, 82 and 83 are laminated and electrically interconnected via two layers of adhesive.
• the adhesive layers between the foils are not visible in Figure 9.
• First foil 81 is an 'OLED foil' comprising a Polyethylene Naphthalate (PEN) layer with printed organic light emitting diodes (OLED's). To protect the OLED's against the ambient environment, the OLED's may be locally covered by flexible, inorganic transparent barrier layers.
• Second foil 82 is a 'Photodiode foil' comprising a PEN layer with printed organic photodiodes.
• Third foil 83 is a 'Driver foil' onto which driver components are mounted.
• the driver foil comprises a copper layer and a polyimide layer.
• a polyimide layer is not-stretchable and disintegrates at 5-25% area enlargement - whereas the electro-optical device functionality is already long lost before disintegration of the polyimide layer.
• Both the OLED foil 81 and the Photodiode foil 82 are electrically connected to the Driver foil 83.
• the sensor is manufactured by a manufacturing process as herein disclosed, in particular, according to the laminate - cutting and stretching steps 100-300.
• first interconnects 84 connect OLED foil 81 to Driver foil 83 and second interconnects 85 connect Photodiode foil 82 to Driver foil 83.
• interconnects 85 pass through Photodiode foil 82.
• a stretchable material e.g. silicone by spinning
• any stretchable material such as latex, polyurethane, all kinds of rubbers like NBR (nitrile butadiene rubber) thermoplastic elastomers (TPE).
• TPEs are grouped into major families based on polyolefin (TPE-O), polyester (TPE-E), polyurethane (TPE-U), polyamide (TPE-A), and polystyrene (TPE-S).
• the stretchable substrate may be a stretchable textile.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Health & Medical Sciences (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Physics & Mathematics (AREA)
• Life Sciences & Earth Sciences (AREA)
• Heart & Thoracic Surgery (AREA)
• Vascular Medicine (AREA)
• Biomedical Technology (AREA)
• Animal Behavior & Ethology (AREA)
• General Health & Medical Sciences (AREA)
• Public Health (AREA)
• Veterinary Medicine (AREA)
• Structure Of Printed Boards (AREA)
• Laminated Bodies (AREA)

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• 2010
  • 2010-02-09 EP EP10153105A patent/EP2355144A1/en not_active Withdrawn
• 2011
  • 2011-02-09 WO PCT/NL2011/050092 patent/WO2011099851A1/en not_active Ceased
  • 2011-02-09 US US13/577,735 patent/US8961725B2/en not_active Expired - Fee Related
  • 2011-02-09 JP JP2012552828A patent/JP5907896B2/ja active Active
  • 2011-02-09 CN CN201180017534.XA patent/CN102822960B/zh not_active Expired - Fee Related
  • 2011-02-09 EP EP11704332.3A patent/EP2534680B1/en not_active Not-in-force

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