TWI429502B - 互連多元件晶格研磨墊 - Google Patents
互連多元件晶格研磨墊 Download PDFInfo
- Publication number
- TWI429502B TWI429502B TW097130484A TW97130484A TWI429502B TW I429502 B TWI429502 B TW I429502B TW 097130484 A TW097130484 A TW 097130484A TW 97130484 A TW97130484 A TW 97130484A TW I429502 B TWI429502 B TW I429502B
- Authority
- TW
- Taiwan
- Prior art keywords
- abrasive
- elements
- polishing
- polishing pad
- abrasive elements
- Prior art date
Links
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- NMPZCCZXCOMSDQ-XVFCMESISA-N 2',3'-cyclic CMP Chemical compound O=C1N=C(N)C=CN1[C@H]1[C@@H]2OP(O)(=O)O[C@@H]2[C@@H](CO)O1 NMPZCCZXCOMSDQ-XVFCMESISA-N 0.000 description 4
- 238000013459 approach Methods 0.000 description 4
- WCPTXJJVVDAEMW-UHFFFAOYSA-N cCMP Natural products O=C1N=C(N)C=CN1C1C(O)C2OP(O)(=O)OCC2O1 WCPTXJJVVDAEMW-UHFFFAOYSA-N 0.000 description 4
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/06—Fluid handling related problems
- B01L2200/0689—Sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/06—Auxiliary integrated devices, integrated components
- B01L2300/0627—Sensor or part of a sensor is integrated
- B01L2300/0636—Integrated biosensor, microarrays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/06—Auxiliary integrated devices, integrated components
- B01L2300/0627—Sensor or part of a sensor is integrated
- B01L2300/0645—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
- B01L2300/0877—Flow chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/12—Specific details about materials
- B01L2300/123—Flexible; Elastomeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Hematology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/893,785 US7828634B2 (en) | 2007-08-16 | 2007-08-16 | Interconnected-multi-element-lattice polishing pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200909134A TW200909134A (en) | 2009-03-01 |
| TWI429502B true TWI429502B (zh) | 2014-03-11 |
Family
ID=40363344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097130484A TWI429502B (zh) | 2007-08-16 | 2008-08-11 | 互連多元件晶格研磨墊 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7828634B2 (enExample) |
| EP (1) | EP2025457A3 (enExample) |
| JP (1) | JP5389395B2 (enExample) |
| KR (1) | KR101483306B1 (enExample) |
| CN (1) | CN101367190B (enExample) |
| SG (1) | SG150467A1 (enExample) |
| TW (1) | TWI429502B (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7635290B2 (en) | 2007-08-15 | 2009-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Interpenetrating network for chemical mechanical polishing |
| US7530887B2 (en) * | 2007-08-16 | 2009-05-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with controlled wetting |
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| US8801949B2 (en) | 2011-09-22 | 2014-08-12 | Dow Global Technologies Llc | Method of forming open-network polishing pads |
| US9108291B2 (en) | 2011-09-22 | 2015-08-18 | Dow Global Technologies Llc | Method of forming structured-open-network polishing pads |
| US8894799B2 (en) | 2011-09-22 | 2014-11-25 | Dow Global Technologies Llc | Method of forming layered-open-network polishing pads |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US9484212B1 (en) * | 2015-10-30 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| CN113146464A (zh) | 2016-01-19 | 2021-07-23 | 应用材料公司 | 多孔化学机械抛光垫 |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019026021A1 (en) * | 2017-08-04 | 2019-02-07 | 3M Innovative Properties Company | MICRO-REPLICATED POLISHING SURFACE WITH IMPROVED COPLANARITY |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| AU2018380006A1 (en) | 2017-12-04 | 2020-06-25 | California Institute Of Technology | Metasurface-assisted 3D beam shaping |
| TWI674172B (zh) * | 2018-03-30 | 2019-10-11 | 中國砂輪企業股份有限公司 | 立體研磨工具及其製造方法 |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
