DE602007012125D1 - Verfahren für den anschluss einer antenne an einen transponderchip und entsprechendes einlagensubstrat - Google Patents
Verfahren für den anschluss einer antenne an einen transponderchip und entsprechendes einlagensubstratInfo
- Publication number
- DE602007012125D1 DE602007012125D1 DE602007012125T DE602007012125T DE602007012125D1 DE 602007012125 D1 DE602007012125 D1 DE 602007012125D1 DE 602007012125 T DE602007012125 T DE 602007012125T DE 602007012125 T DE602007012125 T DE 602007012125T DE 602007012125 D1 DE602007012125 D1 DE 602007012125D1
- Authority
- DE
- Germany
- Prior art keywords
- transponder chip
- antenna
- substrate
- corresponding insert
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G06K19/07773—Antenna details
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- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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US11/733,756 US7546671B2 (en) | 2006-09-26 | 2007-04-10 | Method of forming an inlay substrate having an antenna wire |
PCT/EP2007/059340 WO2008037579A1 (en) | 2006-09-26 | 2007-09-06 | Method of connecting an antenna to a transponder chip and corresponding inlay substrate |
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US7707706B2 (en) | 2007-06-29 | 2010-05-04 | Ruhlamat Gmbh | Method and arrangement for producing a smart card |
DE102007030650B4 (de) * | 2007-07-02 | 2011-05-05 | Ruhlamat Automatisierungstechnik Gmbh | Verfahren zur Herstellung einer Chipkarte |
EP2302566B1 (de) * | 2009-09-22 | 2013-03-27 | ats Automation Technology Services | Verfahren zum Anschließen von mindestens einem Drahtleiter auf einem Substrat mit einem Chip in einer Transpondereinheit |
US8633777B2 (en) * | 2009-12-01 | 2014-01-21 | Qualcomm Incorporated | Methods and apparatus for inductors with integrated passive and active elements |
US8919915B2 (en) * | 2012-02-21 | 2014-12-30 | Xerox Corporation | Ultrasonic laminating of materials for ink jet printheads |
EP2783783B1 (de) * | 2013-03-27 | 2021-12-01 | BSH Hausgeräte GmbH | Verfahren zur Bearbeitung zumindest einer Litzendrahteinheit |
US9748035B2 (en) | 2013-09-10 | 2017-08-29 | The Charles Stark Draper Laboratory, Inc. | Methods for forming chip-scale electrical components |
DE102014000133B4 (de) * | 2014-01-13 | 2015-10-15 | Melzer Maschinenbau Gmbh | Verfahren und Einrichtung zur Bearbeitung eines Substrats |
JP5989198B2 (ja) * | 2015-07-17 | 2016-09-07 | 株式会社トッパンTdkレーベル | 非接触通信媒体の製造方法、及びアンテナと回路装置の接続方法 |
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US11631942B2 (en) | 2020-05-07 | 2023-04-18 | Arris Enterprises Llc | Hybrid antenna with polarization flexibility |
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DE19616424A1 (de) | 1996-04-25 | 1997-10-30 | Manfred Dr Michalk | Elektrisch isolierendes Material mit einem elektronischen Modul |
DE19646717B4 (de) * | 1996-11-12 | 2004-05-06 | Manfred Rietzler | Chipkarte mit Chipkartenmodul |
DE19745648A1 (de) * | 1997-10-15 | 1998-11-26 | Siemens Ag | Trägerelement für einen Halbleiterchip zum Einbau in Chipkarten |
WO2000021030A1 (en) * | 1998-10-06 | 2000-04-13 | Intermec Ip Corp. | Rfid transponder having improved rf characteristics |
DE19920399C1 (de) * | 1999-05-04 | 2001-01-25 | Cubit Electronics Gmbh | Verfahren und Vorrichtung zur Herstellung von Leiterdrähten auf oder in einer elektrisch isolierenden Schicht |
DE102004045896B4 (de) * | 2004-09-22 | 2007-01-18 | Mühlbauer Ag | Transponder mit Antenne und Flip-Chip-Modul und Verfahren zu dessen Herstellung |
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- 2007-09-06 WO PCT/EP2007/059340 patent/WO2008037579A1/en active Application Filing
- 2007-09-06 KR KR1020097006031A patent/KR101108361B1/ko active IP Right Grant
- 2007-09-06 EP EP07820048A patent/EP2070016B1/de active Active
- 2007-09-06 DE DE602007012125T patent/DE602007012125D1/de active Active
- 2007-09-06 AT AT07820048T patent/ATE496347T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2008037579A1 (en) | 2008-04-03 |
KR101108361B1 (ko) | 2012-01-25 |
EP2070016B1 (de) | 2011-01-19 |
ATE496347T1 (de) | 2011-02-15 |
KR20090058529A (ko) | 2009-06-09 |
EP2070016A1 (de) | 2009-06-17 |
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