ATE471572T1 - Elastisch verformbare integrierte schaltung - Google Patents
Elastisch verformbare integrierte schaltungInfo
- Publication number
- ATE471572T1 ATE471572T1 AT07735369T AT07735369T ATE471572T1 AT E471572 T1 ATE471572 T1 AT E471572T1 AT 07735369 T AT07735369 T AT 07735369T AT 07735369 T AT07735369 T AT 07735369T AT E471572 T1 ATE471572 T1 AT E471572T1
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- integrated
- elastically deformable
- islands
- circuit device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Reduction Or Emphasis Of Bandwidth Of Signals (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06112384 | 2006-04-07 | ||
PCT/IB2007/051190 WO2007116344A1 (en) | 2006-04-07 | 2007-04-03 | Elastically deformable integrated-circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE471572T1 true ATE471572T1 (de) | 2010-07-15 |
Family
ID=38420545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07735369T ATE471572T1 (de) | 2006-04-07 | 2007-04-03 | Elastisch verformbare integrierte schaltung |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090283891A1 (de) |
EP (1) | EP2008303B1 (de) |
JP (1) | JP2009533839A (de) |
CN (1) | CN101416302A (de) |
AT (1) | ATE471572T1 (de) |
DE (1) | DE602007007201D1 (de) |
WO (1) | WO2007116344A1 (de) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7834424B2 (en) * | 2006-09-12 | 2010-11-16 | The Board Of Trustees Of The Leland Stanford Junior University | Extendable connector and network |
FR2917895B1 (fr) * | 2007-06-21 | 2010-04-09 | Commissariat Energie Atomique | Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple |
WO2009111641A1 (en) | 2008-03-05 | 2009-09-11 | The Board Of Trustees Of The University Of Illinois | Stretchable and foldable electronic devices |
WO2010042653A1 (en) | 2008-10-07 | 2010-04-15 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
US9123614B2 (en) | 2008-10-07 | 2015-09-01 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
WO2010056857A2 (en) * | 2008-11-12 | 2010-05-20 | Mc10, Inc. | Extremely stretchable electronics |
CA2780747C (en) * | 2008-11-12 | 2020-08-25 | Mc10, Inc. | Extremely stretchable electronics |
JP2012515436A (ja) * | 2009-01-12 | 2012-07-05 | エムシー10 インコーポレイテッド | 非平面撮像アレイの方法及び応用 |
EP2392196B1 (de) | 2009-01-30 | 2018-08-22 | IMEC vzw | Streckbare elektronische einrichtung |
WO2010102310A2 (en) * | 2009-03-03 | 2010-09-10 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
US8344955B2 (en) | 2010-01-08 | 2013-01-01 | Nokia Corporation | Integrated antenna with e-flex technology |
JP5560738B2 (ja) * | 2010-02-01 | 2014-07-30 | 日本電気株式会社 | 半導体装置、三次元集積回路およびその製造方法 |
EP2355144A1 (de) | 2010-02-09 | 2011-08-10 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Bestückung auf flexiblen und/oder dehnbaren Substraten |
US8987913B2 (en) | 2010-05-12 | 2015-03-24 | Monolithe Semiconductor Inc. | Deformable network structure |
TWI567945B (zh) * | 2010-05-12 | 2017-01-21 | 瑪納利斯半導體公司 | 可伸張之網狀結構 |
US8716603B2 (en) | 2010-11-24 | 2014-05-06 | Nokia Corporation | Printed wiring board with dielectric material sections having different dissipation factors |
EP2461658A1 (de) | 2010-12-03 | 2012-06-06 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Verfahren und Vorrichtung zur Anordnung elektrischer Komponenten auf einem flexiblen Substrat sowie Anordnung einer elektrischen Komponente mit einem flexiblen Substrat |
