ES2355180T3 - Procedimiento de fabricación de un ensamble de chips unidos mecánicamente por medio de una conexión flexible. - Google Patents

Procedimiento de fabricación de un ensamble de chips unidos mecánicamente por medio de una conexión flexible. Download PDF

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Publication number
ES2355180T3
ES2355180T3 ES08826649T ES08826649T ES2355180T3 ES 2355180 T3 ES2355180 T3 ES 2355180T3 ES 08826649 T ES08826649 T ES 08826649T ES 08826649 T ES08826649 T ES 08826649T ES 2355180 T3 ES2355180 T3 ES 2355180T3
Authority
ES
Spain
Prior art keywords
chips
substrate
connecting element
chip
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES08826649T
Other languages
English (en)
Spanish (es)
Inventor
Jean Brun
Bruno Mourey
Dominique Vicard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Application granted granted Critical
Publication of ES2355180T3 publication Critical patent/ES2355180T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10W90/00—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W70/093—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/4519—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H10P72/74—
    • H10W44/248—
    • H10W70/611—
    • H10W70/688—
    • H10W72/0198—
    • H10W72/07537—
    • H10W72/552—
    • H10W72/553—
    • H10W90/10—
    • H10W90/753—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Die Bonding (AREA)
  • Micromachines (AREA)
  • Transmitters (AREA)
ES08826649T 2007-06-21 2008-06-20 Procedimiento de fabricación de un ensamble de chips unidos mecánicamente por medio de una conexión flexible. Active ES2355180T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0704445A FR2917895B1 (fr) 2007-06-21 2007-06-21 Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple
FR0704445 2007-06-21

Publications (1)

Publication Number Publication Date
ES2355180T3 true ES2355180T3 (es) 2011-03-23

Family

ID=38663147

Family Applications (1)

Application Number Title Priority Date Filing Date
ES08826649T Active ES2355180T3 (es) 2007-06-21 2008-06-20 Procedimiento de fabricación de un ensamble de chips unidos mecánicamente por medio de una conexión flexible.

Country Status (9)

Country Link
US (2) US8471773B2 (enExample)
EP (2) EP2158604B1 (enExample)
JP (2) JP5385900B2 (enExample)
CN (2) CN101711430B (enExample)
AT (1) ATE486367T1 (enExample)
DE (1) DE602008003224D1 (enExample)
ES (1) ES2355180T3 (enExample)
FR (1) FR2917895B1 (enExample)
WO (2) WO2009004243A2 (enExample)

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FR2986372B1 (fr) 2012-01-31 2014-02-28 Commissariat Energie Atomique Procede d'assemblage d'un element a puce micro-electronique sur un element filaire, installation permettant de realiser l'assemblage
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Also Published As

Publication number Publication date
US8471773B2 (en) 2013-06-25
FR2917895A1 (fr) 2008-12-26
ATE486367T1 (de) 2010-11-15
CN101681887A (zh) 2010-03-24
US8258011B2 (en) 2012-09-04
WO2009004243A2 (fr) 2009-01-08
WO2009013409A2 (fr) 2009-01-29
EP2158605A2 (fr) 2010-03-03
DE602008003224D1 (de) 2010-12-09
FR2917895B1 (fr) 2010-04-09
CN101681887B (zh) 2011-08-10
CN101711430A (zh) 2010-05-19
US20100245182A1 (en) 2010-09-30
JP2010530584A (ja) 2010-09-09
EP2158604A2 (fr) 2010-03-03
WO2009004243A4 (fr) 2009-07-23
US20100136746A1 (en) 2010-06-03
WO2009004243A3 (fr) 2009-05-14
EP2158604B1 (fr) 2016-10-19
CN101711430B (zh) 2013-10-16
EP2158605B1 (fr) 2010-10-27
WO2009013409A3 (fr) 2009-05-22
JP5405457B2 (ja) 2014-02-05
JP5385900B2 (ja) 2014-01-08
JP2010530630A (ja) 2010-09-09

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