JP2009147106A5 - - Google Patents

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Publication number
JP2009147106A5
JP2009147106A5 JP2007322824A JP2007322824A JP2009147106A5 JP 2009147106 A5 JP2009147106 A5 JP 2009147106A5 JP 2007322824 A JP2007322824 A JP 2007322824A JP 2007322824 A JP2007322824 A JP 2007322824A JP 2009147106 A5 JP2009147106 A5 JP 2009147106A5
Authority
JP
Japan
Prior art keywords
semiconductor device
bump
substrate
semiconductor chip
electrode pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007322824A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009147106A (ja
JP5020051B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007322824A priority Critical patent/JP5020051B2/ja
Priority claimed from JP2007322824A external-priority patent/JP5020051B2/ja
Publication of JP2009147106A publication Critical patent/JP2009147106A/ja
Publication of JP2009147106A5 publication Critical patent/JP2009147106A5/ja
Application granted granted Critical
Publication of JP5020051B2 publication Critical patent/JP5020051B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007322824A 2007-12-14 2007-12-14 半導体装置 Expired - Fee Related JP5020051B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007322824A JP5020051B2 (ja) 2007-12-14 2007-12-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007322824A JP5020051B2 (ja) 2007-12-14 2007-12-14 半導体装置

Publications (3)

Publication Number Publication Date
JP2009147106A JP2009147106A (ja) 2009-07-02
JP2009147106A5 true JP2009147106A5 (enExample) 2010-12-16
JP5020051B2 JP5020051B2 (ja) 2012-09-05

Family

ID=40917380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007322824A Expired - Fee Related JP5020051B2 (ja) 2007-12-14 2007-12-14 半導体装置

Country Status (1)

Country Link
JP (1) JP5020051B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120298406A1 (en) * 2011-05-23 2012-11-29 International Business Machines Corporation Reduced stress gull wing solder joints for printed wiring board connections
WO2015082951A1 (en) * 2013-12-06 2015-06-11 Commissariat à l'énergie atomique et aux énergies alternatives Method of hermetically sealing a hole with a fuse material
US10497846B2 (en) * 2017-07-11 2019-12-03 Lg Innotek Co., Ltd. Light emitting device package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258127A (ja) * 1991-02-13 1992-09-14 Fujitsu Ltd バンプ接合パッド構造
KR100216839B1 (ko) * 1996-04-01 1999-09-01 김규현 Bga 반도체 패키지의 솔더 볼 랜드 메탈 구조
JP2001223293A (ja) * 2000-02-09 2001-08-17 Nec Corp 半導体装置及びその製造方法
JP2002270718A (ja) * 2001-03-07 2002-09-20 Seiko Epson Corp 配線基板及びその製造方法、半導体装置及びその製造方法、回路基板並びに電子機器

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