JP2006173460A5 - - Google Patents

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Publication number
JP2006173460A5
JP2006173460A5 JP2004366029A JP2004366029A JP2006173460A5 JP 2006173460 A5 JP2006173460 A5 JP 2006173460A5 JP 2004366029 A JP2004366029 A JP 2004366029A JP 2004366029 A JP2004366029 A JP 2004366029A JP 2006173460 A5 JP2006173460 A5 JP 2006173460A5
Authority
JP
Japan
Prior art keywords
insulating film
pad
main surface
solder bump
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004366029A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006173460A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004366029A priority Critical patent/JP2006173460A/ja
Priority claimed from JP2004366029A external-priority patent/JP2006173460A/ja
Priority to US11/300,308 priority patent/US20060131365A1/en
Publication of JP2006173460A publication Critical patent/JP2006173460A/ja
Publication of JP2006173460A5 publication Critical patent/JP2006173460A5/ja
Priority to US12/547,980 priority patent/US20090315179A1/en
Pending legal-status Critical Current

Links

JP2004366029A 2004-12-17 2004-12-17 半導体装置の製造方法 Pending JP2006173460A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004366029A JP2006173460A (ja) 2004-12-17 2004-12-17 半導体装置の製造方法
US11/300,308 US20060131365A1 (en) 2004-12-17 2005-12-15 Method of manufacturing a semiconductor device
US12/547,980 US20090315179A1 (en) 2004-12-17 2009-08-26 Semiconductor device having solder bumps protruding beyond insulating films

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004366029A JP2006173460A (ja) 2004-12-17 2004-12-17 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2006173460A JP2006173460A (ja) 2006-06-29
JP2006173460A5 true JP2006173460A5 (enExample) 2009-08-13

Family

ID=36594430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004366029A Pending JP2006173460A (ja) 2004-12-17 2004-12-17 半導体装置の製造方法

Country Status (2)

Country Link
US (2) US20060131365A1 (enExample)
JP (1) JP2006173460A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI278374B (en) * 2005-12-23 2007-04-11 Delta Electronics Inc Object and bonding method thereof
US8058163B2 (en) * 2008-08-07 2011-11-15 Flipchip International, Llc Enhanced reliability for semiconductor devices using dielectric encasement
JP5109900B2 (ja) * 2008-09-24 2012-12-26 大日本印刷株式会社 導電性バンプ付き基板シート製造方法
KR101022942B1 (ko) * 2008-11-12 2011-03-16 삼성전기주식회사 흐름 방지용 댐을 구비한 인쇄회로기판 및 그 제조방법
JP5587804B2 (ja) * 2011-01-21 2014-09-10 日本特殊陶業株式会社 電子部品実装用配線基板の製造方法、電子部品実装用配線基板、及び電子部品付き配線基板の製造方法
US9966350B2 (en) * 2011-06-06 2018-05-08 Maxim Integrated Products, Inc. Wafer-level package device
US9761549B2 (en) * 2012-11-08 2017-09-12 Tongfu Microelectronics Co., Ltd. Semiconductor device and fabrication method
JP2014192476A (ja) * 2013-03-28 2014-10-06 Fujitsu Ltd プリント基板の半田実装方法及び半田実装構造

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US5381848A (en) * 1993-09-15 1995-01-17 Lsi Logic Corporation Casting of raised bump contacts on a substrate
US5478700A (en) * 1993-12-21 1995-12-26 International Business Machines Corporation Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
US5673846A (en) * 1995-08-24 1997-10-07 International Business Machines Corporation Solder anchor decal and method
FR2762715B1 (fr) * 1997-04-28 2000-07-21 Novatec Procede de realisation et de brasage de billes de connexion electrique sur des plages d'accueil de raccordement electrique de circuits ou de composants electroniques et dispositif de mise en oeuvre
JPH1160645A (ja) * 1997-08-27 1999-03-02 Tdk Corp 耐熱性低誘電性高分子材料ならびにそれを用いたフィルム、基板、電子部品および耐熱性樹脂成形品
US5977632A (en) * 1998-02-02 1999-11-02 Motorola, Inc. Flip chip bump structure and method of making
KR100552988B1 (ko) * 1998-03-27 2006-02-15 세이코 엡슨 가부시키가이샤 반도체 장치 및 그 제조 방법, 회로 기판 및 전자기기
US6461953B1 (en) * 1998-08-10 2002-10-08 Fujitsu Limited Solder bump forming method, electronic component mounting method, and electronic component mounting structure
US6114098A (en) * 1998-09-17 2000-09-05 International Business Machines Corporation Method of filling an aperture in a substrate
JP3403677B2 (ja) * 1999-09-06 2003-05-06 マイクロ・テック株式会社 半田ボール形成方法
TW498435B (en) * 2000-08-15 2002-08-11 Hitachi Ltd Method of producing semiconductor integrated circuit device and method of producing multi-chip module
DE10056869B4 (de) * 2000-11-16 2005-10-13 Advanced Micro Devices, Inc., Sunnyvale Halbleiterbauteil mit einer strahlungsabsorbierenden leitenden Schutzschicht und Verfahren zur Herstellung derselben
US6818545B2 (en) * 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
JP3461172B2 (ja) * 2001-07-05 2003-10-27 日東電工株式会社 多層配線回路基板の製造方法
JP2003046230A (ja) * 2001-08-02 2003-02-14 Seiko Instruments Inc 構造体及びこの構造体を用いた実装方法
US6605524B1 (en) * 2001-09-10 2003-08-12 Taiwan Semiconductor Manufacturing Company Bumping process to increase bump height and to create a more robust bump structure
US6703069B1 (en) * 2002-09-30 2004-03-09 Intel Corporation Under bump metallurgy for lead-tin bump over copper pad
US7128946B2 (en) * 2002-12-27 2006-10-31 Hynix Semiconductor Inc. Plate for forming metal wires and method of forming metal wires using the same
JP2004342904A (ja) * 2003-05-16 2004-12-02 Murata Mfg Co Ltd 電子回路装置および電子回路装置の製造方法
CN1291069C (zh) * 2003-05-31 2006-12-20 香港科技大学 微细间距倒装焊凸点电镀制备方法
TWI223882B (en) * 2003-06-30 2004-11-11 Advanced Semiconductor Eng Bumping process
KR100510543B1 (ko) * 2003-08-21 2005-08-26 삼성전자주식회사 표면 결함이 제거된 범프 형성 방법
TW592013B (en) * 2003-09-09 2004-06-11 Advanced Semiconductor Eng Solder bump structure and the method for forming the same
US7485564B2 (en) * 2007-02-12 2009-02-03 International Business Machines Corporation Undercut-free BLM process for Pb-free and Pb-reduced C4
US7622737B2 (en) * 2007-07-11 2009-11-24 International Business Machines Corporation Test structures for electrically detecting back end of the line failures and methods of making and using the same

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