DE59701709C5 - Verfahren und vorrichtung zur kontaktierung eines drahtleiters - Google Patents

Verfahren und vorrichtung zur kontaktierung eines drahtleiters Download PDF

Info

Publication number
DE59701709C5
DE59701709C5 DE59701709.3T DE59701709T DE59701709C5 DE 59701709 C5 DE59701709 C5 DE 59701709C5 DE 59701709 T DE59701709 T DE 59701709T DE 59701709 C5 DE59701709 C5 DE 59701709C5
Authority
DE
Germany
Prior art keywords
void
void void
axis
aluminum surface
pretreatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE59701709.3T
Other languages
English (en)
Other versions
DE59701709D1 (de
Inventor
David Finn
Manfred Rietzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smartrac IP BV
Original Assignee
Smartrac IP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19619771A external-priority patent/DE19619771A1/de
Priority claimed from DE1996120242 external-priority patent/DE19620242C2/de
Application filed by Smartrac IP BV filed Critical Smartrac IP BV
Priority claimed from PCT/DE1997/000261 external-priority patent/WO1997030418A2/de
Application granted granted Critical
Publication of DE59701709D1 publication Critical patent/DE59701709D1/de
Publication of DE59701709C5 publication Critical patent/DE59701709C5/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/05599Material
    • H01L2224/056Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624Aluminium [Al] as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45015Cross-sectional shape being circular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147Copper (Cu) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/4813Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485Material
    • H01L2224/48505Material at the bonding interface
    • H01L2224/48799Principal constituent of the connecting portion of the wire connector being Copper (Cu)
    • H01L2224/488Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48817Principal constituent of the connecting portion of the wire connector being Copper (Cu) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
    • H01L2224/48824Aluminium (Al) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85203Thermocompression bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01028Nickel [Ni]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12042LASER
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49149Assembling terminal to base by metal fusion bonding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49151Assembling terminal to base by deforming or shaping
    • Y10T29/49153Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/51Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5187Wire working
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/51Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5193Electrical connector or terminal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/532Conductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/532Conductor
    • Y10T29/53209Terminal or connector
    • Y10T29/53213Assembled to wire-type conductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/532Conductor
    • Y10T29/53209Terminal or connector
    • Y10T29/53213Assembled to wire-type conductor
    • Y10T29/53235Means to fasten by deformation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/532Conductor
    • Y10T29/53243Multiple, independent conductors

Abstract

Nichtig

Description

  • Der 2. Senat (Nichtigkeitssenat) des Bundespatentgerichts hat auf die mündliche Verhandlung vom 20. Oktober 2011 für Recht erkannt:
    Das europäische Patent 0 880 754 wird mit Wirkung für das Hoheitsgebiet der Bundesrepublik Deutschland im Umfang der Patentansprüche 1 bis 4, 6 bis 13, 16 bis 18, 23 bis 32, 34 sowie 36 bis 39 teilweise für nichtig erklärt.

Claims (35)

