JP5389395B2 - 相互接続された多要素格子研磨パッド - Google Patents
相互接続された多要素格子研磨パッド Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/06—Fluid handling related problems
- B01L2200/0689—Sealing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/06—Auxiliary integrated devices, integrated components
- B01L2300/0627—Sensor or part of a sensor is integrated
- B01L2300/0636—Integrated biosensor, microarrays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
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- B01L2300/0645—Electrodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/12—Specific details about materials
- B01L2300/123—Flexible; Elastomeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Clinical Laboratory Science (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Hematology (AREA)
- General Health & Medical Sciences (AREA)
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- Computer Hardware Design (AREA)
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
本発明は、一般に、化学機械研磨のための研磨パッドの分野に関する。具体的には、本発明は、磁性、光学及び半導体基板を化学機械研磨するために有用である研磨構造を有する研磨パッドに向けられる。
集積回路又は他の電子デバイスの製作では、導電、半導体及び誘電材料の多層を、半導体ウェーハの表面上に堆積させて、そこから除去する。導電、半導体及び誘電材料の薄層は、多くの堆積技術を用いて堆積させることができる。現代のウェーハ加工における一般的な堆積技術は、とりわけ、スパッタリングとしても知られる物理蒸着(PVD)、化学気相蒸着(CVD)、プラズマ促進化学蒸着(PECVD)及び電気化学めっきを含む。一般的な除去技術は、とりわけ、湿式及び乾式の等方性及び異方性エッチングを含む。
本発明の態様は、研磨媒体の存在下で、磁性、光学及び半導体基板の内の少なくとも一つを研磨するために有用である研磨パッドを提供し、a)垂直方向に整列させられた、第一及び第二の端を有する複数の研磨要素と、b)複数の連結点の各々において少なくとも三つの研磨要素を備え、研磨要素の第一及び第二の端を接続し、階層を形成する複数の連結点であって、各階層が研磨要素の第一及び第二の端の間の垂直方向の厚さを示す、複数の連結点と、c)研磨要素を接続する複数の連結点の連続した階層を接続することから形成される、相互接続された格子構造とを含む。
図を参照すると、図1は、本発明の研磨パッド104とともに用いるのに好適である、2軸化学機械研磨(CMP)ポリッシャ100を図示している。一般的に、研磨パッド104は、物品、たとえば半導体ウェーハ112(加工されているか又は加工されていない)又は他の被加工物、たとえばとりわけガラス、フラットパネルディスプレイ又は磁気情報記憶ディスクと対面し、研磨媒体120の存在下で被加工物の研磨面116の研磨を行うための研磨面110を有する研磨層108を含む。研磨媒体120は、深さ128を有する任意の螺旋溝124を通って進行する。便宜上、以下用語「ウェーハ」は、一般性を失うことなく用いられる。加えて、特許請求の範囲を含む本明細書で用いられるように、用語「研磨媒体」は、粒子を含有する研磨液及び粒子を含有しない液、たとえば研磨剤を含まない、反応性液体の研磨液を含む。
Claims (6)
- 研磨媒体の存在下で、磁性、光学及び半導体基板の内の少なくとも一つを研磨するために有用である研磨パッドであって、
a)垂直方向に整列させられた、第一及び第二の端を有する複数の研磨要素と、
b)複数の連結点の各々において少なくとも三つの研磨要素を備え、研磨要素の第一及び第二の端を接続し、階層を形成する複数の連結点であって、各階層が研磨要素の第一及び第二の端の間の垂直方向の厚さを示す、複数の連結点と、
c)研磨要素を接続する複数の連結点の連続した階層を接続することから形成される、相互接続された格子構造と
を含む研磨パッド。 - 連結点が、3〜6個の研磨要素を接続する、請求項1記載の研磨パッド。
- 研磨要素が、各連結点の上下の研磨要素と整列する、請求項1記載の研磨パッド。
- 各研磨要素が、一連の相互接続された円盤を含む、請求項1記載の研磨パッド。
- 相互接続された格子には、水平の研磨要素が欠如している、請求項1記載の研磨パッド。
- 研磨媒体の存在下で、磁性、光学及び半導体基板の内の少なくとも一つを研磨するために有用である、請求項1〜5のいずれかに記載の研磨パッドであって、
a)垂直方向に整列させられた、第一及び第二の端を有する複数の研磨要素と、
b)複数の連結点の各々において少なくとも三つの研磨要素を備え、研磨要素の第一及び第二の端を接続し、階層を形成する複数の連結点であって、各階層が研磨要素の第一及び第二の端の間の垂直方向の厚さを示す、複数の連結点と、
c)研磨要素を接続する複数の連結点の連続した階層を接続することから形成され、複数の連結点を通して一定方向に整列する研磨要素を備える、相互接続された格子構造と
を含む研磨パッド。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/893,785 | 2007-08-16 | ||
US11/893,785 US7828634B2 (en) | 2007-08-16 | 2007-08-16 | Interconnected-multi-element-lattice polishing pad |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009051002A JP2009051002A (ja) | 2009-03-12 |
JP2009051002A5 JP2009051002A5 (ja) | 2013-07-11 |
JP5389395B2 true JP5389395B2 (ja) | 2014-01-15 |
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ID=40363344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2008209142A Active JP5389395B2 (ja) | 2007-08-16 | 2008-08-15 | 相互接続された多要素格子研磨パッド |
Country Status (7)
Country | Link |
---|---|
US (1) | US7828634B2 (ja) |
EP (1) | EP2025457A3 (ja) |
JP (1) | JP5389395B2 (ja) |
KR (1) | KR101483306B1 (ja) |
CN (1) | CN101367190B (ja) |
SG (1) | SG150467A1 (ja) |
TW (1) | TWI429502B (ja) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7635290B2 (en) | 2007-08-15 | 2009-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interpenetrating network for chemical mechanical polishing |
US7530887B2 (en) * | 2007-08-16 | 2009-05-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with controlled wetting |
US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
US9108291B2 (en) | 2011-09-22 | 2015-08-18 | Dow Global Technologies Llc | Method of forming structured-open-network polishing pads |
US8801949B2 (en) | 2011-09-22 | 2014-08-12 | Dow Global Technologies Llc | Method of forming open-network polishing pads |
US8894799B2 (en) | 2011-09-22 | 2014-11-25 | Dow Global Technologies Llc | Method of forming layered-open-network polishing pads |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
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TW200909134A (en) | 2009-03-01 |
KR20090017994A (ko) | 2009-02-19 |
TWI429502B (zh) | 2014-03-11 |
US20090047883A1 (en) | 2009-02-19 |
KR101483306B1 (ko) | 2015-01-15 |
CN101367190A (zh) | 2009-02-18 |
EP2025457A3 (en) | 2014-08-20 |
EP2025457A2 (en) | 2009-02-18 |
SG150467A1 (en) | 2009-03-30 |
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