SG150467A1 - Interconnected-multi-element-lattice polishing pad - Google Patents

Interconnected-multi-element-lattice polishing pad

Info

Publication number
SG150467A1
SG150467A1 SG200806007-1A SG2008060071A SG150467A1 SG 150467 A1 SG150467 A1 SG 150467A1 SG 2008060071 A SG2008060071 A SG 2008060071A SG 150467 A1 SG150467 A1 SG 150467A1
Authority
SG
Singapore
Prior art keywords
polishing
interconnected
polishing pad
elements
junctions
Prior art date
Application number
SG200806007-1A
Other languages
English (en)
Inventor
Bo Jiang
Gregory P Muldowney
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of SG150467A1 publication Critical patent/SG150467A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06—Fluid handling related problems
    • B01L2200/0689—Sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0636—Integrated biosensor, microarrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0645—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
    • B01L2300/0877—Flow chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/12—Specific details about materials
    • B01L2300/123—Flexible; Elastomeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
SG200806007-1A 2007-08-16 2008-08-13 Interconnected-multi-element-lattice polishing pad SG150467A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/893,785 US7828634B2 (en) 2007-08-16 2007-08-16 Interconnected-multi-element-lattice polishing pad

Publications (1)

Publication Number Publication Date
SG150467A1 true SG150467A1 (en) 2009-03-30

Family

ID=40363344

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200806007-1A SG150467A1 (en) 2007-08-16 2008-08-13 Interconnected-multi-element-lattice polishing pad

Country Status (7)

Country Link
US (1) US7828634B2 (enExample)
EP (1) EP2025457A3 (enExample)
JP (1) JP5389395B2 (enExample)
KR (1) KR101483306B1 (enExample)
CN (1) CN101367190B (enExample)
SG (1) SG150467A1 (enExample)
TW (1) TWI429502B (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7635290B2 (en) 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US7530887B2 (en) * 2007-08-16 2009-05-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with controlled wetting
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US8801949B2 (en) 2011-09-22 2014-08-12 Dow Global Technologies Llc Method of forming open-network polishing pads
US8894799B2 (en) 2011-09-22 2014-11-25 Dow Global Technologies Llc Method of forming layered-open-network polishing pads
US9108291B2 (en) 2011-09-22 2015-08-18 Dow Global Technologies Llc Method of forming structured-open-network polishing pads
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10456886B2 (en) 2016-01-19 2019-10-29 Applied Materials, Inc. Porous chemical mechanical polishing pads
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
JP7165719B2 (ja) * 2017-08-04 2022-11-04 スリーエム イノベイティブ プロパティズ カンパニー 平坦性が向上された微細複製研磨表面
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
EP3721295A4 (en) * 2017-12-04 2022-01-05 California Institute of Technology Metasurface-assisted 3d beam shaping
TWI674172B (zh) * 2018-03-30 2019-10-11 中國砂輪企業股份有限公司 立體研磨工具及其製造方法
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11541736B2 (en) * 2019-06-04 2023-01-03 Fca Us Llc Multiple position vehicle cover
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11833638B2 (en) 2020-03-25 2023-12-05 Rohm and Haas Electronic Materials Holding, Inc. CMP polishing pad with polishing elements on supports
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740239A (en) * 1953-07-02 1956-04-03 Bay State Abrasive Products Co Flexible abrasive products
US2984052A (en) * 1959-08-12 1961-05-16 Norton Co Coated abrasives
US3861892A (en) * 1973-02-08 1975-01-21 Norton Co Coated abrasive material and manner of manufacture
US4282011A (en) * 1980-05-30 1981-08-04 Dan River Incorporated Woven fabrics containing glass fibers and abrasive belts made from same
JPH0398759A (ja) * 1989-09-07 1991-04-24 Nec Corp ポリシングパッド及びその製造方法
US5131924A (en) * 1990-02-02 1992-07-21 Wiand Ronald C Abrasive sheet and method
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5871392A (en) * 1996-06-13 1999-02-16 Micron Technology, Inc. Under-pad for chemical-mechanical planarization of semiconductor wafers
CA2192880C (en) * 1996-12-13 2005-02-22 Brian H. Parrott Sanding devices and the like for removing materials
JPH1199468A (ja) * 1997-09-29 1999-04-13 Toshiba Corp 研磨パッド及びそれを用いた研磨装置
JP2918883B1 (ja) * 1998-07-15 1999-07-12 日本ピラー工業株式会社 研磨パッド
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
US6979248B2 (en) * 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6962524B2 (en) * 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US20030013397A1 (en) * 2001-06-27 2003-01-16 Rhoades Robert L. Polishing pad of polymer coating
ES2203295B1 (es) * 2001-10-03 2005-06-01 Airtel Movil, S.A. Sistema y procedimiento de acceso a la informacion de abonado de una red de telefonia movil desde la red tcp/ip.
US20040226620A1 (en) 2002-09-26 2004-11-18 Daniel Therriault Microcapillary networks
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US20040259479A1 (en) 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US7261625B2 (en) * 2005-02-07 2007-08-28 Inoac Corporation Polishing pad
US7503833B2 (en) 2006-02-16 2009-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
US7604529B2 (en) 2006-02-16 2009-10-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
US7517277B2 (en) * 2007-08-16 2009-04-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Layered-filament lattice for chemical mechanical polishing