  1. Nichtig
  2. Nichtig
  3. Nichtig
  4. Nichtig
  5. Verfahren nach einem oder mehreren der vorangehenden Ansprüche, dadurch gekennzeichnet, daß die Querbewegung (24) längs einer im Winkel zur Achse der Verlegebewegung (29) veränderbaren Querbewegungsachse erfolgt.
  6. Nichtig
  7. Nichtig
  8. Nichtig
  9. Nichtig
  10. Nichtig
  11. Nichtig
  12. Nichtig
  13. Nichtig
  14. Anwendung des Verfahrens nach einem oder mehreren der Ansprüche 4 bis 9 zur Herstellung einer rotationssymmetrischen Körperspule, dadurch gekennzeichnet, daß der Drahtleiter (20) auf einem als Wicklungsträger (80) ausgebildeten, relativ zur Verlegevorrichtung (22) rotierenden Substrat verlegt wird.
  15. Verfahren nach Anspruch 14, gekennzeichnet durch die Herstellung einer einstückig mit einer Schwingmembran verbundenen Tauchspule einer Lautsprechereinheit.
  16. Nichtig
  17. Nichtig
  18. Nichtig
  19. Verfahren nach Anspruch 17, dadurch gekennzeichnet, daß die Aluminiumoberfläche zur Vorbehandlung mit einem Reinigungsverfahren beaufschlagt wird.
  20. Verfahren nach Anspruch 19, dadurch gekennzeichnet, daß als Reinigungsverfahren ein Trockenätzverfahren, ein Naßätzverfahren oder eine Laserbeaufschlagung der Aluminiumoberfläche eingesetzt wird.
  21. Verfahren nach Anspruch 17, dadurch gekennzeichnet, daß die Aluminiumoberfläche zur Vorbehandlung mit einer mehrschichtigen Kontaktmetallisierung (138, 139) mit einer auf die Aluminiumfläche als Zwischenschicht (140) aufgebrachten Zinkatschicht und einer für die Kontaktierung mit dem Drahtleiter (113) vorgesehenen Verbindungsschicht (141, 142) versehen wird.
  22. Verfahren nach Anspruch 21, dadurch gekennzeichnet, daß die Verbindungsschicht als eine Nickel- oder Palladium aufweisende Schicht ausgebildet ist.
  23. Nichtig
  24. Nichtig
  25. Nichtig
  26. Nichtig
  27. Nichtig
  28. Nichtig
  29. Nichtig
  30. Nichtig
  31. Nichtig
  32. Nichtig
  33. Vorrichtung nach Anspruch 32, dadurch gekennzeichnet, daß der Ultraschalloszillator derart angeordnet ist, daß die Achse seiner Wirkrichtung veränderbar ist.
  34. Nichtig
  35. Vorrichtung nach Anspruch 34, gekennzeichnet durch eine mit einer Schwingungsstempelachse (97) koaxiale Schwenkachse (100).
DE59701709.3T 1996-02-12 1997-02-12 Verfahren und vorrichtung zur kontaktierung eines drahtleiters Expired - Lifetime DE59701709C5 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DE19604840 1996-02-12
DE19604840 1996-02-12
DE19619771A DE19619771A1 (de) 1996-02-12 1996-05-17 Verfahren und Vorrichtung zur Verlegung eines Drahtleiters auf einem Substrat sowie hiermit hergestellte Substrate
DE19619771 1996-05-17
DE1996120242 DE19620242C2 (de) 1996-05-20 1996-05-20 Verfahren und Vorrichtung zur Kontaktierung eines Drahtleiters bei der Herstellung einer Transpondereinheit
DE19620242 1996-05-20
PCT/DE1997/000261 WO1997030418A2 (de) 1996-02-12 1997-02-12 Verfahren und vorrichtung zur kontaktierung eines drahtleiters

Publications (2)

Publication Number Publication Date
DE59701709D1 DE59701709D1 (de) 2000-06-21
DE59701709C5 true DE59701709C5 (de) 2014-01-09

Family

ID=27512494

Family Applications (1)

Application Number Title Priority Date Filing Date
DE59701709.3T Expired - Lifetime DE59701709C5 (de) 1996-02-12 1997-02-12 Verfahren und vorrichtung zur kontaktierung eines drahtleiters

Country Status (3)

