CN101711430B - 射频芯片的组装 - Google Patents

射频芯片的组装 Download PDF

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Publication number
CN101711430B
CN101711430B CN200880021239XA CN200880021239A CN101711430B CN 101711430 B CN101711430 B CN 101711430B CN 200880021239X A CN200880021239X A CN 200880021239XA CN 200880021239 A CN200880021239 A CN 200880021239A CN 101711430 B CN101711430 B CN 101711430B
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chip
chips
connection
antenna
radio frequency
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CN101711430A (zh
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多米尼克·维卡尔
吉恩·布朗
贝诺特·利宾娜
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Commissariat a lEnergie Atomique CEA
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    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
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    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
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    • H01Q1/00—Details of, or arrangements associated with, antennas
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    • Y10T29/00—Metal working
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Die Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Micromachines (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Transmitters (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Led Device Packages (AREA)
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CN200880021239XA 2007-06-21 2008-06-18 射频芯片的组装 Active CN101711430B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0704445A FR2917895B1 (fr) 2007-06-21 2007-06-21 Procede de fabrication d'un assemblage de puces reliees mecaniquement au moyen d'une connexion souple
FR0704445 2007-06-21
PCT/FR2008/051079 WO2009004243A2 (fr) 2007-06-21 2008-06-18 Assemblage de puces radiofrequence

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CN101711430A CN101711430A (zh) 2010-05-19
CN101711430B true CN101711430B (zh) 2013-10-16

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CN2008800212154A Expired - Fee Related CN101681887B (zh) 2007-06-21 2008-06-20 通过柔性连接而机械互连的成套芯片的制造方法

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CN2008800212154A Expired - Fee Related CN101681887B (zh) 2007-06-21 2008-06-20 通过柔性连接而机械互连的成套芯片的制造方法

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US (2) US8471773B2 (enExample)
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CN101681887A (zh) 2010-03-24
DE602008003224D1 (de) 2010-12-09
WO2009004243A2 (fr) 2009-01-08
EP2158604B1 (fr) 2016-10-19
JP5385900B2 (ja) 2014-01-08
US8471773B2 (en) 2013-06-25
CN101681887B (zh) 2011-08-10
WO2009004243A3 (fr) 2009-05-14
US20100136746A1 (en) 2010-06-03
FR2917895A1 (fr) 2008-12-26
US8258011B2 (en) 2012-09-04
US20100245182A1 (en) 2010-09-30
EP2158604A2 (fr) 2010-03-03
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ATE486367T1 (de) 2010-11-15
JP2010530584A (ja) 2010-09-09
JP2010530630A (ja) 2010-09-09
FR2917895B1 (fr) 2010-04-09
ES2355180T3 (es) 2011-03-23
CN101711430A (zh) 2010-05-19
JP5405457B2 (ja) 2014-02-05
WO2009013409A3 (fr) 2009-05-22

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