ES2355180T3 - Procedimiento de fabricación de un ensamble de chips unidos mecánicamente por medio de una conexión flexible. - Google Patents

Procedimiento de fabricación de un ensamble de chips unidos mecánicamente por medio de una conexión flexible. Download PDF

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Publication number
ES2355180T3
ES2355180T3 ES08826649T ES08826649T ES2355180T3 ES 2355180 T3 ES2355180 T3 ES 2355180T3 ES 08826649 T ES08826649 T ES 08826649T ES 08826649 T ES08826649 T ES 08826649T ES 2355180 T3 ES2355180 T3 ES 2355180T3
Authority
ES
Spain
Prior art keywords
chips
substrate
connecting element
chip
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES08826649T
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English (en)
Spanish (es)
Inventor
Jean Brun
Bruno Mourey
Dominique Vicard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application granted granted Critical
Publication of ES2355180T3 publication Critical patent/ES2355180T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07786—Antenna details the antenna being of the HF type, such as a dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07537—Techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/553—Materials of bond wires not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Transmitters (AREA)
  • Micromachines (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Led Device Packages (AREA)
  • Multi-Conductor Connections (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Die Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
ES08826649T 2007-06-21 2008-06-20 Procedimiento de fabricación de un ensamble de chips unidos mecánicamente por medio de una conexión flexible. Active ES2355180T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0704445A FR2917895B1 (fr) 2007-06-21 2007-06-21 Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple
FR0704445 2007-06-21

Publications (1)

Publication Number Publication Date
ES2355180T3 true ES2355180T3 (es) 2011-03-23

Family

ID=38663147

Family Applications (1)

Application Number Title Priority Date Filing Date
ES08826649T Active ES2355180T3 (es) 2007-06-21 2008-06-20 Procedimiento de fabricación de un ensamble de chips unidos mecánicamente por medio de una conexión flexible.

Country Status (9)