Country Link
US (1) US6698089B2 (de)
KR (1) KR100373063B1 (de)
DE (1) DE59701709C5 (de)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6628240B2 (en) * 2000-11-08 2003-09-30 American Pacific Technology Method and apparatus for rapid staking of antennae in smart card manufacture
US20060097911A1 (en) * 2002-07-03 2006-05-11 Quelis Id Systems Inc. Wire positioning and mechanical attachment for a radio-frequency indentification device
AU2003258171A1 (en) * 2002-08-12 2004-02-25 Mobilewise, Inc. Wireless power supply system for small devices
ATE408870T1 (de) * 2004-03-25 2008-10-15 Bauer Eric Verfahren zur herstellung eines elektronischen labels
JP4444771B2 (ja) * 2004-09-14 2010-03-31 株式会社沖データ 部材固定具及び電子機器
US20060090332A1 (en) * 2004-10-28 2006-05-04 Vahid Taban Contactless conveyor system for the production of smart cards
CA2585168C (en) * 2004-11-02 2014-09-09 Imasys Ag Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
EP2070016B1 (de) * 2006-09-26 2011-01-19 Féinics AmaTech Teoranta Verfahren für den anschluss einer antenne an einen transponderchip und entsprechendes einlagensubstrat
EP2070013A2 (de) * 2006-09-26 2009-06-17 HID Global GmbH Verfahren für den anschluss einer antenne an einen transponderchip und entsprechendes einlagensubstrat
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
KR101313122B1 (ko) 2006-09-26 2013-09-30 에이치아이디 글로벌 게엠베하 트랜스폰더 칩 및 관련 인레이 기판에의 안테나 연결 방법
US7979975B2 (en) * 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
WO2008037592A1 (en) 2006-09-26 2008-04-03 Advanced Micromechanic And Automation Technology Ltd Method of connecting an antenna to a transponder chip and corresponding transponder inlay
US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7546671B2 (en) * 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
IL184260A0 (en) 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
US7707706B2 (en) * 2007-06-29 2010-05-04 Ruhlamat Gmbh Method and arrangement for producing a smart card
DE102007030650B4 (de) * 2007-07-02 2011-05-05 Ruhlamat Automatisierungstechnik Gmbh Verfahren zur Herstellung einer Chipkarte
ES2355682T3 (es) 2007-09-18 2011-03-30 Hid Global Ireland Teoranta Procedimiento para la unión de un conductor de cable dispuesto sobre un sustrato.
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US8522431B2 (en) 2008-01-09 2013-09-03 Féines Amatech Teoranta Mounting and connecting an antenna wire in a transponder
US20110247197A1 (en) 2008-01-09 2011-10-13 Feinics Amatech Teoranta Forming channels for an antenna wire of a transponder
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
DE102009003312A1 (de) 2008-10-14 2010-04-15 Hesse & Knipps Gmbh Bondvorrichtung, Ultraschall-Transducer und Bondverfahren
DE102009012255A1 (de) * 2009-03-07 2010-09-09 Michalk, Manfred, Dr. Schaltungsanordnung
KR100972417B1 (ko) * 2009-06-19 2010-07-27 수퍼나노텍(주) 초음파 열융착 방식을 이용한 rf 안테나 및 그 제조방법
DE102009038620B4 (de) * 2009-08-26 2012-05-24 Melzer Maschinenbau Gmbh Verfahren und Vorrichtung zur Herstellung einer Transpondereinheit
US8366009B2 (en) 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
US8613132B2 (en) * 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate
KR20130108068A (ko) 2010-05-04 2013-10-02 페이닉스 아마테크 테오란타 Rfid 인레이의 제조
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
US9033250B2 (en) * 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
WO2012020073A2 (en) 2010-08-12 2012-02-16 Féinics Amatech Teoranta Limited Rfid antenna modules and increasing coupling
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
US9633304B2 (en) 2010-08-12 2017-04-25 Féinics Amatech Teoranta Booster antenna configurations and methods
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
EP2718876A1 (de) 2011-06-04 2014-04-16 Féinics AmaTech Teoranta Herstellung eines substrats zum einbetten eines drahtes
US9475086B2 (en) 2013-01-18 2016-10-25 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US9390364B2 (en) 2011-08-08 2016-07-12 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
US9251458B2 (en) 2011-09-11 2016-02-02 Féinics Amatech Teoranta Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles
JP2014529927A (ja) 2011-08-08 2014-11-13 フェニックスアマテック テオランタ Rfidスマートカードに関する結合の向上
US10518518B2 (en) 2013-01-18 2019-12-31 Féinics Amatech Teoranta Smart cards with metal layer(s) and methods of manufacture
US10867235B2 (en) 2011-08-08 2020-12-15 Féinics Amatech Teoranta Metallized smartcard constructions and methods
