ATE486367T1 - Verfahren zur herstellung eines satzes von durch eine flexible verbindung mechanisch verbundenen chips - Google Patents

Verfahren zur herstellung eines satzes von durch eine flexible verbindung mechanisch verbundenen chips

Info

Publication number
ATE486367T1
ATE486367T1 AT08826649T AT08826649T ATE486367T1 AT E486367 T1 ATE486367 T1 AT E486367T1 AT 08826649 T AT08826649 T AT 08826649T AT 08826649 T AT08826649 T AT 08826649T AT E486367 T1 ATE486367 T1 AT E486367T1
Authority
AT
Austria
Prior art keywords
chips
producing
reception
mechanically connected
flexible connection
Prior art date
Application number
AT08826649T
Other languages
German (de)
English (en)
Inventor
Jean Brun
Bruno Mourey
Dominique Vicard
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE486367T1 publication Critical patent/ATE486367T1/de

Links

Classifications

    • H10W90/00—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W70/093—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/4519—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H10P72/74—
    • H10W44/248—
    • H10W70/611—
    • H10W70/688—
    • H10W72/0198—
    • H10W72/07537—
    • H10W72/552—
    • H10W72/553—
    • H10W90/10—
    • H10W90/753—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Die Bonding (AREA)
  • Micromachines (AREA)
  • Transmitters (AREA)
AT08826649T 2007-06-21 2008-06-20 Verfahren zur herstellung eines satzes von durch eine flexible verbindung mechanisch verbundenen chips ATE486367T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0704445A FR2917895B1 (fr) 2007-06-21 2007-06-21 Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple
PCT/FR2008/000867 WO2009013409A2 (fr) 2007-06-21 2008-06-20 Procédé de fabrication d'un assemblage de puces reliées mécaniquement au moyen d'une connexion souple

Publications (1)

Publication Number Publication Date
ATE486367T1 true ATE486367T1 (de) 2010-11-15

Family

ID=38663147

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08826649T ATE486367T1 (de) 2007-06-21 2008-06-20 Verfahren zur herstellung eines satzes von durch eine flexible verbindung mechanisch verbundenen chips

Country Status (9)

Country Link
US (2) US8471773B2 (enExample)
EP (2) EP2158604B1 (enExample)
JP (2) JP5385900B2 (enExample)
CN (2) CN101711430B (enExample)
AT (1) ATE486367T1 (enExample)
DE (1) DE602008003224D1 (enExample)
ES (1) ES2355180T3 (enExample)
FR (1) FR2917895B1 (enExample)
WO (2) WO2009004243A2 (enExample)

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Also Published As

Publication number Publication date
US8471773B2 (en) 2013-06-25
FR2917895A1 (fr) 2008-12-26
CN101681887A (zh) 2010-03-24
US8258011B2 (en) 2012-09-04
WO2009004243A2 (fr) 2009-01-08
WO2009013409A2 (fr) 2009-01-29
EP2158605A2 (fr) 2010-03-03
DE602008003224D1 (de) 2010-12-09
FR2917895B1 (fr) 2010-04-09
ES2355180T3 (es) 2011-03-23
CN101681887B (zh) 2011-08-10
CN101711430A (zh) 2010-05-19
US20100245182A1 (en) 2010-09-30
JP2010530584A (ja) 2010-09-09
EP2158604A2 (fr) 2010-03-03
WO2009004243A4 (fr) 2009-07-23
US20100136746A1 (en) 2010-06-03
WO2009004243A3 (fr) 2009-05-14
EP2158604B1 (fr) 2016-10-19
CN101711430B (zh) 2013-10-16
EP2158605B1 (fr) 2010-10-27
WO2009013409A3 (fr) 2009-05-22
JP5405457B2 (ja) 2014-02-05
JP5385900B2 (ja) 2014-01-08
JP2010530630A (ja) 2010-09-09

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