JP2009051002A5 - - Google Patents

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Publication number
JP2009051002A5
JP2009051002A5 JP2008209142A JP2008209142A JP2009051002A5 JP 2009051002 A5 JP2009051002 A5 JP 2009051002A5 JP 2008209142 A JP2008209142 A JP 2008209142A JP 2008209142 A JP2008209142 A JP 2008209142A JP 2009051002 A5 JP2009051002 A5 JP 2009051002A5
Authority
JP
Japan
Prior art keywords
polishing
elements
polishing pad
points
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008209142A
Other languages
English (en)
Japanese (ja)
Other versions
JP5389395B2 (ja
JP2009051002A (ja
Filing date
Publication date
Priority claimed from US11/893,785 external-priority patent/US7828634B2/en
Application filed filed Critical
Publication of JP2009051002A publication Critical patent/JP2009051002A/ja
Publication of JP2009051002A5 publication Critical patent/JP2009051002A5/ja
Application granted granted Critical
Publication of JP5389395B2 publication Critical patent/JP5389395B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008209142A 2007-08-16 2008-08-15 相互接続された多要素格子研磨パッド Active JP5389395B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/893,785 US7828634B2 (en) 2007-08-16 2007-08-16 Interconnected-multi-element-lattice polishing pad
US11/893,785 2007-08-16

Publications (3)

Publication Number Publication Date
JP2009051002A JP2009051002A (ja) 2009-03-12
JP2009051002A5 true JP2009051002A5 (enExample) 2013-07-11
JP5389395B2 JP5389395B2 (ja) 2014-01-15

Family

ID=40363344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008209142A Active JP5389395B2 (ja) 2007-08-16 2008-08-15 相互接続された多要素格子研磨パッド

Country Status (7)

Country Link
US (1) US7828634B2 (enExample)
EP (1) EP2025457A3 (enExample)
JP (1) JP5389395B2 (enExample)
KR (1) KR101483306B1 (enExample)
CN (1) CN101367190B (enExample)
SG (1) SG150467A1 (enExample)
TW (1) TWI429502B (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
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US7635290B2 (en) 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US7530887B2 (en) * 2007-08-16 2009-05-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with controlled wetting
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US8801949B2 (en) 2011-09-22 2014-08-12 Dow Global Technologies Llc Method of forming open-network polishing pads
US9108291B2 (en) 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
US8894799B2 (en) 2011-09-22 2014-11-25 Dow Global Technologies Llc Method of forming layered-open-network polishing pads
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN113146464A (zh) 2016-01-19 2021-07-23 应用材料公司 多孔化学机械抛光垫
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019026021A1 (en) * 2017-08-04 2019-02-07 3M Innovative Properties Company MICRO-REPLICATED POLISHING SURFACE WITH IMPROVED COPLANARITY
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
AU2018380006A1 (en) 2017-12-04 2020-06-25 California Institute Of Technology Metasurface-assisted 3D beam shaping
TWI674172B (zh) * 2018-03-30 2019-10-11 中國砂輪企業股份有限公司 立體研磨工具及其製造方法
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11541736B2 (en) * 2019-06-04 2023-01-03 Fca Us Llc Multiple position vehicle cover
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11833638B2 (en) * 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (25)

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US2740239A (en) * 1953-07-02 1956-04-03 Bay State Abrasive Products Co Flexible abrasive products
US2984052A (en) * 1959-08-12 1961-05-16 Norton Co Coated abrasives
US3861892A (en) * 1973-02-08 1975-01-21 Norton Co Coated abrasive material and manner of manufacture
US4282011A (en) * 1980-05-30 1981-08-04 Dan River Incorporated Woven fabrics containing glass fibers and abrasive belts made from same
JPH0398759A (ja) * 1989-09-07 1991-04-24 Nec Corp ポリシングパッド及びその製造方法
US5131924A (en) * 1990-02-02 1992-07-21 Wiand Ronald C Abrasive sheet and method
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5871392A (en) * 1996-06-13 1999-02-16 Micron Technology, Inc. Under-pad for chemical-mechanical planarization of semiconductor wafers
CA2192880C (en) * 1996-12-13 2005-02-22 Brian H. Parrott Sanding devices and the like for removing materials
JPH1199468A (ja) * 1997-09-29 1999-04-13 Toshiba Corp 研磨パッド及びそれを用いた研磨装置
JP2918883B1 (ja) * 1998-07-15 1999-07-12 日本ピラー工業株式会社 研磨パッド
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US20030013397A1 (en) * 2001-06-27 2003-01-16 Rhoades Robert L. Polishing pad of polymer coating
ES2203295B1 (es) * 2001-10-03 2005-06-01 Airtel Movil, S.A. Sistema y procedimiento de acceso a la informacion de abonado de una red de telefonia movil desde la red tcp/ip.
US20040226620A1 (en) * 2002-09-26 2004-11-18 Daniel Therriault Microcapillary networks
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US20040259479A1 (en) 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
US7604529B2 (en) * 2006-02-16 2009-10-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
US7503833B2 (en) * 2006-02-16 2009-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
US7517277B2 (en) * 2007-08-16 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Layered-filament lattice for chemical mechanical polishing

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