US10733494B2 (en) 2014-08-10 2020-08-04 Féinics Amatech Teoranta Contactless metal card constructions
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
CN103930906A (zh) 2011-08-08 2014-07-16 菲尼克斯阿美特克有限公司 改进rfid智能卡中的耦合和改进与rfid智能卡的耦合
US9798968B2 (en) 2013-01-18 2017-10-24 Féinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
MX336040B (es) 2011-09-11 2016-01-07 Feinics Amatech Teoranta Modulos de antena rfid y procedimientos de fabricacion.
JP5884471B2 (ja) * 2011-12-26 2016-03-15 凸版印刷株式会社 モジュール基板の製造方法及びその製造装置
US10518490B2 (en) 2013-03-14 2019-12-31 Board Of Regents, The University Of Texas System Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices
US9414501B2 (en) 2012-01-04 2016-08-09 Board Of Regents, The University Of Texas System Method for connecting inter-layer conductors and components in 3D structures
US10748867B2 (en) 2012-01-04 2020-08-18 Board Of Regents, The University Of Texas System Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices
WO2013110625A1 (en) 2012-01-23 2013-08-01 Féinics Amatech Teoranta Offsetting shielding and enhancing coupling in metallized smart cards
KR20140123562A (ko) 2012-02-05 2014-10-22 페이닉스 아마테크 테오란타 Rfid 안테나 모듈 및 방법
EP2704186A1 (de) * 2012-08-27 2014-03-05 Garreth Finlay Verfahren zum Verlegen eines Drahtleiters auf einem Träger und zum Anschließen desselben an einem Chip
US10762413B2 (en) 2012-08-30 2020-09-01 Féinics Amatech Teoranta Booster antenna configurations and methods
US10783426B2 (en) 2012-08-30 2020-09-22 David Finn Dual-interface metal hybrid smartcard
US10824931B2 (en) 2012-08-30 2020-11-03 Féinics Amatech Teoranta Contactless smartcards with multiple coupling frames
US10552722B2 (en) 2014-08-10 2020-02-04 Féinics Amatech Teoranta Smartcard with coupling frame antenna
FR2995709A1 (fr) 2012-09-18 2014-03-21 Arjowiggins Security Procede de fabrication d'une structure a puce electronique et structure ainsi fabriquee.
US11354558B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Contactless smartcards with coupling frames
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US11341389B2 (en) 2013-01-18 2022-05-24 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
US10977542B2 (en) 2013-01-18 2021-04-13 Amtech Group Limited Industrial Estate Smart cards with metal layer(s) and methods of manufacture
US10599972B2 (en) 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
US11928537B2 (en) 2013-01-18 2024-03-12 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
EP2784724A3 (de) 2013-03-27 2015-04-22 Féinics AmaTech Teoranta Selektive Abscheidung von magnetischen Teilchen und Verwendung von magnetischem Material als Trägermedium zur Abscheidung anderer Teilchen
EP3005242A1 (de) 2013-05-28 2016-04-13 Féinics AmaTech Teoranta Antennenmodule für doppelschnittstellen-chipkarten, verstärkungsantennenkonfigurationen und verfahren
EP3014531B1 (de) * 2013-06-29 2022-07-20 Féinics AmaTech Teoranta Kartenkörper und chipkarte mit diesem körper
US9908037B2 (en) 2013-07-11 2018-03-06 Board Of Regents, The University Of Texas System Electronic gaming die
EP3069303B1 (de) 2013-11-13 2022-07-20 Féinics AmaTech Teoranta Smartcard mit kopplungsrahmen und verfahren zur vergrösserung des aktivierungsabstands eines transponder-chipmoduls
EP3086208B1 (de) 2015-04-24 2019-03-06 Nxp B.V. Chipkarte mit berührungsbasierter benutzerschnittstelle
EP3222513A1 (de) * 2016-03-24 2017-09-27 Airbus Operations GmbH Verfahren zur herstellung einer verkleidungsplatte mit integriertem elektrischem verbinder für ein luft- oder raumfahrzeug, verkleidungsplatte und verkleidungsplattenanordnung
EP3602680B1 (de) 2017-03-29 2024-01-17 Féinics AmaTech Teoranta Chipkarte mit koppelrahmenantenne
KR102001243B1 (ko) * 2017-11-28 2019-07-17 신혜중 다중 와이어를 선으로 하는 안테나 선 형성을 위한 와이어 임베딩 헤드
WO2019173455A1 (en) 2018-03-07 2019-09-12 X-Card Holdings, Llc Metal card
DE102018117364A1 (de) * 2018-07-18 2020-01-23 Infineon Technologies Ag Verfahren und Vorrichtung zum Trimmen einer auf einem Träger aufgebrachten Antenne, Verfahren zum Herstellen einer Trägerstruktur, Trägerstruktur und Chipkarte
FR3098785A1 (fr) * 2019-07-15 2021-01-22 Compagnie Plastic Omnium Se Procédé de fabrication d’un élément de carrosserie muni d’une piste conductrice
US11465354B2 (en) * 2020-01-06 2022-10-11 The Boeing Company Fabrication of additive manufacturing parts

