TWI419292B - 半導體晶片，使用該晶片之顯示面板及製造半導體晶片與使用該晶片之顯示面板的方法 - Google Patents

半導體晶片，使用該晶片之顯示面板及製造半導體晶片與使用該晶片之顯示面板的方法 Download PDF

Info

Publication number
TWI419292B
TWI419292B TW095130982A TW95130982A TWI419292B TW I419292 B TWI419292 B TW I419292B TW 095130982 A TW095130982 A TW 095130982A TW 95130982 A TW95130982 A TW 95130982A TW I419292 B TWI419292 B TW I419292B
Authority
TW
Taiwan
Prior art keywords
insulating layer
substrate
electrode pad
display panel
bumps
Prior art date
Application number
TW095130982A
Other languages
English (en)
Chinese (zh)
Other versions
TW200715514A (en
Inventor
趙源九
姜鎬民
Original Assignee
三星顯示器公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星顯示器公司 filed Critical 三星顯示器公司
Publication of TW200715514A publication Critical patent/TW200715514A/zh
Application granted granted Critical
Publication of TWI419292B publication Critical patent/TWI419292B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/287—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW095130982A 2005-08-24 2006-08-23 半導體晶片，使用該晶片之顯示面板及製造半導體晶片與使用該晶片之顯示面板的方法 TWI419292B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050077657A KR101134168B1 (ko) 2005-08-24 2005-08-24 반도체 칩 및 그 제조 방법과, 그를 이용한 표시 패널 및그 제조 방법

Publications (2)

Publication Number Publication Date
TW200715514A TW200715514A (en) 2007-04-16
TWI419292B true TWI419292B (zh) 2013-12-11

Family

ID=37778760

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130982A TWI419292B (zh) 2005-08-24 2006-08-23 半導體晶片，使用該晶片之顯示面板及製造半導體晶片與使用該晶片之顯示面板的方法

Country Status (5)

Country Link
US (1) US7750469B2 (enExample)
JP (1) JP5311531B2 (enExample)
KR (1) KR101134168B1 (enExample)
CN (1) CN1921095B (enExample)
TW (1) TWI419292B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI729267B (zh) * 2017-02-28 2021-06-01 日商富士軟片股份有限公司 半導體器件、積層體及半導體器件的製造方法以及積層體的製造方法

