JP5311531B2 - 半導体チップの実装された表示パネル - Google Patents

半導体チップの実装された表示パネル Download PDF

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Publication number
JP5311531B2
JP5311531B2 JP2006227756A JP2006227756A JP5311531B2 JP 5311531 B2 JP5311531 B2 JP 5311531B2 JP 2006227756 A JP2006227756 A JP 2006227756A JP 2006227756 A JP2006227756 A JP 2006227756A JP 5311531 B2 JP5311531 B2 JP 5311531B2
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Prior art keywords
insulating film
display panel
electrode pad
bumps
organic insulating
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Expired - Fee Related
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JP2006227756A
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English (en)
Japanese (ja)
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JP2007059916A5 (enExample
JP2007059916A (ja
Inventor
鎬 民 姜
源 九 趙
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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US7750469B2 (en) 2010-07-06
CN1921095A (zh) 2007-02-28
TW200715514A (en) 2007-04-16
JP2007059916A (ja) 2007-03-08
KR101134168B1 (ko) 2012-04-09
TWI419292B (zh) 2013-12-11

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