Also Published As

Publication number Publication date
CN101367190A (zh) 2009-02-18
US20090047883A1 (en) 2009-02-19
US7828634B2 (en) 2010-11-09
EP2025457A3 (en) 2014-08-20
JP2009051002A (ja) 2009-03-12
KR101483306B1 (ko) 2015-01-15
KR20090017994A (ko) 2009-02-19
TWI429502B (zh) 2014-03-11
EP2025457A2 (en) 2009-02-18
CN101367190B (zh) 2012-05-02
TW200909134A (en) 2009-03-01
JP5389395B2 (ja) 2014-01-15

Similar Documents

Publication Publication Date Title
EP2025457A3 (en) Interconnected-multi-element-lattice polishing pad
TW200742061A (en) Semiconductor device comprising a lattice matching layer
SG130055A1 (en) Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
WO2011049710A3 (en) Stacked semiconductor device
JP2009051002A5 (enExample)
SG150465A1 (en) Layered-filament lattice for chemical mechanical polishing
WO2006138425A3 (en) Chip spanning connection
WO2008036073A3 (en) High temperature superconducting wires and coils
WO2008036062A3 (en) Method for making a semiconductor device including band-engineered superlattice using intermediate annealing
WO2008135905A3 (en) A photosensitive device and a method of manufacturing a photosensitive device
WO2007103445A3 (en) Network control
TW200701452A (en) Semiconductor device including a superlattice with regions defining a semiconductor junction
TW200607056A (en) Semiconductor chip-embedded substrate and method of manufacturing same
WO2008027239A3 (en) Single spacer process for multiplying pitch by a factor greater than two and related intermediate ic structures
WO2004068556A3 (en) Semiconductor structures with structural homogeneity
ATE545134T1 (de) Speichersystem mit sektionalen datenzeilen
TW200717747A (en) Wafer-to-wafer stacking with supporting pedestals
TW200802972A (en) GaN-based semiconductor light-emitting device and method for the fabrication thereof
WO2008063337A3 (en) Semiconductor-on-diamond devices and associated methods
WO2007061854A3 (en) Compliant base to increase contact for micro- or nano-fibers
EP1587141A3 (en) Method and apparatus involving capacitively coupled communication within a stack of laminated chips
US11103085B2 (en) Inclined pocketed spring string and pocketed spring bed core
WO2010005592A8 (en) Microelectronic interconnect element with decreased conductor spacing
TW200744797A (en) Three-dimensional network for chemical mechanical polishing
TW200742060A (en) Method for making an electronic device including a poled superlattice having a net electrical dipole moment