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2841454B1 (fr) 2002-07-01 2004-10-22 Jean Pierre Delmotte "appareil de cuisson d'aliments de type barbecue avec une plaque de regulation multi-fonctionnelle"
JP2009527121A (ja) * 2006-02-15 2009-07-23 エヌエックスピー ビー ヴィ 半導体パッケージの製造方法、パッケージ基板、および集積回路（ｉｃ）デバイス
JP2008166381A (ja) * 2006-12-27 2008-07-17 Sanyo Electric Co Ltd 半導体装置及びその製造方法
KR100810242B1 (ko) * 2007-02-13 2008-03-06 삼성전자주식회사 반도체 다이 패키지와 그를 이용한 내장형 인쇄회로 기판
JP2009282285A (ja) * 2008-05-22 2009-12-03 Mitsubishi Electric Corp 画像表示装置、およびその実装検査方法
JP2011009363A (ja) * 2009-06-24 2011-01-13 Nec Corp 半導体装置及びその製造方法並びにこれを用いた複合回路装置
TWI412107B (zh) * 2009-10-02 2013-10-11 財團法人工業技術研究院 凸塊結構、晶片封裝結構及該凸塊結構之製備方法
TWI445147B (zh) * 2009-10-14 2014-07-11 日月光半導體製造股份有限公司 半導體元件
CN102044513A (zh) * 2009-10-21 2011-05-04 日月光半导体制造股份有限公司 半导体组件
TW201117336A (en) * 2009-11-05 2011-05-16 Raydium Semiconductor Corp Electronic chip and substrate providing insulation protection between conducting nodes
TW201121006A (en) * 2009-12-03 2011-06-16 Hannstar Display Corp Connection structure for chip-on-glass driver IC and connection method therefor
US8426251B2 (en) * 2010-01-07 2013-04-23 Infineon Technologies Ag Semiconductor device
CN102237329B (zh) * 2010-04-27 2013-08-21 瑞鼎科技股份有限公司 芯片结构及其芯片接合结构与制造方法
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
TWI478303B (zh) 2010-09-27 2015-03-21 日月光半導體製造股份有限公司 具有金屬柱之晶片及具有金屬柱之晶片之封裝結構
CN102064135B (zh) * 2010-10-21 2015-07-22 日月光半导体制造股份有限公司 具有金属柱的芯片及具有金属柱的芯片的封装结构
KR101822012B1 (ko) * 2010-12-07 2018-01-26 삼성디스플레이 주식회사 유기전계발광 표시 장치 및 그 제조 방법
TWM408126U (en) * 2010-12-10 2011-07-21 Chunghwa Picture Tubes Ltd Conductive pad structure, chip package structure and active device array substrate
JP5370599B2 (ja) * 2011-01-26 2013-12-18 株式会社村田製作所 電子部品モジュールおよび電子部品素子
KR20130013515A (ko) * 2011-07-28 2013-02-06 삼성디스플레이 주식회사 유기 발광 표시 장치
TWI531835B (zh) 2011-11-15 2016-05-01 友達光電股份有限公司 顯示面板
US9368437B2 (en) 2011-12-31 2016-06-14 Intel Corporation High density package interconnects
US9257276B2 (en) 2011-12-31 2016-02-09 Intel Corporation Organic thin film passivation of metal interconnections
JP2014053597A (ja) * 2012-08-09 2014-03-20 Hitachi Chemical Co Ltd チップ型電子部品及び接続構造体
US10622310B2 (en) 2012-09-26 2020-04-14 Ping-Jung Yang Method for fabricating glass substrate package
US9293438B2 (en) 2013-07-03 2016-03-22 Harris Corporation Method for making electronic device with cover layer with openings and related devices
CN108321142B (zh) * 2013-07-26 2020-08-28 日月光半导体制造股份有限公司 半导体封装件及其的制造方法
JP6324746B2 (ja) * 2014-02-03 2018-05-16 デクセリアルズ株式会社 接続体、接続体の製造方法、電子機器
CN104900543B (zh) * 2014-03-06 2018-02-06 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制备方法
US9666814B2 (en) 2014-03-07 2017-05-30 Samsung Display Co., Ltd. Display device and method of manufacturing the same
JP2016018879A (ja) * 2014-07-08 2016-02-01 株式会社東芝 半導体装置および半導体装置の製造方法
US9698134B2 (en) * 2014-11-27 2017-07-04 Sct Technology, Ltd. Method for manufacturing a light emitted diode display
CN104966676B (zh) * 2015-07-08 2018-04-27 上海新微技术研发中心有限公司 共晶键合方法
TWI675440B (zh) * 2015-09-16 2019-10-21 楊秉榮 玻璃基板封裝及其製造方法
KR102393315B1 (ko) * 2015-09-30 2022-04-29 엘지디스플레이 주식회사 디스플레이 장치
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
KR102539031B1 (ko) * 2016-04-28 2023-06-02 삼성디스플레이 주식회사 표시 장치
KR102654925B1 (ko) * 2016-06-21 2024-04-05 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
KR102666884B1 (ko) * 2016-07-15 2024-05-17 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법
CN106019663A (zh) * 2016-07-29 2016-10-12 京东方科技集团股份有限公司 集成电路器件及制作方法、电路板、显示面板、显示装置
KR102638304B1 (ko) * 2016-08-02 2024-02-20 삼성디스플레이 주식회사 표시장치
KR102615177B1 (ko) * 2016-10-06 2023-12-20 삼성디스플레이 주식회사 평판표시장치
KR102785987B1 (ko) * 2016-10-13 2025-03-24 삼성디스플레이 주식회사 표시 패널
KR102341124B1 (ko) * 2017-09-26 2021-12-22 삼성디스플레이 주식회사 전자패널, 표시장치, 및 그 제조 방법
CN109659304A (zh) * 2017-10-12 2019-04-19 上海和辉光电有限公司 一种阵列基板、显示面板及显示装置
US10283471B1 (en) * 2017-11-06 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Micro-connection structure and manufacturing method thereof
CN109860224B (zh) * 2017-11-30 2021-05-14 京东方科技集团股份有限公司 显示基板及其制作方法、显示面板、显示装置
KR102452462B1 (ko) * 2017-12-26 2022-10-06 엘지디스플레이 주식회사 표시장치
KR102633137B1 (ko) 2018-01-23 2024-02-02 삼성전자주식회사 반도체 패키지
JP7185252B2 (ja) 2018-01-31 2022-12-07 三国電子有限会社 接続構造体の作製方法
JP7046351B2 (ja) 2018-01-31 2022-04-04 三国電子有限会社 接続構造体の作製方法
JP7160302B2 (ja) * 2018-01-31 2022-10-25 三国電子有限会社 接続構造体および接続構造体の作製方法
KR102512724B1 (ko) * 2018-04-19 2023-03-23 삼성디스플레이 주식회사 표시장치 및 이의 제조방법
KR20200005096A (ko) * 2018-07-05 2020-01-15 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
CN109188790B (zh) * 2018-09-13 2022-04-15 京东方科技集团股份有限公司 基板及其制作方法、显示装置
CN114097015A (zh) * 2019-07-12 2022-02-25 夏普株式会社 显示装置
KR102888782B1 (ko) * 2019-10-11 2025-11-24 삼성디스플레이 주식회사 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법
KR102722915B1 (ko) 2019-10-30 2024-10-28 삼성전자주식회사 반도체 패키지 및 그 제조방법
KR20210065580A (ko) * 2019-11-27 2021-06-04 엘지디스플레이 주식회사 플렉서블 표시장치
US11456349B2 (en) * 2019-12-31 2022-09-27 Samsung Display Co., Ltd. Display device having flexible film with window portion
KR20210150649A (ko) * 2020-06-03 2021-12-13 삼성디스플레이 주식회사 표시장치
CN111640722B (zh) * 2020-06-11 2022-07-05 厦门通富微电子有限公司 一种芯片封装方法和芯片封装器件
CN111554582B (zh) * 2020-06-11 2022-07-15 厦门通富微电子有限公司 一种芯片封装方法和芯片封装器件
US11991824B2 (en) 2020-08-28 2024-05-21 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof
GB202408216D0 (en) * 2024-06-10 2024-07-24 Flexenable Tech Limited Driver chip on organic polymer substrate