Country Link
US (2) US8471773B2 (enExample)
EP (2) EP2158604B1 (enExample)
JP (2) JP5385900B2 (enExample)
CN (2) CN101711430B (enExample)
AT (1) ATE486367T1 (enExample)
DE (1) DE602008003224D1 (enExample)
ES (1) ES2355180T3 (enExample)
FR (1) FR2917895B1 (enExample)
WO (2) WO2009004243A2 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2937464B1 (fr) * 2008-10-21 2011-02-25 Commissariat Energie Atomique Assemblage d'une puce microelectronique a rainure avec un element filaire sous forme de toron et procede d'assemblage
FR2945151B1 (fr) 2009-04-30 2011-04-29 Commissariat Energie Atomique Procede de fixation d'un composant electronique sur un produit
JP5281965B2 (ja) * 2009-06-23 2013-09-04 日立Ｇｅニュークリア・エナジー株式会社 Ｉｃタグケーブル用芯線、ｉｃタグケーブル、ｉｃタグケーブルの位置検出システム及び検出方法
EP2570006A4 (en) * 2010-05-12 2018-02-28 Monolithe Semiconductor Inc. Extendable network structure
FR2961949B1 (fr) * 2010-06-24 2012-08-03 Commissariat Energie Atomique Elements a puce assembles sur des fils presentant une amorce de rupture
FR2961947B1 (fr) 2010-06-24 2013-03-15 Commissariat Energie Atomique Incorporation d'elements a puce dans un fil guipe
EP2643261A4 (en) * 2010-11-22 2018-01-17 Senseair AB Method for the wafer-level integration of shape memory alloy wires
JP5820696B2 (ja) * 2011-11-07 2015-11-24 新電元工業株式会社 半導体装置の製造方法及び半導体装置の製造用治具
DE102011120250B4 (de) 2011-12-05 2023-05-04 Volkswagen Aktiengesellschaft Telefonantennenkoppelplatte für ein Fahrzeug
FR2986372B1 (fr) * 2012-01-31 2014-02-28 Commissariat Energie Atomique Procede d'assemblage d'un element a puce micro-electronique sur un element filaire, installation permettant de realiser l'assemblage
US8927338B1 (en) 2013-06-13 2015-01-06 International Business Machines Corporation Flexible, stretchable electronic devices
US9801277B1 (en) 2013-08-27 2017-10-24 Flextronics Ap, Llc Bellows interconnect
US9231327B1 (en) 2013-08-27 2016-01-05 Flextronics Ap, Llc Electronic circuit slidable interconnect
US9674949B1 (en) 2013-08-27 2017-06-06 Flextronics Ap, Llc Method of making stretchable interconnect using magnet wires
US10015880B1 (en) 2013-12-09 2018-07-03 Multek Technologies Ltd. Rip stop on flex and rigid flex circuits
US9338915B1 (en) 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
DE102015219190A1 (de) * 2015-10-05 2017-04-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines elektronischen Bauelements und elektronisches Bauelement
FR3042203B1 (fr) 2015-10-12 2018-06-22 Commissariat A L'energie Atomique Et Aux Energies Alternatives Incorporation d'elements a puce dans un fil guipe.
GB2561490B (en) 2016-04-07 2019-02-27 Advanced E Textiles Ltd Improvements relating to textiles incorporating electronic devices
FR3058579B1 (fr) * 2016-11-07 2018-11-16 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif d'emission reception radiofrequence
FR3062515B1 (fr) 2017-01-30 2019-11-01 Primo1D Procede d'insertion d'un fil dans une rainure d'une puce de semi-conducteur, et equipement pour la mise en œuvre d’un tel procede.
FR3065578B1 (fr) 2017-04-19 2019-05-03 Primo1D Procede d'assemblage d'une puce microelectronique sur un element filaire
FR3065579B1 (fr) 2017-04-19 2019-05-03 Primo1D Dispositif d'emission reception radiofrequence
RO133013B1 (ro) * 2017-06-16 2020-09-30 Promar Textil Industries S.R.L. Etichetă rfid pentru medii agresive cu cuplaj inductiv în buclă dublă
FR3069962B1 (fr) 2017-08-01 2020-09-25 Primo1D Antenne a plaque pour coupler un terminal d’emission-reception a un dispositif rfid
FR3078980B1 (fr) 2018-03-14 2021-06-11 Primo1D Fil guipe compose d’une ame principale et d’au moins un fils de couverture et comprenant au moins un element filaire conducteur relie electriquement a au moins une puce electronique
WO2019224575A1 (en) 2018-05-22 2019-11-28 Tyco Fire & Security Gmbh Elongate flexible tag
US10438895B1 (en) 2018-06-08 2019-10-08 American Semiconductor, Inc. Flexible micro-module
US12223814B2 (en) 2019-09-16 2025-02-11 Sensormatic Electronics, LLC Security tag for textiles using conductive thread
US10783424B1 (en) 2019-09-18 2020-09-22 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
FR3103630B1 (fr) 2019-11-22 2022-06-03 Primo1D Puce fonctionnelle adaptee pour etre assemblee a des elements filaires, et procede de fabrication d’une telle puce
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US12524640B2 (en) 2019-11-27 2026-01-13 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11694057B2 (en) 2020-01-03 2023-07-04 Sensormatic Electronics, LLC RFID tag and method of making same
CN111394854B (zh) * 2020-02-26 2022-07-12 东华大学 一种法向模螺旋偶极子电子标签纱的制作方法
EP3923195B1 (fr) * 2020-06-11 2023-08-23 Primo1D Etiquette électronique présentant un caractère souple et déformable
FR3119944B1 (fr) 2021-02-15 2023-02-10 Primo1D Dispositif d'émission-réception radiofréquence utilisant une antenne composée d’un fil textile et d’un ruban conducteur et étiquette électronique associée
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article
FR3131253B1 (fr) 2021-12-23 2024-01-05 Primo1D Pneumatique équipée d’un dispositif d'émission-réception radiofréquence
CN118501673A (zh) * 2024-07-18 2024-08-16 宁波吉品科技有限公司 一种基于压电陶瓷的芯片集成测试板

