JP2008091719A5 - - Google Patents

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Publication number
JP2008091719A5
JP2008091719A5 JP2006272183A JP2006272183A JP2008091719A5 JP 2008091719 A5 JP2008091719 A5 JP 2008091719A5 JP 2006272183 A JP2006272183 A JP 2006272183A JP 2006272183 A JP2006272183 A JP 2006272183A JP 2008091719 A5 JP2008091719 A5 JP 2008091719A5
Authority
JP
Japan
Prior art keywords
resin member
semiconductor device
external connection
electrode pads
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006272183A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008091719A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006272183A priority Critical patent/JP2008091719A/ja
Priority claimed from JP2006272183A external-priority patent/JP2008091719A/ja
Priority to KR1020070095687A priority patent/KR20080031107A/ko
Priority to US11/860,855 priority patent/US7768140B2/en
Priority to TW096136848A priority patent/TW200822312A/zh
Publication of JP2008091719A publication Critical patent/JP2008091719A/ja
Publication of JP2008091719A5 publication Critical patent/JP2008091719A5/ja
Pending legal-status Critical Current

Links

JP2006272183A 2006-10-03 2006-10-03 半導体装置 Pending JP2008091719A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006272183A JP2008091719A (ja) 2006-10-03 2006-10-03 半導体装置
KR1020070095687A KR20080031107A (ko) 2006-10-03 2007-09-20 반도체 장치
US11/860,855 US7768140B2 (en) 2006-10-03 2007-09-25 Semiconductor device
TW096136848A TW200822312A (en) 2006-10-03 2007-10-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006272183A JP2008091719A (ja) 2006-10-03 2006-10-03 半導体装置

Publications (2)

Publication Number Publication Date
JP2008091719A JP2008091719A (ja) 2008-04-17
JP2008091719A5 true JP2008091719A5 (enExample) 2009-10-22

Family

ID=39375548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006272183A Pending JP2008091719A (ja) 2006-10-03 2006-10-03 半導体装置

Country Status (4)

Country Link
US (1) US7768140B2 (enExample)
JP (1) JP2008091719A (enExample)
KR (1) KR20080031107A (enExample)
TW (1) TW200822312A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2234466B1 (en) * 2007-12-26 2019-04-10 Fujikura Ltd. Mounting board and method of producing the same
JP2009302427A (ja) * 2008-06-17 2009-12-24 Shinko Electric Ind Co Ltd 半導体装置および半導体装置の製造方法
US8519522B2 (en) * 2010-10-15 2013-08-27 SK Hynix Inc. Semiconductor package
KR20120039464A (ko) * 2010-10-15 2012-04-25 에스케이하이닉스 주식회사 반도체 패키지
KR102403960B1 (ko) 2014-12-25 2022-05-30 오쿠치 마테리얼스 가부시키가이샤 반도체 장치용 기판, 반도체 장치용 배선부재 및 그 제조 방법 및 반도체 장치용 기판을 이용한 반도체 장치의 제조 방법
DE102017126028B4 (de) 2017-06-30 2020-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Gehäuse und Herstellungsverfahren mit einem Trennfilm als Isolierfilm
US10170341B1 (en) * 2017-06-30 2019-01-01 Taiwan Semiconductor Manufacturing Company, Ltd. Release film as isolation film in package
US11710672B2 (en) * 2019-07-08 2023-07-25 Intel Corporation Microelectronic package with underfilled sealant

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6169328B1 (en) * 1994-09-20 2001-01-02 Tessera, Inc Semiconductor chip assembly
JPH11265967A (ja) 1998-03-17 1999-09-28 Nec Corp Ｌｓｉ実装基板の構造及びその製造方法
GB9917099D0 (en) * 1999-07-22 1999-09-22 Koninkl Philips Electronics Nv Cellular trench-gate field-effect transistors
JP2003007921A (ja) * 2001-06-19 2003-01-10 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP2003100809A (ja) * 2001-09-27 2003-04-04 Harima Chem Inc フリップチップ実装方法
TW557521B (en) * 2002-01-16 2003-10-11 Via Tech Inc Integrated circuit package and its manufacturing process
JP3591524B2 (ja) * 2002-05-27 2004-11-24 日本電気株式会社 半導体装置搭載基板とその製造方法およびその基板検査法、並びに半導体パッケージ
US7294879B2 (en) * 2003-07-18 2007-11-13 International Business Machines Corporation Vertical MOSFET with dual work function materials

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