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5903056A (en) * 1997-04-21 1999-05-11 Lucent Technologies Inc. Conductive polymer film bonding technique
US5943597A (en) * 1998-06-15 1999-08-24 Motorola, Inc. Bumped semiconductor device having a trench for stress relief
US20010033009A1 (en) * 2000-04-25 2001-10-25 Hirokazu Inoue Display driver module and mounting structure therefor
US20010054753A1 (en) * 1998-04-16 2001-12-27 Yoichi Oya Semiconductor package and mount board, and mounting method using the same
US20020033532A1 (en) * 2000-06-16 2002-03-21 Jiun-Han Wu Electrode bonding structure for reducing the thermal expansion of the flexible printed circuit board during the bonding process
CN1348481A (zh) * 1999-02-25 2002-05-08 日东电工株式会社 用于半导体封铸的树脂组合物、由所述材料获得的半导体设备以及制造半导体设备的方法
US20020105078A1 (en) * 2001-02-06 2002-08-08 Au Optronics Corp. Semiconductor device, a method for making the same, and an LCD monitor comprising the same
US6451875B1 (en) * 1999-10-12 2002-09-17 Sony Chemicals Corporation Connecting material for anisotropically electroconductive connection
US6518665B1 (en) * 1997-07-11 2003-02-11 Delaware Capital Formation, Inc. Enhanced underfill adhesion
JP2003332384A (ja) * 2002-05-13 2003-11-21 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
US6744142B2 (en) * 2002-06-19 2004-06-01 National Central University Flip chip interconnection structure and process of making the same
JP2005109023A (ja) * 2003-09-29 2005-04-21 Optrex Corp 半導体チップ及びそれを実装した液晶表示装置
US20050104225A1 (en) * 2003-11-19 2005-05-19 Yuan-Chang Huang Conductive bumps with insulating sidewalls and method for fabricating

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH095769A (ja) * 1995-06-21 1997-01-10 Rohm Co Ltd 電子素子の配線接続構造
JPH10144727A (ja) * 1996-11-14 1998-05-29 Matsushita Electric Ind Co Ltd 半導体素子の実装方法および半導体素子を実装した電子装置
JP2001267370A (ja) * 2000-03-14 2001-09-28 Hitachi Ltd 半導体実装装置および方法
JP2001358171A (ja) * 2000-06-12 2001-12-26 Canon Inc 半導体素子実装構造
KR100456064B1 (ko) 2001-07-06 2004-11-08 한국과학기술원 극미세 피치 ｃｏｇ 기술용 이방성 전도성 필름
JP3810064B2 (ja) * 2002-03-15 2006-08-16 松下電器産業株式会社 液晶表示装置
WO2004051732A1 (en) * 2002-11-29 2004-06-17 Infineon Technologies Ag Attachment of flip-chips to substrates
JP4115832B2 (ja) * 2002-12-27 2008-07-09 東芝松下ディスプレイテクノロジー株式会社 半導体素子及び液晶表示パネル
US7180149B2 (en) * 2003-08-28 2007-02-20 Fujikura Ltd. Semiconductor package with through-hole
JP2005109187A (ja) * 2003-09-30 2005-04-21 Tdk Corp フリップチップ実装回路基板およびその製造方法ならびに集積回路装置
TWI262347B (en) * 2004-08-02 2006-09-21 Hannstar Display Corp Electrical conducting structure and liquid crystal display device comprising the same
JP2007335607A (ja) * 2006-06-14 2007-12-27 Sharp Corp Ｉｃチップ実装パッケージ、及びこれを用いた画像表示装置