US20120279762A1 (en) * | 2011-05-03 | 2012-11-08 | Industry-Academic Cooperation Foundation, Yonsei University | Composition for forming stretchable conductive pattern, method of producing the stretchable conductive pattern using the composition, and electronic device including stretchable conductive electrode |
JP5821290B2 (ja) | 2011-05-31 | 2015-11-24 | セイコーエプソン株式会社 | モジュールおよび電子機器 |
JP5821289B2 (ja) | 2011-05-31 | 2015-11-24 | セイコーエプソン株式会社 | 保持部材、モジュールおよび電子機器 |
JP5935244B2 (ja) | 2011-05-31 | 2016-06-15 | セイコーエプソン株式会社 | モジュールおよび電子機器 |
JP5741306B2 (ja) * | 2011-08-10 | 2015-07-01 | 富士通株式会社 | 電子装置及びその製造方法 |
US9226402B2 (en) | 2012-06-11 | 2015-12-29 | Mc10, Inc. | Strain isolation structures for stretchable electronics |
EP2675253A1 (de) | 2012-06-15 | 2013-12-18 | BIOTRONIK SE & Co. KG | Flexibel-steifer Leiterplattenverbund und Verfahren zur Herstellung eines flexibel-steifen Leiterplattenverbunds |
US9168094B2 (en) | 2012-07-05 | 2015-10-27 | Mc10, Inc. | Catheter device including flow sensing |
US9295842B2 (en) | 2012-07-05 | 2016-03-29 | Mc10, Inc. | Catheter or guidewire device including flow sensing and use thereof |
JP2014048090A (ja) * | 2012-08-30 | 2014-03-17 | Seiko Epson Corp | 電子モジュール、電子機器、及び移動体 |
EP2906960A4 (de) | 2012-10-09 | 2016-06-15 | Mc10 Inc | Kleidung mit integrierter konformer elektronik |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
JP5583815B1 (ja) * | 2013-04-22 | 2014-09-03 | 株式会社フジクラ | 多層配線基板及びその製造方法 |
US9706647B2 (en) * | 2013-05-14 | 2017-07-11 | Mc10, Inc. | Conformal electronics including nested serpentine interconnects |
US8927338B1 (en) | 2013-06-13 | 2015-01-06 | International Business Machines Corporation | Flexible, stretchable electronic devices |
JP6002322B2 (ja) * | 2013-06-19 | 2016-10-05 | 株式会社フジクラ | 伸縮性基板、回路基板、及び伸縮性基板の製造方法 |
CA2920485A1 (en) | 2013-08-05 | 2015-02-12 | Mc10, Inc. | Flexible temperature sensor including conformable electronics |
US10467926B2 (en) | 2013-10-07 | 2019-11-05 | Mc10, Inc. | Conformal sensor systems for sensing and analysis |
KR102365120B1 (ko) | 2013-11-22 | 2022-02-18 | 메디데이타 솔루션즈, 인코포레이티드 | 심장 활동 감지 및 분석용 등각 센서 시스템 |
WO2015100414A1 (en) | 2013-12-27 | 2015-07-02 | Arizona Board Of Regents On Behalf Of Arizona State University | Deformable origami batteries |
US10410962B2 (en) | 2014-01-06 | 2019-09-10 | Mc10, Inc. | Encapsulated conformal electronic systems and devices, and methods of making and using the same |
EP3114911B1 (de) | 2014-03-04 | 2023-05-03 | Medidata Solutions, Inc. | Flexibles mehrteiliges verkapselungsgehäuse für elektronische vorrichtungen |
EP2991460B1 (de) * | 2014-08-29 | 2018-11-21 | Nokia Technologies OY | Vorrichtung und zugehörige Verfahren für verformbare Elektronik |
CN104347591B (zh) * | 2014-09-10 | 2017-05-31 | 朱慧珑 | 柔性集成电路器件及其组件和制造方法 |
WO2016049444A1 (en) | 2014-09-26 | 2016-03-31 | Arizona Board Of Regents On Behalf Of Arizona State University | Stretchable batteries |
US9899330B2 (en) | 2014-10-03 | 2018-02-20 | Mc10, Inc. | Flexible electronic circuits with embedded integrated circuit die |
US10297572B2 (en) * | 2014-10-06 | 2019-05-21 | Mc10, Inc. | Discrete flexible interconnects for modules of integrated circuits |