| US11541736B2 (en) * | 2019-06-04 | 2023-01-03 | Fca Us Llc | Multiple position vehicle cover |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11833638B2 (en) * | 2020-03-25 | 2023-12-05 | Rohm and Haas Electronic Materials Holding, Inc. | CMP polishing pad with polishing elements on supports |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2740239A (en) * | 1953-07-02 | 1956-04-03 | Bay State Abrasive Products Co | Flexible abrasive products |
| US2984052A (en) * | 1959-08-12 | 1961-05-16 | Norton Co | Coated abrasives |
| US3861892A (en) * | 1973-02-08 | 1975-01-21 | Norton Co | Coated abrasive material and manner of manufacture |
| US4282011A (en) * | 1980-05-30 | 1981-08-04 | Dan River Incorporated | Woven fabrics containing glass fibers and abrasive belts made from same |
| JPH0398759A (ja) * | 1989-09-07 | 1991-04-24 | Nec Corp | ポリシングパッド及びその製造方法 |
| US5131924A (en) * | 1990-02-02 | 1992-07-21 | Wiand Ronald C | Abrasive sheet and method |
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5871392A (en) * | 1996-06-13 | 1999-02-16 | Micron Technology, Inc. | Under-pad for chemical-mechanical planarization of semiconductor wafers |
| CA2192880C (en) * | 1996-12-13 | 2005-02-22 | Brian H. Parrott | Sanding devices and the like for removing materials |
| JPH1199468A (ja) * | 1997-09-29 | 1999-04-13 | Toshiba Corp | 研磨パッド及びそれを用いた研磨装置 |
| JP2918883B1 (ja) * | 1998-07-15 | 1999-07-12 | 日本ピラー工業株式会社 | 研磨パッド |
| TW467802B (en) * | 1999-10-12 | 2001-12-11 | Hunatech Co Ltd | Conditioner for polishing pad and method for manufacturing the same |
| US20040020789A1 (en) * | 2000-02-17 | 2004-02-05 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6979248B2 (en) * | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6962524B2 (en) * | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6964604B2 (en) * | 2000-06-23 | 2005-11-15 | International Business Machines Corporation | Fiber embedded polishing pad |
| US20030013397A1 (en) * | 2001-06-27 | 2003-01-16 | Rhoades Robert L. | Polishing pad of polymer coating |
| ES2203295B1 (es) * | 2001-10-03 | 2005-06-01 | Airtel Movil, S.A. | Sistema y procedimiento de acceso a la informacion de abonado de una red de telefonia movil desde la red tcp/ip. |
| US20040226620A1 (en) * | 2002-09-26 | 2004-11-18 | Daniel Therriault | Microcapillary networks |
| US7311862B2 (en) * | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
| US20040259479A1 (en) | 2003-06-23 | 2004-12-23 | Cabot Microelectronics Corporation | Polishing pad for electrochemical-mechanical polishing |
| US7261625B2 (en) * | 2005-02-07 | 2007-08-28 | Inoac Corporation | Polishing pad |
| US7604529B2 (en) * | 2006-02-16 | 2009-10-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Three-dimensional network for chemical mechanical polishing |
| US7503833B2 (en) * | 2006-02-16 | 2009-03-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Three-dimensional network for chemical mechanical polishing |
| US7517277B2 (en) * | 2007-08-16 | 2009-04-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Layered-filament lattice for chemical mechanical polishing |
-
2007
- 2007-08-16 US US11/893,785 patent/US7828634B2/en active Active
-
2008
- 2008-08-11 TW TW097130484A patent/TWI429502B/zh active
- 2008-08-13 SG SG200806007-1A patent/SG150467A1/en unknown
- 2008-08-14 KR KR20080079896A patent/KR101483306B1/ko active Active
- 2008-08-14 EP EP08162350.6A patent/EP2025457A3/en not_active Withdrawn
- 2008-08-15 CN CN2008102126600A patent/CN101367190B/zh active Active
- 2008-08-15 JP JP2008209142A patent/JP5389395B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090017994A (ko) | 2009-02-19 |
| EP2025457A2 (en) | 2009-02-18 |
| EP2025457A3 (en) | 2014-08-20 |
| CN101367190A (zh) | 2009-02-18 |
| CN101367190B (zh) | 2012-05-02 |
| US20090047883A1 (en) | 2009-02-19 |
| JP5389395B2 (ja) | 2014-01-15 |
| SG150467A1 (en) | 2009-03-30 |
| TW200909134A (en) | 2009-03-01 |
| JP2009051002A (ja) | 2009-03-12 |
| US7828634B2 (en) | 2010-11-09 |
| KR101483306B1 (ko) | 2015-01-15 |
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