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5903056A (en) * 1997-04-21 1999-05-11 Lucent Technologies Inc. Conductive polymer film bonding technique
US6518665B1 (en) * 1997-07-11 2003-02-11 Delaware Capital Formation, Inc. Enhanced underfill adhesion
US20010054753A1 (en) * 1998-04-16 2001-12-27 Yoichi Oya Semiconductor package and mount board, and mounting method using the same
US5943597A (en) * 1998-06-15 1999-08-24 Motorola, Inc. Bumped semiconductor device having a trench for stress relief
CN1348481A (zh) * 1999-02-25 2002-05-08 日东电工株式会社 用于半导体封铸的树脂组合物、由所述材料获得的半导体设备以及制造半导体设备的方法
US6451875B1 (en) * 1999-10-12 2002-09-17 Sony Chemicals Corporation Connecting material for anisotropically electroconductive connection
US20010033009A1 (en) * 2000-04-25 2001-10-25 Hirokazu Inoue Display driver module and mounting structure therefor
US20020033532A1 (en) * 2000-06-16 2002-03-21 Jiun-Han Wu Electrode bonding structure for reducing the thermal expansion of the flexible printed circuit board during the bonding process
US20020105078A1 (en) * 2001-02-06 2002-08-08 Au Optronics Corp. Semiconductor device, a method for making the same, and an LCD monitor comprising the same
US6867505B2 (en) * 2001-02-06 2005-03-15 Au Optronics Corp Semiconductor device, a method for making the same, and an LCD monitor comprising the same
JP2003332384A (ja) * 2002-05-13 2003-11-21 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
US6744142B2 (en) * 2002-06-19 2004-06-01 National Central University Flip chip interconnection structure and process of making the same
JP2005109023A (ja) * 2003-09-29 2005-04-21 Optrex Corp 半導体チップ及びそれを実装した液晶表示装置
US20050104225A1 (en) * 2003-11-19 2005-05-19 Yuan-Chang Huang Conductive bumps with insulating sidewalls and method for fabricating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI729267B (zh) * 2017-02-28 2021-06-01 日商富士軟片股份有限公司 半導體器件、積層體及半導體器件的製造方法以及積層體的製造方法

Also Published As

Publication number Publication date
CN1921095B (zh) 2012-05-09
TW200715514A (en) 2007-04-16
US7750469B2 (en) 2010-07-06
JP5311531B2 (ja) 2013-10-09
US20070045841A1 (en) 2007-03-01
KR20070023268A (ko) 2007-02-28
CN1921095A (zh) 2007-02-28
KR101134168B1 (ko) 2012-04-09
JP2007059916A (ja) 2007-03-08

Similar Documents

Publication Publication Date Title
TWI419292B (zh) 半導體晶片，使用該晶片之顯示面板及製造半導體晶片與使用該晶片之顯示面板的方法
CN100412665C (zh) 液晶显示装置及其制造方法
US6937314B2 (en) Liquid crystal display having terminals arranged for securing connection to driving circuit
US6771348B2 (en) Displaying substrate and liquid crystal display device having the same
TW464927B (en) Metal bump with an insulating sidewall and method of fabricating thereof
CN101625471B (zh) 液晶显示设备及其制造方法
US7714974B2 (en) Liquid crystal display device and method of fabricating the same
US8182301B2 (en) Method of fabricating flat panel display having pad electrode
US7459753B2 (en) Electro-optical device, method for manufacturing electro-optical device, and electronic apparatus
CN101592802B (zh) 液晶显示设备及其制造方法
US20090209160A1 (en) Chip on glass type liquid crystal display device and method for fabricating the same
CN100590502C (zh) 阵列基底和具有该阵列基底的显示装置
US7390734B2 (en) Thin film transistor substrate and manufacturing method thereof
US20110242476A1 (en) Liquid crystal display panel and liquid crystal display
CN1176487C (zh) 具有绝缘侧壁的多个金属凸块结构及其制作方法
CN100361297C (zh) 薄膜晶体管基板及制造方法
CN101114658A (zh) 薄膜晶体管基板及制造方法
JP2008096641A (ja) 表示装置及びその製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees