JP2007059916A5 - - Google Patents

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Publication number
JP2007059916A5
JP2007059916A5 JP2006227756A JP2006227756A JP2007059916A5 JP 2007059916 A5 JP2007059916 A5 JP 2007059916A5 JP 2006227756 A JP2006227756 A JP 2006227756A JP 2006227756 A JP2006227756 A JP 2006227756A JP 2007059916 A5 JP2007059916 A5 JP 2007059916A5
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JP
Japan
Prior art keywords
semiconductor chip
insulating film
electrode pad
display panel
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006227756A
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English (en)
Japanese (ja)
Other versions
JP5311531B2 (ja
JP2007059916A (ja
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Publication date
Priority claimed from KR1020050077657A external-priority patent/KR101134168B1/ko
Application filed filed Critical
Publication of JP2007059916A publication Critical patent/JP2007059916A/ja
Publication of JP2007059916A5 publication Critical patent/JP2007059916A5/ja
Application granted granted Critical
Publication of JP5311531B2 publication Critical patent/JP5311531B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006227756A 2005-08-24 2006-08-24 半導体チップの実装された表示パネル Expired - Fee Related JP5311531B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050077657A KR101134168B1 (ko) 2005-08-24 2005-08-24 반도체 칩 및 그 제조 방법과, 그를 이용한 표시 패널 및그 제조 방법
KR10-2005-0077657 2005-08-24

Publications (3)

Publication Number Publication Date
JP2007059916A JP2007059916A (ja) 2007-03-08
JP2007059916A5 true JP2007059916A5 (enExample) 2009-10-08
JP5311531B2 JP5311531B2 (ja) 2013-10-09

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ID=37778760

Family Applications (1)

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JP2006227756A Expired - Fee Related JP5311531B2 (ja) 2005-08-24 2006-08-24 半導体チップの実装された表示パネル

Country Status (5)

