JP2006073805A5 - - Google Patents

Download PDF

Info

Publication number
JP2006073805A5
JP2006073805A5 JP2004255531A JP2004255531A JP2006073805A5 JP 2006073805 A5 JP2006073805 A5 JP 2006073805A5 JP 2004255531 A JP2004255531 A JP 2004255531A JP 2004255531 A JP2004255531 A JP 2004255531A JP 2006073805 A5 JP2006073805 A5 JP 2006073805A5
Authority
JP
Japan
Prior art keywords
film
semiconductor device
connection pad
main component
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004255531A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006073805A (ja
JP4322189B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004255531A priority Critical patent/JP4322189B2/ja
Priority claimed from JP2004255531A external-priority patent/JP4322189B2/ja
Priority to US11/172,207 priority patent/US20060043605A1/en
Publication of JP2006073805A publication Critical patent/JP2006073805A/ja
Publication of JP2006073805A5 publication Critical patent/JP2006073805A5/ja
Priority to US12/401,491 priority patent/US20090174061A1/en
Application granted granted Critical
Publication of JP4322189B2 publication Critical patent/JP4322189B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004255531A 2004-09-02 2004-09-02 半導体装置 Expired - Fee Related JP4322189B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004255531A JP4322189B2 (ja) 2004-09-02 2004-09-02 半導体装置
US11/172,207 US20060043605A1 (en) 2004-09-02 2005-06-29 Semiconductor device
US12/401,491 US20090174061A1 (en) 2004-09-02 2009-03-10 Semiconductor Device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004255531A JP4322189B2 (ja) 2004-09-02 2004-09-02 半導体装置

Publications (3)

Publication Number Publication Date
JP2006073805A JP2006073805A (ja) 2006-03-16
JP2006073805A5 true JP2006073805A5 (enExample) 2006-11-24
JP4322189B2 JP4322189B2 (ja) 2009-08-26

Family

ID=35941942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004255531A Expired - Fee Related JP4322189B2 (ja) 2004-09-02 2004-09-02 半導体装置

Country Status (2)

Country Link
US (2) US20060043605A1 (enExample)
JP (1) JP4322189B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4322189B2 (ja) * 2004-09-02 2009-08-26 株式会社ルネサステクノロジ 半導体装置
JP5162851B2 (ja) * 2006-07-14 2013-03-13 富士通セミコンダクター株式会社 半導体装置及びその製造方法
DE102007023590A1 (de) * 2007-05-21 2008-11-27 Epcos Ag Bauelement mit mechanisch belastbarer Anschlussfläche
US7919409B2 (en) * 2008-08-15 2011-04-05 Air Products And Chemicals, Inc. Materials for adhesion enhancement of copper film on diffusion barriers
DE112009004375B4 (de) * 2009-02-16 2014-03-27 Toyota Jidosha Kabushiki Kaisha Halbleitervorrichtung
EP2478555A1 (en) * 2009-09-17 2012-07-25 Koninklijke Philips Electronics N.V. Geometry of contact sites at brittle inorganic layers in electronic devices
DE102012109161B4 (de) * 2012-09-27 2021-10-28 Pictiva Displays International Limited Organisches, optoelektronisches Bauelement, Verfahren zum Herstellen eines organischen, optoelektronischen Bauelementes und Verfahren zum stoffschlüssigen, elektrischen Kontaktieren
US9245770B2 (en) * 2012-12-20 2016-01-26 Stats Chippac, Ltd. Semiconductor device and method of simultaneous molding and thermalcompression bonding
JP7629756B2 (ja) * 2021-03-03 2025-02-14 Tdk株式会社 積層電極、電極付き歪抵抗膜および圧力センサ
CN118043635A (zh) * 2021-10-07 2024-05-14 Tdk株式会社 层叠电极、带电极的应变电阻膜及压力传感器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6742248B2 (en) * 2001-05-14 2004-06-01 The Boeing Company Method of forming a soldered electrical connection
DE10308275A1 (de) * 2003-02-26 2004-09-16 Advanced Micro Devices, Inc., Sunnyvale Strahlungsresistentes Halbleiterbauteil
US20050104208A1 (en) * 2003-11-14 2005-05-19 International Business Machines Corporation Stabilizing copper overlayer for enhanced c4 interconnect reliability
US6951803B2 (en) * 2004-02-26 2005-10-04 Taiwan Semiconductor Manufacturing Co., Ltd. Method to prevent passivation layer peeling in a solder bump formation process
US7064446B2 (en) * 2004-03-29 2006-06-20 Intel Corporation Under bump metallization layer to enable use of high tin content solder bumps
JP4322189B2 (ja) * 2004-09-02 2009-08-26 株式会社ルネサステクノロジ 半導体装置

Similar Documents

Publication Publication Date Title
TWI334747B (en) Circuit board structure having embedded electronic components
JP3178881U (ja) 集積回路素子パッケージ構造
JP2009246218A5 (enExample)
EP1840941A3 (en) Semiconductor device and manufacturing method thereof
WO2008149322A3 (en) Mount for a semiconductor light emitting device
JP2008283195A5 (enExample)
WO2009016906A1 (ja) 弾性波装置及びその製造方法
JP2006120943A5 (enExample)
JP2011096903A5 (ja) 半導体素子実装配線基板及びその製造方法
JP2007013092A5 (enExample)
JP2006189853A5 (enExample)
JP2008532292A5 (enExample)
JP2004501504A5 (enExample)
EP1675175A3 (en) Wired circuit board
JP2006073805A5 (enExample)
WO2008156100A1 (ja) 回路基板及び半導体装置
JP2009152423A5 (enExample)
JPH11243208A5 (enExample)
JP2002110981A5 (enExample)
JP2009129982A5 (enExample)
JP2006501652A5 (enExample)
JP2005311215A5 (enExample)
JP2006173460A5 (enExample)
JP2007294488A5 (enExample)
JP2006332694A5 (enExample)