JP2009188328A5 - - Google Patents
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- Publication number
- JP2009188328A5 JP2009188328A5 JP2008029141A JP2008029141A JP2009188328A5 JP 2009188328 A5 JP2009188328 A5 JP 2009188328A5 JP 2008029141 A JP2008029141 A JP 2008029141A JP 2008029141 A JP2008029141 A JP 2008029141A JP 2009188328 A5 JP2009188328 A5 JP 2009188328A5
- Authority
- JP
- Japan
- Prior art keywords
- pads
- semiconductor chip
- plan
- view
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 26
- 230000008707 rearrangement Effects 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008029141A JP5166903B2 (ja) | 2008-02-08 | 2008-02-08 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008029141A JP5166903B2 (ja) | 2008-02-08 | 2008-02-08 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009188328A JP2009188328A (ja) | 2009-08-20 |
| JP2009188328A5 true JP2009188328A5 (enExample) | 2011-03-24 |
| JP5166903B2 JP5166903B2 (ja) | 2013-03-21 |
Family
ID=41071248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008029141A Expired - Fee Related JP5166903B2 (ja) | 2008-02-08 | 2008-02-08 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5166903B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG185491A1 (en) * | 2010-05-20 | 2012-12-28 | Ev Group E Thallner Gmbh | Method for producing chip stacks as well as a carrier for executing the method |
| US9121900B2 (en) * | 2011-12-02 | 2015-09-01 | Sandisk Technologies Inc. | Systems and methods for sensing signals communicated with a host device or on an interface of plug-in card when there is lack of access to sensing points |
| JP6122290B2 (ja) | 2011-12-22 | 2017-04-26 | 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | 再配線層を有する半導体パッケージ |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217354A (ja) * | 2001-01-15 | 2002-08-02 | Shinko Electric Ind Co Ltd | 半導体装置 |
| JP4703300B2 (ja) * | 2005-07-20 | 2011-06-15 | 富士通セミコンダクター株式会社 | 中継基板及び当該中継基板を備えた半導体装置 |
| JP2007096071A (ja) * | 2005-09-29 | 2007-04-12 | Toshiba Corp | 半導体メモリカード |
| JP4726640B2 (ja) * | 2006-01-20 | 2011-07-20 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP4900661B2 (ja) * | 2006-02-22 | 2012-03-21 | ルネサスエレクトロニクス株式会社 | 不揮発性記憶装置 |
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2008
- 2008-02-08 JP JP2008029141A patent/JP5166903B2/ja not_active Expired - Fee Related