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0461247A (ja) * 1990-06-28 1992-02-27 Narumi China Corp クワッド・フラット・パッケージ
DE19908172A1 (de) 1999-02-25 2000-08-31 Joergen Brosow Aufklebeplombe
NO311317B1 (no) * 1999-04-30 2001-11-12 Thin Film Electronics Asa Apparat omfattende elektroniske og/eller optoelektroniske kretser samt fremgangsmåte til å realisere og/eller integrerekretser av denne art i apparatet
US6743982B2 (en) * 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
JP4433629B2 (ja) * 2001-03-13 2010-03-17 株式会社日立製作所 半導体装置及びその製造方法
GB0108950D0 (en) * 2001-04-10 2001-05-30 Leonard Philip N Personal computer systems
DE10122324A1 (de) * 2001-05-08 2002-11-14 Philips Corp Intellectual Pty Flexible integrierte monolithische Schaltung
WO2003021679A2 (en) * 2001-09-03 2003-03-13 National Microelectronic Research Centre University College Cork - National University Of Ireland Cork Integrated circuit structure and a method of making an integrated circuit structure
AU2003205104A1 (en) * 2002-01-11 2003-07-30 The Pennsylvania State University Method of forming a removable support with a sacrificial layers and of transferring devices
US20070069341A1 (en) * 2003-05-28 2007-03-29 Mitsuo Usami Radio recognition semiconductor device and its manufacturing method
JP2005051144A (ja) * 2003-07-31 2005-02-24 Shinko Electric Ind Co Ltd 半導体装置の製造方法
CN100461410C (zh) * 2003-08-28 2009-02-11 株式会社日立制作所 半导体器件以及其制造方法
CN1263131C (zh) * 2003-10-08 2006-07-05 复旦大学 射频标签芯片与片外天线阻抗匹配片内自动调节的电路
US7338836B2 (en) * 2003-11-05 2008-03-04 California Institute Of Technology Method for integrating pre-fabricated chip structures into functional electronic systems
JP4291209B2 (ja) * 2004-05-20 2009-07-08 エルピーダメモリ株式会社 半導体装置の製造方法
KR101197046B1 (ko) * 2005-01-26 2012-11-06 삼성디스플레이 주식회사 발광다이오드를 사용하는 2차원 광원 및 이를 이용한 액정표시 장치
KR20090127173A (ko) * 2005-02-16 2009-12-09 가부시키가이샤 히타치세이사쿠쇼 전자 태그용 반도체 장치 및 ｒｆｉｄ 태크
JP2008532122A (ja) * 2005-02-23 2008-08-14 テクスティルマ・アクチェンゲゼルシャフト トランスポンダ糸およびそれを使用した製品
US20060285480A1 (en) * 2005-06-21 2006-12-21 Janofsky Eric B Wireless local area network communications module and integrated chip package
JP5044984B2 (ja) * 2005-06-29 2012-10-10 大日本印刷株式会社 Ｉｃタグ、ｉｃタグの製造方法、およびｉｃタグの製造装置、並びに、インターポーザ、インターポーザの製造方法、およびインターポーザの製造装置
US7621043B2 (en) * 2005-11-02 2009-11-24 Checkpoint Systems, Inc. Device for making an in-mold circuit
JP2009533839A (ja) * 2006-04-07 2009-09-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 弾性変形可能な集積回路装置
US8017441B2 (en) * 2006-06-02 2011-09-13 Hiachi, Ltd. Method for manufacturing IC tag inlet
WO2008081699A1 (ja) * 2006-12-28 2008-07-10 Philtech Inc. 基体シート
US8154456B2 (en) * 2008-05-22 2012-04-10 Philtech Inc. RF powder-containing base

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CN101711430B (zh) 2013-10-16
CN101681887A (zh) 2010-03-24
CN101681887B (zh) 2011-08-10
JP5405457B2 (ja) 2014-02-05
FR2917895B1 (fr) 2010-04-09
EP2158604B1 (fr) 2016-10-19
US20100136746A1 (en) 2010-06-03
CN101711430A (zh) 2010-05-19
FR2917895A1 (fr) 2008-12-26
ATE486367T1 (de) 2010-11-15
WO2009004243A3 (fr) 2009-05-14
WO2009004243A2 (fr) 2009-01-08
EP2158604A2 (fr) 2010-03-03
DE602008003224D1 (de) 2010-12-09
US8258011B2 (en) 2012-09-04
JP2010530584A (ja) 2010-09-09
US8471773B2 (en) 2013-06-25
EP2158605A2 (fr) 2010-03-03
JP2010530630A (ja) 2010-09-09
US20100245182A1 (en) 2010-09-30
WO2009013409A2 (fr) 2009-01-29
WO2009013409A3 (fr) 2009-05-22
EP2158605B1 (fr) 2010-10-27
JP5385900B2 (ja) 2014-01-08
WO2009004243A4 (fr) 2009-07-23

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