USD781270S1 (en) | 2014-10-15 | 2017-03-14 | Mc10, Inc. | Electronic device having antenna |
WO2016109652A1 (en) * | 2015-01-02 | 2016-07-07 | Arizona Board Of Regents On Behalf Of Arizona State University | Archimedean spiral design for deformable electronics |
US10502991B2 (en) | 2015-02-05 | 2019-12-10 | The Arizona Board Of Regents On Behalf Of Arizona State University | Origami displays and methods for their manufacture |
EP3258837A4 (de) | 2015-02-20 | 2018-10-10 | Mc10, Inc. | Automatische erkennung und konfiguration von am körper tragbaren vorrichtungen auf basis von status, position und/oder ausrichtung am körper |
US10398343B2 (en) | 2015-03-02 | 2019-09-03 | Mc10, Inc. | Perspiration sensor |
JP2016178121A (ja) | 2015-03-18 | 2016-10-06 | タツタ電線株式会社 | ストレッチャブルケーブルおよびストレッチャブル回路基板 |
US10653332B2 (en) * | 2015-07-17 | 2020-05-19 | Mc10, Inc. | Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers |
US10709384B2 (en) | 2015-08-19 | 2020-07-14 | Mc10, Inc. | Wearable heat flux devices and methods of use |
US10300371B2 (en) | 2015-10-01 | 2019-05-28 | Mc10, Inc. | Method and system for interacting with a virtual environment |
US10532211B2 (en) | 2015-10-05 | 2020-01-14 | Mc10, Inc. | Method and system for neuromodulation and stimulation |
US20170181276A1 (en) * | 2015-12-21 | 2017-06-22 | Panasonic Intellectual Property Management Co., Ltd. | Substrate including stretchable sheet |
EP3420732B8 (de) | 2016-02-22 | 2020-12-30 | Medidata Solutions, Inc. | System, vorrichtungen und verfahren zur daten- und leistungsübertragung auf dem körper |
WO2017147053A1 (en) | 2016-02-22 | 2017-08-31 | Mc10, Inc. | System, device, and method for coupled hub and sensor node on-body acquisition of sensor information |
WO2017184705A1 (en) | 2016-04-19 | 2017-10-26 | Mc10, Inc. | Method and system for measuring perspiration |
US10390698B2 (en) | 2016-06-16 | 2019-08-27 | Arizona Board Of Regents On Behalf Of Arizona State University | Conductive and stretchable polymer composite |
DE102016212129B4 (de) * | 2016-07-04 | 2022-05-19 | Schweizer Electronic Ag | Hochfrequenz-Sende-/Empfangselement und Verfahren zur Herstellung eines Hochfrequenz-Sende-/Empfangselementes |
JP6781983B2 (ja) * | 2016-08-05 | 2020-11-11 | 国立研究開発法人産業技術総合研究所 | 電子デバイス及びその製造方法 |
US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
JP6972523B2 (ja) * | 2016-09-13 | 2021-11-24 | セイコーエプソン株式会社 | 電子機器 |
CN106455303B (zh) * | 2016-11-15 | 2019-02-05 | 中国科学院力学研究所 | 一种可延展的喷墨打印柔性电路板及其制备方法 |
CN209265885U (zh) * | 2018-09-19 | 2019-08-16 | 昆山工研院新型平板显示技术中心有限公司 | 拉伸电极及包含其的电子器件 |
KR102664207B1 (ko) * | 2018-10-08 | 2024-05-07 | 엘지디스플레이 주식회사 | 스트레쳐블 표시 장치 및 그 제조 방법 |
CN109817687B (zh) * | 2019-02-15 | 2021-10-08 | 京东方科技集团股份有限公司 | 一种柔性基板及oled显示面板 |
CN109704268A (zh) * | 2019-02-21 | 2019-05-03 | 厦门大学 | 一种可拉伸电子干扰变形免疫基材 |
CN110649181B (zh) * | 2019-10-08 | 2022-04-26 | 京东方科技集团股份有限公司 | 显示基板、显示装置以及显示基板的制备方法 |
US11260705B2 (en) | 2019-12-17 | 2022-03-01 | The Goodyear Tire & Rubber Company | Flexible tire sensor unit |
CN111462637B (zh) * | 2020-05-29 | 2022-07-01 | 上海天马微电子有限公司 | 一种显示面板和显示装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3519890A (en) * | 1968-04-01 | 1970-07-07 | North American Rockwell | Low stress lead |