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3459355A (en) 1967-10-11 1969-08-05 Gen Motors Corp Ultrasonic welder for thin wires
US4213556A (en) * 1978-10-02 1980-07-22 General Motors Corporation Method and apparatus to detect automatic wire bonder failure
FR2585210B1 (fr) * 1985-07-19 1994-05-06 Kollmorgen Technologies Corp Procede de fabrication de plaquettes a circuits d'interconnexion
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US5186378A (en) * 1991-09-30 1993-02-16 Texas Instruments Incorporated Method and apparatus for transducer heating in low temperature bonding
US5365657A (en) * 1993-02-01 1994-11-22 Advanced Interconnection Technology Method and apparatus for cutting wire
FR2716281B1 (fr) 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4410732C2 (de) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
EP0864392B1 (de) * 1997-03-13 2001-08-16 F & K Delvotec Bondtechnik GmbH Bondkopf

Also Published As

Publication number Publication date
US20010054230A1 (en) 2001-12-27
KR19990082483A (ko) 1999-11-25
KR100373063B1 (ko) 2003-05-12
DE59701709D1 (de) 2000-06-21
US6698089B2 (en) 2004-03-02

Similar Documents

Publication Publication Date Title
DE59701709C5 (de) Verfahren und vorrichtung zur kontaktierung eines drahtleiters
DE50110460D1 (de) Verfahren zur Herstellung eines Halbleiter-Metallkontaktes durch eine dielektrische Schicht
US6245445B1 (en) Rough electrical contact surface
DE112012000993B4 (de) Unschädliches Verfahren zur Herstellung von durchgehenden leitenden Leiterbahnen auf den Oberflächen eines nicht-leitenden Substrats
DE2756801A1 (de) Stromlose abscheidung von metallen
ATE285346T1 (de) Verfahren zum herstellen eines kraftfahrzeug- formbauteils mit einer integrierten leiterbahn und kraftfahrzeug-formbauteil
EP0807836A3 (de) Verfahren zur Herstellung eines integriert optischen Wellenleiterbauteils sowie Anordnung
DE69011203T2 (de) Verfahren zur Herstellung einer Halbleitervorrichtung durch Abdecken einer leitenden Schicht mit einer Nitridschicht.
DE1640436A1 (de) Elektrische Widerstaende und Verfahren zu ihrer Herstellung
DE10132788A1 (de) Qualitativ hochwertige optische Oberfläche und Verfahren zu ihrer Herstellung
DE3235236A1 (de) Oberflaechenwellenfilter, sowie verfahren zur herstellung einer bedaempfungsschicht fuer oberflaechenwellenfilter
AT312075B (de) Verfahren und Vorrichtung zur Herstellung einer Litze aus Metalldrähten, wobei die Drähte mit einer galvanisch aufgebrachten Oberflächenbeschichtung eines anderen Metalles versehen sind
DE1446214A1 (de) Verfahren zum Aufbringen von metallischen UEberzuegen auf Dielektrika
ATE259537T1 (de) Feindraht bzw. feinstdraht für die anwendung in einem fasermaterial sowie anwendung eines solchen feindrahtes zbw. feinstdrahtes
US6711925B2 (en) Process for manufacturing a conductive wire suitable for use in semiconductor packages
DE1957031A1 (de) Verfahren zum Herstellen von Zinnschichten der Zinnlegierungsschichten auf Draht aus Kupfer oder Kupferlegierungen durch Feuerverzinnen und Vorrichtung zur Durchfuehrung des Verfahrens
DE69903825T2 (de) Verfahren und werkzeug zum ziehen von metalldraht
DE102005054267B3 (de) Halbleiterbauteil und Verfahren zu dessen Herstellung sowie Verwendung des Elektrospinningverfahrens
DE20004244U1 (de) Geschirrkorb für eine Geschirrspülmaschine
KR960028982A (ko) 피복방법
DE4425110C1 (de) Wäßriges Bad für die galvanische Abscheidung von Palladiumüberzügen, Verfahren der galvanischen Abscheidung sowie Verwendung des Bades
DE102005061799B4 (de) Verfahren zur Metallisierung von Silberoberflächen und seine Verwendung
WO2001003174A1 (de) Verfaren zum selektiven beschichten keramischer oberflächen
EP0967635A3 (de) Verfahren zur Herstellung einer gebondeten, aluminiumhaltiges Material enthaltenden Vorrichtung
DE3866986D1 (de) Verfahren zur modifizierung der oberflaeche eines substrates durch bildung einer legierung, anwendung des verfahrens, insbesondere bei eisenlegierungen und bei katalysatoren sowie legierungen, die nach diesem verfahren hergestellt sind.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ASSA ABLOY IDENTIFICATION TECHNOLOGY GROUP AB, STO

Owner name: RIETZLER, MANFRED, 87616 MARKTOBERDORF, DE

8328 Change in the person/name/address of the agent

Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUSSER

8381 Inventor (new situation)

Inventor name: FINN, DAVID, 87629 FUESSEN, DE

Inventor name: RIETZLER, MANFRED, 87616 MARKTOBERDORF, DE

8310 Action for declaration of annulment
8327 Change in the person/name/address of the patent owner

Owner name: SMARTRAC IP B.V., AMSTERDAM, NL

8328 Change in the person/name/address of the agent

Representative=s name: PATENT- UND RECHTSANWAELTE BOECK - TAPPE - V.D. ST

8313 Request for invalidation rejected/withdrawn
8310 Action for declaration of annulment