Country Link
US (1) US7750469B2 (enExample)
JP (1) JP5311531B2 (enExample)
KR (1) KR101134168B1 (enExample)
CN (1) CN1921095B (enExample)
TW (1) TWI419292B (enExample)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2841454B1 (fr) 2002-07-01 2004-10-22 Jean Pierre Delmotte "appareil de cuisson d'aliments de type barbecue avec une plaque de regulation multi-fonctionnelle"
US20100164089A1 (en) * 2006-02-15 2010-07-01 Nxp B.V. Non-Conductive Planarization of Substrate Surface for Mold Cap
JP2008166381A (ja) * 2006-12-27 2008-07-17 Sanyo Electric Co Ltd 半導体装置及びその製造方法
KR100810242B1 (ko) * 2007-02-13 2008-03-06 삼성전자주식회사 반도체 다이 패키지와 그를 이용한 내장형 인쇄회로 기판
JP2009282285A (ja) * 2008-05-22 2009-12-03 Mitsubishi Electric Corp 画像表示装置、およびその実装検査方法
JP2011009363A (ja) * 2009-06-24 2011-01-13 Nec Corp 半導体装置及びその製造方法並びにこれを用いた複合回路装置
TWI412107B (zh) * 2009-10-02 2013-10-11 財團法人工業技術研究院 凸塊結構、晶片封裝結構及該凸塊結構之製備方法
TWI445147B (zh) * 2009-10-14 2014-07-11 日月光半導體製造股份有限公司 半導體元件
CN102044513A (zh) * 2009-10-21 2011-05-04 日月光半导体制造股份有限公司 半导体组件
TW201117336A (en) * 2009-11-05 2011-05-16 Raydium Semiconductor Corp Electronic chip and substrate providing insulation protection between conducting nodes
TW201121006A (en) * 2009-12-03 2011-06-16 Hannstar Display Corp Connection structure for chip-on-glass driver IC and connection method therefor
US8426251B2 (en) * 2010-01-07 2013-04-23 Infineon Technologies Ag Semiconductor device
CN102237329B (zh) * 2010-04-27 2013-08-21 瑞鼎科技股份有限公司 芯片结构及其芯片接合结构与制造方法
US9070851B2 (en) * 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
TWI478303B (zh) 2010-09-27 2015-03-21 日月光半導體製造股份有限公司 具有金屬柱之晶片及具有金屬柱之晶片之封裝結構
CN102064135B (zh) * 2010-10-21 2015-07-22 日月光半导体制造股份有限公司 具有金属柱的芯片及具有金属柱的芯片的封装结构
KR101822012B1 (ko) * 2010-12-07 2018-01-26 삼성디스플레이 주식회사 유기전계발광 표시 장치 및 그 제조 방법
TWM408126U (en) * 2010-12-10 2011-07-21 Chunghwa Picture Tubes Ltd Conductive pad structure, chip package structure and active device array substrate
CN103299410B (zh) * 2011-01-26 2016-01-27 株式会社村田制作所 电子元器件模块及电子元器件单元
KR20130013515A (ko) * 2011-07-28 2013-02-06 삼성디스플레이 주식회사 유기 발광 표시 장치
TWI531835B (zh) 2011-11-15 2016-05-01 友達光電股份有限公司 顯示面板
WO2013101243A1 (en) 2011-12-31 2013-07-04 Intel Corporation High density package interconnects
US9257276B2 (en) 2011-12-31 2016-02-09 Intel Corporation Organic thin film passivation of metal interconnections
JP2014053597A (ja) * 2012-08-09 2014-03-20 Hitachi Chemical Co Ltd チップ型電子部品及び接続構造体
US10622310B2 (en) 2012-09-26 2020-04-14 Ping-Jung Yang Method for fabricating glass substrate package
US9293438B2 (en) 2013-07-03 2016-03-22 Harris Corporation Method for making electronic device with cover layer with openings and related devices
CN104347557A (zh) * 2013-07-26 2015-02-11 日月光半导体制造股份有限公司 半导体封装件及其的制造方法
JP6324746B2 (ja) * 2014-02-03 2018-05-16 デクセリアルズ株式会社 接続体、接続体の製造方法、電子機器
CN104900543B (zh) * 2014-03-06 2018-02-06 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制备方法
US9666814B2 (en) 2014-03-07 2017-05-30 Samsung Display Co., Ltd. Display device and method of manufacturing the same
JP2016018879A (ja) * 2014-07-08 2016-02-01 株式会社東芝 半導体装置および半導体装置の製造方法
US9698134B2 (en) * 2014-11-27 2017-07-04 Sct Technology, Ltd. Method for manufacturing a light emitted diode display
CN104966676B (zh) * 2015-07-08 2018-04-27 上海新微技术研发中心有限公司 共晶键合方法
CN107046018B (zh) * 2015-09-16 2020-06-02 杨秉荣 玻璃基板封装及其制造方法
KR102393315B1 (ko) * 2015-09-30 2022-04-29 엘지디스플레이 주식회사 디스플레이 장치
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
KR102539031B1 (ko) * 2016-04-28 2023-06-02 삼성디스플레이 주식회사 표시 장치
KR102654925B1 (ko) * 2016-06-21 2024-04-05 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
KR102666884B1 (ko) * 2016-07-15 2024-05-17 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법
CN106019663A (zh) * 2016-07-29 2016-10-12 京东方科技集团股份有限公司 集成电路器件及制作方法、电路板、显示面板、显示装置
KR102638304B1 (ko) * 2016-08-02 2024-02-20 삼성디스플레이 주식회사 표시장치
KR102615177B1 (ko) * 2016-10-06 2023-12-20 삼성디스플레이 주식회사 평판표시장치
KR102785987B1 (ko) * 2016-10-13 2025-03-24 삼성디스플레이 주식회사 표시 패널
JP6773884B2 (ja) * 2017-02-28 2020-10-21 富士フイルム株式会社 半導体デバイス、積層体ならびに半導体デバイスの製造方法および積層体の製造方法
KR102341124B1 (ko) * 2017-09-26 2021-12-22 삼성디스플레이 주식회사 전자패널, 표시장치, 및 그 제조 방법