US4754544A (en) * | 1985-01-30 | 1988-07-05 | Energy Conversion Devices, Inc. | Extremely lightweight, flexible semiconductor device arrays |
JP2763445B2 (ja) * | 1992-04-03 | 1998-06-11 | 三菱電機株式会社 | 高周波信号用配線及びそのボンディング装置 |
JPH0636620A (ja) * | 1992-07-14 | 1994-02-10 | Nec Gumma Ltd | フレキシブルフラットケーブル |
JPH0997870A (ja) * | 1995-09-29 | 1997-04-08 | S I I R D Center:Kk | 電子装置及びその製造方法 |
US6027958A (en) * | 1996-07-11 | 2000-02-22 | Kopin Corporation | Transferred flexible integrated circuit |
KR100476524B1 (ko) * | 1997-12-31 | 2005-08-29 | 삼성전자주식회사 | 엘씨디모듈용테이프캐리어패키지 |
WO1999038211A1 (de) * | 1998-01-22 | 1999-07-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikrosystem und verfahren zum herstellen eines mikrosystems |
US6617671B1 (en) * | 1999-06-10 | 2003-09-09 | Micron Technology, Inc. | High density stackable and flexible substrate-based semiconductor device modules |
US6743982B2 (en) * | 2000-11-29 | 2004-06-01 | Xerox Corporation | Stretchable interconnects using stress gradient films |
DE10122324A1 (de) * | 2001-05-08 | 2002-11-14 | Philips Corp Intellectual Pty | Flexible integrierte monolithische Schaltung |
US6627865B1 (en) * | 2001-05-15 | 2003-09-30 | Raytheon Company | Nonplanar integrated optical device array structure and a method for its fabrication |
US6455931B1 (en) * | 2001-05-15 | 2002-09-24 | Raytheon Company | Monolithic microelectronic array structure having substrate islands and its fabrication |
WO2003021679A2 (en) * | 2001-09-03 | 2003-03-13 | National Microelectronic Research Centre University College Cork - National University Of Ireland Cork | Integrated circuit structure and a method of making an integrated circuit structure |
US7011530B2 (en) * | 2002-05-24 | 2006-03-14 | Sitaraman Suresh K | Multi-axis compliance spring |
JP3670636B2 (ja) * | 2002-10-09 | 2005-07-13 | 株式会社日立製作所 | 電子部品を実装した電子装置 |
US6872589B2 (en) * | 2003-02-06 | 2005-03-29 | Kulicke & Soffa Investments, Inc. | High density chip level package for the packaging of integrated circuits and method to manufacture same |
US7491892B2 (en) * | 2003-03-28 | 2009-02-17 | Princeton University | Stretchable and elastic interconnects |
JP4291209B2 (ja) * | 2004-05-20 | 2009-07-08 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
US7629691B2 (en) * | 2004-06-16 | 2009-12-08 | Honeywell International Inc. | Conductor geometry for electronic circuits fabricated on flexible substrates |
JP2006108431A (ja) * | 2004-10-06 | 2006-04-20 | Sharp Corp | 半導体装置 |
-
2007
- 2007-04-03 JP JP2009503711A patent/JP2009533839A/ja not_active Ceased
- 2007-04-03 DE DE602007007201T patent/DE602007007201D1/de active Active
- 2007-04-03 CN CNA200780012607XA patent/CN101416302A/zh active Pending
- 2007-04-03 WO PCT/IB2007/051190 patent/WO2007116344A1/en active Application Filing
- 2007-04-03 AT AT07735369T patent/ATE471572T1/de not_active IP Right Cessation
- 2007-04-03 US US12/295,782 patent/US20090283891A1/en not_active Abandoned
- 2007-04-03 EP EP07735369A patent/EP2008303B1/de not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
EP2008303A1 (de) | 2008-12-31 |
CN101416302A (zh) | 2009-04-22 |
WO2007116344A1 (en) | 2007-10-18 |
JP2009533839A (ja) | 2009-09-17 |
DE602007007201D1 (de) | 2010-07-29 |
US20090283891A1 (en) | 2009-11-19 |
EP2008303B1 (de) | 2010-06-16 |
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