CN109659304A (zh) * 2017-10-12 2019-04-19 上海和辉光电有限公司 一种阵列基板、显示面板及显示装置
US10283471B1 (en) * 2017-11-06 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Micro-connection structure and manufacturing method thereof
CN109860224B (zh) * 2017-11-30 2021-05-14 京东方科技集团股份有限公司 显示基板及其制作方法、显示面板、显示装置
KR102452462B1 (ko) * 2017-12-26 2022-10-06 엘지디스플레이 주식회사 표시장치
KR102633137B1 (ko) 2018-01-23 2024-02-02 삼성전자주식회사 반도체 패키지
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
KR102512724B1 (ko) * 2018-04-19 2023-03-23 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
KR20200005096A (ko) * 2018-07-05 2020-01-15 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
CN109188790B (zh) * 2018-09-13 2022-04-15 京东方科技集团股份有限公司 基板及其制作方法、显示装置
US20220320457A1 (en) * 2019-07-12 2022-10-06 Sharp Kabushiki Kaisha Display device
KR102888782B1 (ko) 2019-10-11 2025-11-24 삼성디스플레이 주식회사 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법
KR102722915B1 (ko) 2019-10-30 2024-10-28 삼성전자주식회사 반도체 패키지 및 그 제조방법
KR20210065580A (ko) 2019-11-27 2021-06-04 엘지디스플레이 주식회사 플렉서블 표시장치
KR20210086900A (ko) * 2019-12-31 2021-07-09 삼성디스플레이 주식회사 표시 장치
KR20210150649A (ko) * 2020-06-03 2021-12-13 삼성디스플레이 주식회사 표시장치
CN111640722B (zh) * 2020-06-11 2022-07-05 厦门通富微电子有限公司 一种芯片封装方法和芯片封装器件
CN111554582B (zh) * 2020-06-11 2022-07-15 厦门通富微电子有限公司 一种芯片封装方法和芯片封装器件
US11991824B2 (en) * 2020-08-28 2024-05-21 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH095769A (ja) * 1995-06-21 1997-01-10 Rohm Co Ltd 電子素子の配線接続構造
JPH10144727A (ja) * 1996-11-14 1998-05-29 Matsushita Electric Ind Co Ltd 半導体素子の実装方法および半導体素子を実装した電子装置
US5903056A (en) * 1997-04-21 1999-05-11 Lucent Technologies Inc. Conductive polymer film bonding technique
DE69811296D1 (de) * 1997-07-11 2003-03-20 Bosch Gmbh Robert Erhöhte Haftung der Unterseitenbeschichtung von Flip-Chips
JPH11297889A (ja) * 1998-04-16 1999-10-29 Sony Corp 半導体パッケージおよび実装基板、ならびにこれらを用いた実装方法
US5943597A (en) * 1998-06-15 1999-08-24 Motorola, Inc. Bumped semiconductor device having a trench for stress relief
HK1046012A1 (en) * 1999-02-25 2002-12-20 Nitto Denko Corporation Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device
US6451875B1 (en) * 1999-10-12 2002-09-17 Sony Chemicals Corporation Connecting material for anisotropically electroconductive connection
JP2001267370A (ja) * 2000-03-14 2001-09-28 Hitachi Ltd 半導体実装装置および方法
US6677664B2 (en) * 2000-04-25 2004-01-13 Fujitsu Hitachi Plasma Display Limited Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis
JP2001358171A (ja) * 2000-06-12 2001-12-26 Canon Inc 半導体素子実装構造
US6489573B2 (en) * 2000-06-16 2002-12-03 Acer Display Technology Electrode bonding structure for reducing the thermal expansion of the flexible printed circuit board during the bonding process
TW479304B (en) * 2001-02-06 2002-03-11 Acer Display Tech Inc Semiconductor apparatus and its manufacturing method, and liquid crystal display using semiconductor apparatus
KR100456064B1 (ko) 2001-07-06 2004-11-08 한국과학기술원 극미세 피치 ｃｏｇ 기술용 이방성 전도성 필름
JP3810064B2 (ja) * 2002-03-15 2006-08-16 松下電器産業株式会社 液晶表示装置
JP2003332384A (ja) * 2002-05-13 2003-11-21 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
US6744142B2 (en) * 2002-06-19 2004-06-01 National Central University Flip chip interconnection structure and process of making the same
WO2004051732A1 (en) * 2002-11-29 2004-06-17 Infineon Technologies Ag Attachment of flip-chips to substrates
JP4115832B2 (ja) * 2002-12-27 2008-07-09 東芝松下ディスプレイテクノロジー株式会社 半導体素子及び液晶表示パネル
US7180149B2 (en) * 2003-08-28 2007-02-20 Fujikura Ltd. Semiconductor package with through-hole
JP2005109023A (ja) * 2003-09-29 2005-04-21 Optrex Corp 半導体チップ及びそれを実装した液晶表示装置
JP2005109187A (ja) * 2003-09-30 2005-04-21 Tdk Corp フリップチップ実装回路基板およびその製造方法ならびに集積回路装置
US20050104225A1 (en) * 2003-11-19 2005-05-19 Yuan-Chang Huang Conductive bumps with insulating sidewalls and method for fabricating
TWI262347B (en) * 2004-08-02 2006-09-21 Hannstar Display Corp Electrical conducting structure and liquid crystal display device comprising the same
JP2007335607A (ja) * 2006-06-14 2007-12-27 Sharp Corp Ｉｃチップ実装パッケージ、及びこれを用いた画像表示装置

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